JPH0561990U - Multiple IC socket - Google Patents

Abstract

(57) [Abstract] [Purpose] Since the conventional IC socket is designed to be a single product, it is difficult to achieve high-density mounting because it requires a large area on the printed circuit board. The present invention eliminates the drawbacks of the prior art and aims to provide a socket that enables high-density mounting. [Configuration] At least a first and a second having different shapes from each other
Multiple IC sockets in which a first socket portion and a second socket portion having different shapes corresponding to the above IC are integrally formed, and the first and second ICs are held so as to be vertically stacked.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a multiple-type IC socket used for a television receiver, a VTR, a radio, a tape recorder, etc.

[0002]

[Prior Art]

 Conventionally, as a method of mounting an IC related to a microcomputer, a single-shaped IC socket is used to insert the IC into a printed board and solder it. Since the IC socket at this time is for inserting the IC alone, if the number of ICs increases, the area on the printed circuit board becomes large and it becomes difficult to realize high-density mounting.

[0003]

[Problems to be solved by the device]

 As described above, since the conventional IC socket corresponds to a single item, there is a problem that it is difficult to take a large area on the printed circuit board, to realize high density mounting, and further to make the product compact. The present invention eliminates the above-mentioned conventional drawbacks and aims to provide a socket that enables high-density mounting.

[0004]

[Means for Solving the Problems]

 According to the present invention, the IC socket is made into a multi-row type, in which one of the ICs having the same shape is formed by inserting the IC lead inside and the other is inserted in the current shape.

Further, regarding the ICs of different shapes, the ICs are inserted while holding the ICs in the same shape so that the ICs are vertically overlapped.

[0006]

[Action]

 According to the present invention, the multiple IC socket allows the ICs to be stacked in two stages, the area on the printed circuit board can be reduced, high-density mounting can be performed, and a large number of circuit configurations can be incorporated.

[0007]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. In the embodiment of FIG. 1, 1 is an IC socket body, 2 is an inner IC socket pin, and 3 is an outer IC socket pin, which are respectively molded in the IC socket body 1. The IC socket body 1 includes a first support portion 1a for holding the first IC and a first support portion 1a integrally provided outside the first support portion 1a for holding a second IC larger than the first IC. It is composed of two supporting portions 1b. Then, the first support portion 1a and the second support portion 1b are staggered.

FIG. 2 shows a state in which the first IC 4 and the second IC 5 are connected to the IC socket body 1. The first IC, 4 is mounted on the first supporting portion 1a, and the second IC, 5 having a larger shape than the first IC, 4 is mounted on the second supporting portion 1b. It That is, the first IC 4 and the second IC 5 are held so as to be vertically stacked.

FIG. 3 shows a second embodiment of the present invention. In FIG. 3, 11 is an IC socket body, 12 is an inner IC socket pin, and 13 is an outer IC socket pin, which are respectively molded in the IC socket body 11. The IC socket body 11 holds a first support portion 11a that holds the first IC, and a second IC that has the same shape as the first IC that is integrally provided outside the first support portion 11a. The second supporting portion 11b is provided. Then, the first support portion 11a and the second support portion 11b are staggered.

In FIG. 4, the pins of the first IC and 6 are inserted into the IC socket body 11 by inward forming, and the pins of the second IC 7 are inserted vertically and connected to the respective socket pins 12 and 13. Shows the state of being done. According to the first and second embodiments, the holding and connecting of two ICs can be performed by simply making the shape of the IC socket bodies 1 and 11 slightly larger than the shape corresponding to one IC. High-density mounting on the board becomes possible.

[0011]

[Effect of the device]

 As described above, according to the present invention, multiple IC sockets can be used to stack two stages of ICs, the area on the printed circuit board can be reduced, and high-density mounting can be achieved. Many circuits can be incorporated into.

[Brief description of drawings]

FIG. 1 is a perspective view of a multiple IC socket according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a state where the first and second ICs are connected to the IC socket shown in FIG.

FIG. 3 is a perspective view of a multiple IC socket according to a second embodiment of the present invention.

FIG. 4 is a plan view showing a state in which the first and second ICs are connected to the IC socket shown in FIG.

[Explanation of symbols]

 1, 11 IC socket body 2, 12 Inner IC socket pin 3, 13 Outer IC socket pin 1a, 11a Supporting part 1b, 11b Supporting second IC 4, 6th 1st IC 5,7 2nd IC

Claims (2)

[Scope of utility model registration request] 1. A first socket portion and a second socket portion having different shapes are integrally formed corresponding to at least first and second ICs having different shapes. Multiple type IC socket that holds ICs so that they are vertically stacked. 2. A multiple-type IC socket for holding first and second ICs having the same shape, wherein the first IC is held so that its foot faces inward, and the second IC is Multiple-type IC socket that holds the foot vertically inserted.