JPS6343430U - - Google Patents

Info

Publication number
JPS6343430U
JPS6343430U JP13689086U JP13689086U JPS6343430U JP S6343430 U JPS6343430 U JP S6343430U JP 13689086 U JP13689086 U JP 13689086U JP 13689086 U JP13689086 U JP 13689086U JP S6343430 U JPS6343430 U JP S6343430U
Authority
JP
Japan
Prior art keywords
film fixing
semiconductor device
fixing member
film
insulating member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13689086U
Other languages
English (en)
Other versions
JPH0432762Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13689086U priority Critical patent/JPH0432762Y2/ja
Publication of JPS6343430U publication Critical patent/JPS6343430U/ja
Application granted granted Critical
Publication of JPH0432762Y2 publication Critical patent/JPH0432762Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Credit Cards Or The Like (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図〜第３図はこの考案の一実施例を示す平
面図、側面図、裏面図、第４図は従来の半導体装
置を実装した状態を示す斜視図、第５図、第６図
は従来の半導体装置を示す平面図、側面図である
。 図において、１はプリント配線基板、３ａ，３
ｂは前者が長く、後者が短い、いずれもリード端
子、１０はフイルム固定部材、１２は絶縁部材、
５は半導体チツプである。尚、図中同一符号は同
一又は相当部分を示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 半導体チツプを固定するフイルム固定部材
    と、 前記フイルム固定部材に固定され、プリント配
    線基板に表面実装され、前記基板と前記チツプと
    を電気的に接続する複数のリード端子とを 備えたものにおいて、長短、交互に前記リード
    端子が並ぶようにすると共に、長いリード端子の
    フイルム固定部材側の裏面に絶縁部材を設けたこ
    とを特徴とする半導体装置。 (2) 絶縁部材が塗布して得られる絶縁物である
    ことを特徴とする実用新案登録請求の範囲第１項
    記載の半導体装置。 (3) 絶縁部材がフイルム固定部材の元の材料の
    フイルムを微細加工して形成されていることを特
    徴とする実用新案登録請求の範囲第１項記載の半
    導体装置。
JP13689086U 1986-09-04 1986-09-04 Expired JPH0432762Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13689086U JPH0432762Y2 (ja) 1986-09-04 1986-09-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13689086U JPH0432762Y2 (ja) 1986-09-04 1986-09-04

Publications (2)

Publication Number Publication Date
JPS6343430U true JPS6343430U (ja) 1988-03-23
JPH0432762Y2 JPH0432762Y2 (ja) 1992-08-06

Family

ID=31040428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13689086U Expired JPH0432762Y2 (ja) 1986-09-04 1986-09-04

Country Status (1)

Country Link
JP (1) JPH0432762Y2 (ja)

Also Published As

Publication number Publication date
JPH0432762Y2 (ja) 1992-08-06

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