JPS6344454U - - Google Patents

Info

Publication number
JPS6344454U
JPS6344454U JP13878386U JP13878386U JPS6344454U JP S6344454 U JPS6344454 U JP S6344454U JP 13878386 U JP13878386 U JP 13878386U JP 13878386 U JP13878386 U JP 13878386U JP S6344454 U JPS6344454 U JP S6344454U
Authority
JP
Japan
Prior art keywords
integrally formed
parts
lead frame
external
external leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13878386U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13878386U priority Critical patent/JPS6344454U/ja
Publication of JPS6344454U publication Critical patent/JPS6344454U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図および第２図は本考案に係るリードフレ
ームの樹脂封止前の状態を示す平面図と側面図、
第３図は同じくリードフレームによつて組み立て
た半導体装置を示す斜視図、第４図および第５図
は他の実施例におけるリードフレームの樹脂封止
前の状態を示す平面図と側面図、第６図はそのリ
ードフレームによつて組み立てた半導体装置を示
す斜視図、第７図および第８図は従来のリードフ
レームの樹脂封止前の状態を示す平面図と側面図
、第９図はそのリードフレームによつて組み立て
た半導体装置を示す斜視図である。 １……リードフレーム、２〜５……外部リード
、６〜９……内部電極、３１〜３５……延在部、
３６……連結片。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一側方に突出する複数の外部リードおよびこれ
    ら外部リードに各々接続する内部電極を有する金
    属片からなり、前記内部電極に反外部リード側に
    突出する延在部を一体に形成し、これら延在部は
    連結片によつて接続されていることを特徴とする
    リードフレーム。
JP13878386U 1986-09-09 1986-09-09 Pending JPS6344454U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13878386U JPS6344454U (ja) 1986-09-09 1986-09-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13878386U JPS6344454U (ja) 1986-09-09 1986-09-09

Publications (1)

Publication Number Publication Date
JPS6344454U true JPS6344454U (ja) 1988-03-25

Family

ID=31044074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13878386U Pending JPS6344454U (ja) 1986-09-09 1986-09-09

Country Status (1)

Country Link
JP (1) JPS6344454U (ja)

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