JPH0569949U - IC carrier - Google Patents

Abstract

(57) [Summary] [Purpose] The purpose of the present invention is for surface mounting after lead molding.
It is to provide a carrier that holds a C package and is used in a selection process, in which an IC is inserted from a solder mounting surface side. [Structure] Lead housing a matching the shape of the lead pin
9, positioning mold part a6, latch 5 to IC16
Is held, and the contact pin a is retained by the lead retainer a12.
The lead pin 17 is supported at the time of contact with 22. Also,
Positioning groove 15 and positioning portion a2 of contactor a22
5 matches and performs positioning. [Effect] It is possible to improve the solderability without damaging the contact on the solder mounting surface, and it is possible to commonly use the test hold for forward / reverse bending IC by changing the insertion direction of the IC.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to an IC test jig, and more particularly to a sorting jig which holds a surface mounted IC package such as TSOP or SOP after lead molding and performs a sorting step.

[0002]

[Prior Art]

 As shown in FIG. 4, the conventional IC carrier has a structure in which the IC package is inserted from the side opposite to the solder mounting surface of the IC lead pin, and the lead storage portion has a hierarchical structure according to the lead shape. Also, the contact with the contact pin of the burn-in socket or the contactor for the handler was made on the solder mounting surface of the lead pin.

[0003]

[Problems to be solved by the device]

 This conventional IC carrier has a problem that the solder mounting surface of the lead pin is scratched by the contact pin when the socket is mounted, and the solderability to the printed board is affected. In addition, since the IC package is inserted into the carrier in one direction, it is necessary to manufacture two sorts of sorting jigs such as test boards for each type of product by forward bending / reverse bending, which is costly. there were.

[0004]

[Means for Solving the Problems]

 The IC carrier of the present invention enables the IC package after lead molding to be mounted and is joined to the latch for hooking the package, the mold portion for positioning the package, and the positioning portion of the burn-in socket or the contactor for the handler. Positioning groove that enables positioning with contact pins of contact sockets for handlers and handlers, and a lead retainer that prevents lead bending of the IC package when the contact pins of the burn-in sockets or contactors for handlers are contacted, and the IC package It has a lead storage part that can be inserted from the solder mounting surface side of the lead pin.

[0005]

【Example】

 Next, the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of the IC package of the first embodiment of the present invention mounted on a handler contactor when viewed from the side. The lead accommodating portion a9 has a structure conforming to the shape of the solder mounting surface 18 side of the lead pin 17 of the IC package 16, and the IC package 16 is inserted from the solder mounting surface 18 side of the lead pin 17. The lead pin 17 of the IC package 16 has a structure in which the positioning groove 15 of the IC carrier a1 and the positioning portion a25 of the contactor a19 are aligned with each other so that the contact pin a22 is not displaced. The contact pin a22 contacts on the opposite side of the solder mounting surface 18 of the lead pin 17 of the IC package 16, and the surface of the lead pin 17 is adjusted to the shape of the lead so that the lead is not bent due to the pressure at the time of contact. It is supported by the lead pressing portion a12 so that no additional force is applied.

FIG. 2 is a plan view showing a state in which the IC package of the first embodiment of the present invention shown in FIG. 1 is mounted, as seen from the inserting direction of the IC package. The IC package 16 is positioned by the positioning mold part a6 of the carrier a1, is fixed by the latch 5 so as not to come off during transportation, and the IC package 16 such as the lead pin 17 is entirely wrapped so as not to protrude from the outer shape of the IC carrier a1. It is structured like this. The latch 5 has elasticity so that it can be spread outward when the IC package 16 is mounted or removed. Further, a positioning groove 15 is formed which is joined to the positioning portion a25 of the burn-in socket or the handler contactor a19 to enable positioning. This IC carrier a1 has the same structure even if the size of the IC package 16 is slightly changed, and an IC carrier of the same size can be used as long as the size of the IC package is not so different.

FIG. 3 is a cross-sectional view of the IC carrier of the second embodiment of the present invention in which an IC package is mounted and viewed from the side. In this embodiment, the contact between the lead pin 17 of the IC package 16 and the contact pin b23 of the contactor b20 for the handler is made at the bent portion of the lead pin 17 or the lead shoulder portion 28. The pressure when the contact pin b23 comes into contact with the lead pin 17 of the IC package 16 is set so as not to cause the lead to bend, and the lead retainer 29 is provided in a part of the lead accommodating portion b10 of the IC carrier b2. The structure is such that the tip of 17 does not contact the carrier b2, and no pressure is applied to the tip of the solder mounting surface 18 of the lead pin 17, which has the effect of not affecting the coplanarity.

[0008]

[Effect of the device]

 As described above, according to the present invention, the lead storage part and the lead retainer part matched to the shape of the lead mounting side of the solder are provided so that the IC package can be mounted from the direction in which the lead pins are open (solder mounting side). The IC carrier has a latch for preventing disengagement of the IC package, a positioning mold part, and a positioning groove that enables positioning with the burn-in socket and the contactor for the handler. It has the effect of not being scratched and having good solderability. In addition, as long as the damage caused by the contact pins on the solder mounting surface does not affect the solderability when soldering the printed board, the forward-bending (or reverse-bending) IC package can be inserted with the IC carrier shown in the conventional example. Mounted in the same direction and contact the contact pin on the solder mounting surface side, and the reverse-bending (or forward-bending) IC package is mounted in the IC carrier insertion direction shown in the present invention and contacts the contact pin on the reverse side of the solder mounting surface. With the structure, the test board and the burn-in board can be shared by forward bending and reverse bending IC packages, which has the effect of reducing costs. Further, even if the size of the IC package is slightly changed, if the carrier can have the same outer dimensions, it is possible to reduce the cost without having to change the transfer system in the automated equipment such as the handler.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a state in which an IC package of an IC carrier according to a first embodiment of the present invention is mounted and mounted on a handler for a handler when viewed from a side surface.

FIG. 2 is a plan view showing a state in which the IC package is mounted when viewed from the insertion direction of the IC package of the IC carrier of the first embodiment.

FIG. 3 is a cross-sectional view of the IC carrier according to the second embodiment of the present invention when the IC package is inserted and mounted on a handler for a handler when viewed from the side.

FIG. 4 is a cross-sectional view of an IC package inserted into a conventional IC carrier and mounted on a contactor for a handler, as viewed from the side.

[Explanation of symbols]

 1 IC carrier a 2 IC carrier b 3 IC carrier c 4 IC (integrated circuit) 5 Latch 6 Positioning mold part a 7 Positioning mold part b 8 Positioning mold part c 9 Lead storing part a 10 Lead storing part b 11 Lead storing part c 12 lead retainer a 13 lead retainer b 14 lead retainer c 15 positioning groove 16 IC package 17 lead pin 18 solder mounting surface 19 contactor a 20 contactor b 21 contactor c 22 contact pin a 23 contact pin b 24 contact pin c 25 Positioning part a 26 Positioning part b 27 Positioning part c 28 Lead shoulder part 29 Lead avoiding part

Claims (1)

[Scope of utility model registration request] 1. A latch for hooking a package after mounting a lead of an integrated circuit for surface mounting such as TSOP, SOP, and the like, a positioning mold portion for positioning the package, a burn-in socket and a contactor for a handler. Of the surface mounting integrated circuit package at the time of contact between the positioning groove joined to the positioning part of the burn-in socket or the contact pin of the handler contactor contact pin and the contact pin of the burn-in socket or handler contactor contact pin. An IC characterized in that it has a lead retainer for preventing lead bending and a lead accommodating portion for insertion from the solder mounting surface side of the lead pin of the surface mounting integrated circuit package.
Career.