JPS6343794A - Poroduction of solder powder - Google Patents
Poroduction of solder powderInfo
- Publication number
- JPS6343794A JPS6343794A JP18639086A JP18639086A JPS6343794A JP S6343794 A JPS6343794 A JP S6343794A JP 18639086 A JP18639086 A JP 18639086A JP 18639086 A JP18639086 A JP 18639086A JP S6343794 A JPS6343794 A JP S6343794A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder powder
- compressed gas
- humidity
- molten
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 45
- 239000000843 powder Substances 0.000 title claims abstract description 31
- 239000007789 gas Substances 0.000 claims abstract description 21
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000001301 oxygen Substances 0.000 claims abstract description 17
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000011261 inert gas Substances 0.000 claims description 4
- 238000011084 recovery Methods 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 17
- 239000002184 metal Substances 0.000 abstract description 17
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 abstract description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052786 argon Inorganic materials 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 abstract 1
- 229910002092 carbon dioxide Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000000227 grinding Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- QMHWARSFUCGBJK-UHFFFAOYSA-N 2-(1,3-benzothiazol-2-yl)guanidine Chemical compound C1=CC=C2SC(N=C(N)N)=NC2=C1 QMHWARSFUCGBJK-UHFFFAOYSA-N 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は半田粉末の製造方法に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to a method for manufacturing solder powder.
（従来の技術とその問題点）
半田溶湯を粉化することによって半田粉末を製造覆る方
法としては、半田溶湯流に圧縮ガスを吹きイ」せること
によって該溶湯流を飛散させ粉末化する噴霧法が広く知
られている。(Prior art and its problems) As a method for manufacturing solder powder by powdering molten solder, there is a spraying method in which the molten solder flow is dispersed and powdered by blowing compressed gas into the molten solder flow. is widely known.
これは溶解可能な金属、例えば、鉛、亜鉛。This is a soluble metal, such as lead or zinc.
アルミニウム、銅、ニッケル、鉄等の単体から銅−亜鉛
、ステンレス鋼あるいは三七ニッグ等の合金粉末にいた
るまでの広い範囲に製造することができ、かつ原材料の
制御によって一定の性状の粉末を大量に製造′Ｃ−きる
ことが特徴である。It is possible to produce a wide range of powders, from simple substances such as aluminum, copper, nickel, and iron to alloy powders such as copper-zinc, stainless steel, and 37-nig, and by controlling the raw materials, large quantities of powder with constant properties can be produced. It is characterized by the fact that it can be manufactured in the following manner.
このように製造される粉末の形状は球状が望ましいが、
これらの形状及び性状は噴霧時の諸条ｆ１、例えばガス
圧力、溶湯温度、ガス噴出環帯の角度、冷１１１′１方
法等により左右される。The shape of the powder produced in this way is preferably spherical, but
These shapes and properties are influenced by various factors f1 during spraying, such as gas pressure, molten metal temperature, angle of gas ejection ring, cooling method, etc.
シした、半田溶湯が圧縮ガスにより粉化され、凝固覆る
までの間に生成する酸化物が球状化の成否の鍵をにぎり
、これら酸化物が所定量をこえると球状化が阻まれるこ
とが知られ（いる。It is known that the oxides that are generated during the time when the molten solder is powdered by compressed gas and solidified are the key to the success or failure of spheroidization, and that if these oxides exceed a certain amount, spheroidization is inhibited. There are.
そのため、半田溶湯が粉化飛散して回収容器内を落下す
る過程において、酸化物の生成に多大の影響をもつ酸素
との結びつきを制限づるために丹縮ガス及び回収容器内
の酸素濃度を制限覆ることが行なわれていた。Therefore, in the process of molten solder powdering and scattering and falling inside the collection container, the condensation gas and the oxygen concentration in the collection container are restricted in order to limit the combination with oxygen, which has a great effect on the formation of oxides. Covering was being done.
また、最近では半田粉末の形成過程にお【プる酸化物の
生成には、酸素と共に湿度も大ぎく係わり、半田粉末の
形状及び性状の形成に多大の影響を与えていることが発
見された。In addition, it has recently been discovered that, along with oxygen, humidity is also closely related to the formation of oxides during the formation process of solder powder, and that it has a great influence on the formation of the shape and properties of solder powder. .
そのため、回収容器内の湿度が高い場合には、半田粉末
の表面に水分が付着してしまい、これらの半田粉末を使
用したソルダーペースト（ＲＭＡタイプのフラックス２
０ｗｔ％に対して半田粉末を８０Ｗ１％混合したもの）
をａ板に印刷して加熱溶解すると、半田表面の光沢が濁
りかつ半田がひとつにまとまらず半田ボールが残るとい
う欠点があった。Therefore, if the humidity inside the collection container is high, water will adhere to the surface of the solder powder, and solder paste (RMA type flux 2) using these solder powders will
0wt% mixed with 80W1% solder powder)
When printed on an A board and heated and melted, the problem was that the gloss on the solder surface became cloudy and the solder did not come together and solder balls remained.
（発明が解決しようとする技術的課題）以上の問題を解
決するための本発明の技術的課題は、噴霧法による半田
粉末の製造方法において、回収容器内の酸素及び湿度の
濃度を所定の値に設定することである。(Technical Problem to be Solved by the Invention) A technical problem to be solved by the present invention to solve the above-mentioned problems is to reduce the concentration of oxygen and humidity in a collection container to predetermined values in a method for manufacturing solder powder by a spraying method. It is to set it to .
（技術的課題を達成するだめの技術的手段）以上の技術
的課題を達成するだめの本発明の技術的手段は、細孔よ
り流出せる半田溶湯に圧縮ガスを噴射することにより詳
細溶湯を粉化して飛散させると共に、該粉化して飛散し
た半田を回収容器内を落下させて半田粉末を製造する半
［１１粉末の製造方法におい−Ｃ１該圧縮ガス及び回収
容器内を酸素濃度が８％以下、湿度が３０％以下の不活
竹なガス雰囲気にすることであり、該酸素濃度が８％を
越えると粉末表面の酸化皮膜が多くなりボール形状が球
形でなくなる。(Technical Means for Accomplishing the Technical Problem) The technical means of the present invention for achieving the above technical problem is to powder the detailed molten metal by injecting compressed gas into the molten solder that can flow out from the pores. At the same time, the powdered and scattered solder is allowed to fall in a recovery container to produce solder powder. The purpose is to create an inert gas atmosphere with a humidity of 30% or less. If the oxygen concentration exceeds 8%, the oxide film on the powder surface will increase and the ball shape will no longer be spherical.
また湿度が３０％を越えると半田粉末表面に水分の１４
着が著しくソルダーペーストにした時、半田ボールの発
生が問題となる。Also, if the humidity exceeds 30%, moisture will form on the surface of the solder powder.
When solder paste is used, the generation of solder balls becomes a problem.
本発明は以上の様に圧旨ガス及び回収容器内を酸素濃度
が８％以下、温度が３０％以下の不活竹なガス雰囲気と
することににり半田粉末の表面に酸化皮膜及び水分（濁
気）がイ」希するのを少なく押えることがて゛きるので
、球状でかつ一定の優れた竹状の半田粉末を製造するこ
とができる。As described above, the present invention creates an inert gas atmosphere with an oxygen concentration of 8% or less and a temperature of 30% or less in the pressurized gas and recovery container, thereby forming an oxide film and moisture ( Since the generation of turbidity can be suppressed to a minimum, it is possible to produce a spherical and uniform bamboo-like solder powder.
（実施例） 以下、本発明の−・実施例を図面に基づいて説明する。(Example) Embodiments of the present invention will be described below based on the drawings.
本発明の半田粉末（ｍ）は図示する製造装置（Ａ）で製
造されるものであり、回収容器（３）内を所定の雰囲気
（酸素濃度、湿度）に設定した状態で製造開始する。該
製造装置（Ａ）は半田溶湯（ｎ＞を貯湯するための溶湯
槽（１）と、該半田溜Ｍ（ｎ）を粉化して飛散さぜる噴
霧装置（２）と、該粉化して飛散された半田粉末（ｍ）
を回収するための回収容器（３）とから成る。The solder powder (m) of the present invention is manufactured by the illustrated manufacturing apparatus (A), and manufacture is started with the inside of the collection container (3) set to a predetermined atmosphere (oxygen concentration, humidity). The manufacturing device (A) includes a molten metal tank (1) for storing molten solder metal (n), a spray device (2) for pulverizing and scattering the solder pool M(n), and a spraying device (2) for pulverizing and scattering the molten solder metal (n). Scattered solder powder (m)
and a collection container (3) for collecting.
溶湯金属（ｍ）は噴霧法により半田粉末（ｍ）を製造し
得る金属一般をすべて含むものであり、特に酸素との親
和力の高い鉛、亜鉛、アルミニウム、銅、ニッケル、鉄
及びこれらの合金等が対象とされる。Molten metal (m) includes all metals in general that can be used to produce solder powder (m) by spraying, especially lead, zinc, aluminum, copper, nickel, iron, and alloys thereof, which have a high affinity with oxygen. are targeted.
該半田溶湯（ｍ）は貯湯槽（１）の溶湯ルツボ（１ａ）
内に貯湯され、該ルツボ底面に突設した溶湯ノズル（１
ｂ）を通って流出し、噴霧装置（２）にお（）るガスノ
ズル（２ａ）から噴射する圧縮ガス（Ｓ）により回収容
器（３）内に粉化し−Ｃ飛散されて半田粉末（ｍ）を形
成するものである。The molten solder (m) is placed in the molten metal crucible (1a) of the hot water storage tank (1).
The melt is stored inside the crucible, and a molten metal nozzle (1
The solder powder (m) flows out through b) and is pulverized into a collection container (3) by the compressed gas (S) injected from the gas nozzle (2a) in the spray device (2). It forms the
Ｊ、た半ｌ］溶１（ｎ）は溶湯ルツボ（１ａ）周囲に設
置−また保温装置（４）により融点にＣきるだけ近い噴
霧化の可能な温度に保温され、溶湯ルツボ（１ａ）の流
出口（１Ｃ）に上下動自在に設（）た開閉棒（５）によ
りその流出量が調整される。The melt 1 (n) is placed around the molten metal crucible (1a) and is kept at a temperature as close to the melting point as possible by the heat insulating device (4) to allow atomization, and the molten metal crucible (1a) is The outflow amount is adjusted by an opening/closing rod (5) provided at the outflow port (1C) so as to be movable up and down.
圧縮ガス（Ｓ）は酸素濃度が８％以下でかつ湿度が３０
％以下のアルゴン、窒素、ＧＯ２、ガス等が用いられ、
供給管（６）内に配設した電熱線（７〉により加熱され
る。Compressed gas (S) has an oxygen concentration of 8% or less and a humidity of 30%.
% or less of argon, nitrogen, GO2, gas, etc. are used,
It is heated by a heating wire (7) disposed inside the supply pipe (6).
これは、粉化された半田金属が冷却され凝固するまでの
時間を長くとり表面張力の働く機会を多くすることによ
り、その形状を球形にしようどづ゛るものである。This is because the powdered solder metal takes a long time to cool and solidify, giving more opportunities for surface tension to act, thereby making the shape spherical.
また、圧縮ガス（Ｓ）の圧力は、微細で一定の性状及び
形状の粉末を得ることのできる程度の適正なものとする
。Further, the pressure of the compressed gas (S) is set to be appropriate enough to obtain fine powder with constant properties and shape.
回収容器（３）は気密性に優れたものであり、その内部
は酸素濃度が８％以下でかつ湿度が３０％以下に保持さ
れている。The recovery container (3) has excellent airtightness, and the oxygen concentration inside thereof is maintained at 8% or less and the humidity is maintained at 30% or less.
而して、酸素濃度８％以下、湿度３０％以下の雰囲気で
粉化して飛散された半田溶湯（ｎ）は、これらが凝固し
終るまで酸素及び湿度と接触を最小限に絶たれ、酸化物
が生成されずかつ表面に水分（湿気）が付着しない状態
で表面張力により球状化される。Therefore, the molten solder (n), which is powdered and scattered in an atmosphere with an oxygen concentration of 8% or less and a humidity of 30% or less, is kept from contact with oxygen and humidity to a minimum until it solidifies, and the oxides are is formed into spheres due to surface tension without any water (moisture) adhering to the surface.
そして、回収容器底部の選別器（３ａ）により各種の大
きざの粉末にふるい分けられて回収される。The powder is then sieved into powders of various sizes by a sorter (3a) at the bottom of the collection container and collected.
数表は溶湯温度が２３０°の半［口溶湯を５ Ｋｆｌ
／ ｃＭの圧力の不活性な圧縮ガスで粉化して飛散さけ
て各種の要素を測定した結果を示したものである。The numerical table shows that the molten metal temperature is half of 230° [mouth molten metal is 5 Kfl
This figure shows the results of measuring various elements after powdering with an inert compressed gas at a pressure of /cM to avoid scattering.
（表）
以上の様な測定結果から半田粉末の製造方法におい−Ｃ
１圧縮ガス及び同収容器内を酸素１１１度が８％１ズ１
ぺ湿度が３０％以下の不活性なガス雰囲気どり−ること
により前記の本発明の効果を確認することができノ’−
Ｉ＋(Table) Based on the above measurement results, the solder powder manufacturing method -C
1 Compressed gas and oxygen 111 degrees in the same container 8% 1z 1
The effects of the present invention described above can be confirmed by creating an inert gas atmosphere with a humidity of 30% or less.
I+
図面は本発明の半田粉末を製造するための製造装置の断
面図である。The drawing is a sectional view of a manufacturing apparatus for manufacturing the solder powder of the present invention.
Claims (1)
より、該半田溶湯を粉化して飛散させると共に、該粉化
して飛散した平面を回収容器内を落下させて半田粉末を
製造する半田粉末の製造方法において、該圧縮ガス及び
回収容器内を酸素濃度が８％以下、湿度が３０％以下の
不活性なガス雰囲気にしたことを特徴とする半田粉末の
製造方法。By injecting compressed gas into the molten solder flowing out from the pores, the molten solder is pulverized and scattered, and the pulverized and scattered flat surface is allowed to fall inside a collection container to produce solder powder. A method for producing solder powder, characterized in that the compressed gas and the inside of the recovery container are made into an inert gas atmosphere with an oxygen concentration of 8% or less and a humidity of 30% or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61186390A JP2510524B2 (en) | 1986-08-07 | 1986-08-07 | Method for manufacturing solder powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61186390A JP2510524B2 (en) | 1986-08-07 | 1986-08-07 | Method for manufacturing solder powder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6343794A true JPS6343794A (en) | 1988-02-24 |
| JP2510524B2 JP2510524B2 (en) | 1996-06-26 |
Family
ID=16187555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61186390A Expired - Lifetime JP2510524B2 (en) | 1986-08-07 | 1986-08-07 | Method for manufacturing solder powder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2510524B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6511524B2 (en) | 2001-01-12 | 2003-01-28 | Yugen Kaisha Shoukiseisakusho | Method and device for producing ball-shaped metallic particles at least almost equal in diameter |
| JP2008183621A (en) * | 2008-02-04 | 2008-08-14 | Mitsui Mining & Smelting Co Ltd | Solder powder |
| JP2008261057A (en) * | 2008-07-07 | 2008-10-30 | Dowa Holdings Co Ltd | Method for producing spherical body |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5485157A (en) * | 1977-12-20 | 1979-07-06 | Matsushita Electric Ind Co Ltd | Method and apparatus for preparing solder powder |
| JPS58147501A (en) * | 1982-02-15 | 1983-09-02 | エスシ−エム・コ−ポレ−シヨン | Manufacture of dispersion enhancement type alloy particle |
| JPS58157595A (en) * | 1982-03-11 | 1983-09-19 | Senjiyu Kinzoku Kogyo Kk | Production of solder powder |
| JPS58217608A (en) * | 1982-06-14 | 1983-12-17 | Toyo Kinzokufun Kk | Manufacture of metal particle |
-
1986
- 1986-08-07 JP JP61186390A patent/JP2510524B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5485157A (en) * | 1977-12-20 | 1979-07-06 | Matsushita Electric Ind Co Ltd | Method and apparatus for preparing solder powder |
| JPS58147501A (en) * | 1982-02-15 | 1983-09-02 | エスシ−エム・コ−ポレ−シヨン | Manufacture of dispersion enhancement type alloy particle |
| JPS58157595A (en) * | 1982-03-11 | 1983-09-19 | Senjiyu Kinzoku Kogyo Kk | Production of solder powder |
| JPS58217608A (en) * | 1982-06-14 | 1983-12-17 | Toyo Kinzokufun Kk | Manufacture of metal particle |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6511524B2 (en) | 2001-01-12 | 2003-01-28 | Yugen Kaisha Shoukiseisakusho | Method and device for producing ball-shaped metallic particles at least almost equal in diameter |
| JP2008183621A (en) * | 2008-02-04 | 2008-08-14 | Mitsui Mining & Smelting Co Ltd | Solder powder |
| JP2008261057A (en) * | 2008-07-07 | 2008-10-30 | Dowa Holdings Co Ltd | Method for producing spherical body |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2510524B2 (en) | 1996-06-26 |
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