JPS6341861B2 - - Google Patents
Info
- Publication number
- JPS6341861B2 JPS6341861B2 JP16602683A JP16602683A JPS6341861B2 JP S6341861 B2 JPS6341861 B2 JP S6341861B2 JP 16602683 A JP16602683 A JP 16602683A JP 16602683 A JP16602683 A JP 16602683A JP S6341861 B2 JPS6341861 B2 JP S6341861B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- semiconductor
- coating
- present
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 31
- 239000004065 semiconductor Substances 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 239000000843 powder Substances 0.000 claims description 11
- 229910052844 willemite Inorganic materials 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- 238000007789 sealing Methods 0.000 description 7
- 230000015556 catabolic process Effects 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910007472 ZnO—B2O3—SiO2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000000700 radioactive tracer Substances 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16602683A JPS6060944A (ja) | 1983-09-08 | 1983-09-08 | 半導体被覆用ガラス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16602683A JPS6060944A (ja) | 1983-09-08 | 1983-09-08 | 半導体被覆用ガラス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6060944A JPS6060944A (ja) | 1985-04-08 |
| JPS6341861B2 true JPS6341861B2 (de) | 1988-08-19 |
Family
ID=15823556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16602683A Granted JPS6060944A (ja) | 1983-09-08 | 1983-09-08 | 半導体被覆用ガラス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6060944A (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0337412B1 (de) * | 1988-04-15 | 1995-07-05 | E.I. Du Pont De Nemours And Company | Abdichtungszusammensetzung |
| KR101169049B1 (ko) * | 2005-06-30 | 2012-07-26 | 엘지디스플레이 주식회사 | 액정 표시 장치용 박막 트랜지스터 소자 및 그의 제조 방법 |
| CN110642519B (zh) * | 2019-09-25 | 2022-06-14 | 湖南利德电子浆料股份有限公司 | 一种氮化铝基板用包封浆料及其制备方法和应用 |
-
1983
- 1983-09-08 JP JP16602683A patent/JPS6060944A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6060944A (ja) | 1985-04-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0084936B1 (de) | Glaszusammensetzung zum Überziehen von Halbleiterelementen | |
| US3755720A (en) | Glass encapsulated semiconductor device | |
| US3505571A (en) | Glass covered semiconductor device | |
| JPS638059B2 (de) | ||
| JPS6341861B2 (de) | ||
| TW202033467A (zh) | 半導體元件被覆用玻璃及使用此的半導體被覆用材料 | |
| US3900330A (en) | Zno-b' 2'o' 3'-sio' 2 'glass coating compositions containing ta' 2'o' 5 'and a semiconductor device coated with the same | |
| JPH0149653B2 (de) | ||
| TWI819109B (zh) | 半導體元件被覆用玻璃及使用此的半導體被覆用材料 | |
| US3674520A (en) | Solder glass for adhering sealing or coating | |
| JPS6011467B2 (ja) | ガラス被覆半導体装置およびその製法 | |
| JPS58167445A (ja) | 半導体被覆用ガラス | |
| JP2764880B2 (ja) | 半導体被覆用ガラス | |
| JPS5840845A (ja) | 半導体被覆用ガラス | |
| JPS6146420B2 (de) | ||
| JPS6124343B2 (de) | ||
| JPS6366417B2 (de) | ||
| JPS58190836A (ja) | 半導体被覆用ガラス組成物の製造方法 | |
| JPH0426541B2 (de) | ||
| JPH0224373B2 (de) | ||
| JPS61294803A (ja) | 電圧非直線抵抗体の製造法 | |
| CN117923802A (zh) | 半导体器件钝化用无铅玻璃粉及其应用 | |
| JPH048385B2 (de) | ||
| JPS6325702B2 (de) | ||
| JPS6236611B2 (de) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |