JPS6341861B2 - - Google Patents

Info

Publication number
JPS6341861B2
JPS6341861B2 JP16602683A JP16602683A JPS6341861B2 JP S6341861 B2 JPS6341861 B2 JP S6341861B2 JP 16602683 A JP16602683 A JP 16602683A JP 16602683 A JP16602683 A JP 16602683A JP S6341861 B2 JPS6341861 B2 JP S6341861B2
Authority
JP
Japan
Prior art keywords
glass
semiconductor
coating
present
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16602683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6060944A (ja
Inventor
Kazuo Hatano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Priority to JP16602683A priority Critical patent/JPS6060944A/ja
Publication of JPS6060944A publication Critical patent/JPS6060944A/ja
Publication of JPS6341861B2 publication Critical patent/JPS6341861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP16602683A 1983-09-08 1983-09-08 半導体被覆用ガラス Granted JPS6060944A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16602683A JPS6060944A (ja) 1983-09-08 1983-09-08 半導体被覆用ガラス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16602683A JPS6060944A (ja) 1983-09-08 1983-09-08 半導体被覆用ガラス

Publications (2)

Publication Number Publication Date
JPS6060944A JPS6060944A (ja) 1985-04-08
JPS6341861B2 true JPS6341861B2 (zh) 1988-08-19

Family

ID=15823556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16602683A Granted JPS6060944A (ja) 1983-09-08 1983-09-08 半導体被覆用ガラス

Country Status (1)

Country Link
JP (1) JPS6060944A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68923313T2 (de) * 1988-04-15 1996-03-14 Du Pont Abdichtungszusammensetzung.
KR101169049B1 (ko) * 2005-06-30 2012-07-26 엘지디스플레이 주식회사 액정 표시 장치용 박막 트랜지스터 소자 및 그의 제조 방법
CN110642519B (zh) * 2019-09-25 2022-06-14 湖南利德电子浆料股份有限公司 一种氮化铝基板用包封浆料及其制备方法和应用

Also Published As

Publication number Publication date
JPS6060944A (ja) 1985-04-08

Similar Documents

Publication Publication Date Title
EP0084936B1 (en) Glass composition for covering semiconductor elements
US3755720A (en) Glass encapsulated semiconductor device
US3505571A (en) Glass covered semiconductor device
JPS638059B2 (zh)
JPS6341861B2 (zh)
TW202033467A (zh) 半導體元件被覆用玻璃及使用此的半導體被覆用材料
US3900330A (en) Zno-b' 2'o' 3'-sio' 2 'glass coating compositions containing ta' 2'o' 5 'and a semiconductor device coated with the same
JPH0149653B2 (zh)
TWI819109B (zh) 半導體元件被覆用玻璃及使用此的半導體被覆用材料
US3674520A (en) Solder glass for adhering sealing or coating
JPS6238301B2 (zh)
JP2764880B2 (ja) 半導体被覆用ガラス
JPS5840845A (ja) 半導体被覆用ガラス
JPS6011467B2 (ja) ガラス被覆半導体装置およびその製法
JPS6124343B2 (zh)
JPS6366417B2 (zh)
JPS58190836A (ja) 半導体被覆用ガラス組成物の製造方法
JPH0426541B2 (zh)
JPS6146420B2 (zh)
JPH0224373B2 (zh)
JPS61294803A (ja) 電圧非直線抵抗体の製造法
CN117923802A (zh) 半导体器件钝化用无铅玻璃粉及其应用
JPH048385B2 (zh)
JPS6325702B2 (zh)
JPS6236611B2 (zh)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees