JPS6342140Y2 - - Google Patents
Info
- Publication number
- JPS6342140Y2 JPS6342140Y2 JP4148486U JP4148486U JPS6342140Y2 JP S6342140 Y2 JPS6342140 Y2 JP S6342140Y2 JP 4148486 U JP4148486 U JP 4148486U JP 4148486 U JP4148486 U JP 4148486U JP S6342140 Y2 JPS6342140 Y2 JP S6342140Y2
- Authority
- JP
- Japan
- Prior art keywords
- conveyor
- spray nozzle
- surface treatment
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007921 spray Substances 0.000 claims description 49
- 238000004381 surface treatment Methods 0.000 claims description 28
- 239000000126 substance Substances 0.000 claims description 22
- 230000005540 biological transmission Effects 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 13
- 238000005530 etching Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000033001 locomotion Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4148486U JPS6342140Y2 (enEXAMPLES) | 1986-03-20 | 1986-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4148486U JPS6342140Y2 (enEXAMPLES) | 1986-03-20 | 1986-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62153368U JPS62153368U (enEXAMPLES) | 1987-09-29 |
| JPS6342140Y2 true JPS6342140Y2 (enEXAMPLES) | 1988-11-04 |
Family
ID=30856531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4148486U Expired JPS6342140Y2 (enEXAMPLES) | 1986-03-20 | 1986-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6342140Y2 (enEXAMPLES) |
-
1986
- 1986-03-20 JP JP4148486U patent/JPS6342140Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62153368U (enEXAMPLES) | 1987-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1350834A (en) | Method and apparatus for decontaminating hollow articles | |
| JPS6342140Y2 (enEXAMPLES) | ||
| JPH022112A (ja) | 半導体ウェファの処理方法と装置 | |
| US4620894A (en) | Apparatus for processing circuit board substrate | |
| KR20070062433A (ko) | 기판의 처리 장치 | |
| US5524654A (en) | Etching, developing and peeling apparatus for printed board | |
| KR200190024Y1 (ko) | 자동세척기의 세척 장치 | |
| US3983758A (en) | Automatic processor for offset plates | |
| JPH11156770A (ja) | 基板保持装置 | |
| JP2003062495A (ja) | ロータリー液処理装置 | |
| JP2824031B2 (ja) | 基板の表面処理装置 | |
| JP2006135162A (ja) | 噴霧方法および装置 | |
| JP4213905B2 (ja) | 基板の処理装置及び処理方法 | |
| JPH06302935A (ja) | 基板のエッチング方法、および、基板のエッチング装置 | |
| JPH0453023Y2 (enEXAMPLES) | ||
| EP3460578B1 (en) | System for processing flexographic printing plates | |
| JP2002126663A (ja) | ワーク洗浄方法と、その装置 | |
| JPH0627987Y2 (ja) | 両面プリント基板のエッチング装置 | |
| CN210725536U (zh) | 一种高精密度内层线路的生产装置 | |
| KR20050073714A (ko) | 기판 처리 장치 | |
| JPH06226216A (ja) | 自動洗浄・乾燥装置 | |
| JPH07204547A (ja) | 薄板部材の液処理装置 | |
| JPS60234975A (ja) | 板状物の浸漬処理方法 | |
| SU1627267A1 (ru) | Устройство дл струйного облива | |
| JP2001340815A (ja) | 洗浄装置 |