JPS6341108A - Resin molding device - Google Patents
Resin molding deviceInfo
- Publication number
- JPS6341108A JPS6341108A JP61185617A JP18561786A JPS6341108A JP S6341108 A JPS6341108 A JP S6341108A JP 61185617 A JP61185617 A JP 61185617A JP 18561786 A JP18561786 A JP 18561786A JP S6341108 A JPS6341108 A JP S6341108A
- Authority
- JP
- Japan
- Prior art keywords
- heat receiving
- infrared absorbing
- receiving surface
- absorbing material
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 23
- 229920005989 resin Polymers 0.000 title claims abstract description 20
- 239000011347 resin Substances 0.000 title claims abstract description 20
- 239000011358 absorbing material Substances 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims abstract description 17
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 7
- 239000004800 polyvinyl chloride Substances 0.000 abstract description 5
- 229920000915 polyvinyl chloride Polymers 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 238000004898 kneading Methods 0.000 abstract description 4
- 229920000877 Melamine resin Polymers 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 abstract description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 230000003028 elevating effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 36
- 238000010438 heat treatment Methods 0.000 description 15
- 238000007666 vacuum forming Methods 0.000 description 6
- 239000000470 constituent Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000000071 blow moulding Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000002335 surface treatment layer Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は成形装置の樹脂溶融部や成形型などにおける
受熱面の有利な加熱構造に関する。なお本発明において
樹脂成形装置とは装置全体並びに成形型までを含む範囲
で使用する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an advantageous heating structure for a heat-receiving surface of a resin melting part of a molding device, a mold, or the like. In the present invention, the resin molding apparatus is used to include the entire apparatus and molds.
［発明の背景］
射出成形、押し出し成形及びブロー成形などによる熱可
塑性樹脂の成形においては、まず樹脂成形装置内におい
て、熱可塑性樹脂を溶融するための加熱部が設けられる
。またロール成形や真空成形などにおいては、ロール面
や型面を加熱して行う。ところでこのような各部の加熱
に際して、内蔵等されるヒータの輻射熱によって昇温す
る必要がある。この昇温性能は成形サイクルに大きな影
響を及ぼす。ところが実際は受熱面における満足な昇温
性能が得られにくい。受熱面を形成゛する材料がまだ不
十分なためである。このため大電力で加熱する必要があ
り、電力コストが増大した。[Background of the Invention] In molding a thermoplastic resin by injection molding, extrusion molding, blow molding, etc., a heating section for melting the thermoplastic resin is first provided in a resin molding apparatus. Further, in roll forming, vacuum forming, etc., the roll surface or mold surface is heated. By the way, when heating each part, it is necessary to raise the temperature by radiant heat from a built-in heater or the like. This temperature increase performance has a large effect on the molding cycle. However, in reality, it is difficult to obtain satisfactory temperature increase performance on the heat receiving surface. This is because the material that forms the heat receiving surface is still insufficient. For this reason, it was necessary to heat with a large amount of electric power, which increased the electric power cost.
［発明の目的］
本発明は樹脂成形装置を構成する材料を工夫することに
より、樹脂成形装置の受熱面における昇温性能を向上さ
せることを目的とする。[Object of the Invention] An object of the present invention is to improve the temperature raising performance on the heat receiving surface of a resin molding device by devising the materials constituting the resin molding device.
［発明の概要］
本発明の樹脂成形装置は、その受熱面の少なくとも一部
に赤外線吸収材層を形成しである。第１図は本発明にか
かる樹脂成形装置の受熱部１部分を原理的に示す模式図
である。この受熱部１の熱源側には受熱面２が形成され
る。さらに受熱面２に対して赤外線吸収材層３が積層形
成される。赤外線吸収材層３はポリエステルフィルムな
どのフィルムや受熱面２上に直接形成された表面処理層
等からなる。表面処理としては塗装や各種材料のコーテ
ィングがある。またコーティング層の形成には金属層の
容射によるものも含まれる。コーティング材料はメラミ
ン樹脂など各種の樹脂又は金属材料が受熱面２の構成材
料との関係で適宜選択される。但し赤外線吸収材層３の
構成材料は、受熱面２の構成材料と比較して相対的に赤
外線の吸収能が高いものであればよく、特定の材料に限
定されるものではない。このようにして構成した樹脂成
形装置の受熱部１に対して内部または外部のヒータ４か
ら受熱面２及び赤外線吸収材層３を加熱すると、ヒータ
４の輻射熱を赤外線吸収材層３が吸収し、受熱面２を加
熱する。したがって赤外線吸収材層３によりヒータ４単
独の加熱よりも著しく加熱効率がよくなり、昇温性能が
向上する。[Summary of the Invention] The resin molding apparatus of the present invention has an infrared absorbing material layer formed on at least a portion of its heat receiving surface. FIG. 1 is a schematic diagram showing the principle of a portion of a heat receiving section of a resin molding apparatus according to the present invention. A heat receiving surface 2 is formed on the heat source side of the heat receiving portion 1 . Further, an infrared absorbing material layer 3 is laminated on the heat receiving surface 2 . The infrared absorbing material layer 3 is made of a film such as a polyester film, a surface treatment layer formed directly on the heat receiving surface 2, or the like. Surface treatments include painting and coating with various materials. Formation of the coating layer also includes a method of forming a metal layer by spraying. As the coating material, various resins such as melamine resin or metal materials are appropriately selected depending on the constituent material of the heat receiving surface 2. However, the constituent material of the infrared absorbing material layer 3 is not limited to a specific material as long as it has a relatively high infrared absorption ability compared to the constituent material of the heat receiving surface 2. When the heat receiving surface 2 and the infrared absorbing material layer 3 of the heat receiving part 1 of the resin molding apparatus configured in this way are heated from the internal or external heater 4, the infrared absorbing material layer 3 absorbs the radiant heat of the heater 4, The heat receiving surface 2 is heated. Therefore, the infrared absorbing material layer 3 has a significantly better heating efficiency than heating by the heater 4 alone, and the temperature raising performance is improved.
第２図は受熱面をアルミニウム、鉄及びＳＵ３合金の３
種の金属に変えた場合における、赤外線吸収材層の影響
を示すものである。これらはいずれも同一の条件で加熱
したものである。なお太い実線は赤外線吸収材層を併用
したものを、また細い実線は赤外線吸収材層を使用しな
い比較例を示す。これから明らかなように、いずれの金
属においても赤外線吸収材層を用いた方が、用いないも
のの約倍の昇温性能を示す。Figure 2 shows three types of heat receiving surfaces: aluminum, iron, and SU3 alloy.
This figure shows the influence of the infrared absorbing material layer when changing to a different metal. All of these were heated under the same conditions. Note that the thick solid line indicates a comparative example in which an infrared absorbing material layer was used, and the thin solid line indicates a comparative example in which an infrared absorbing material layer was not used. As is clear from this, for any metal, when an infrared absorbing material layer is used, the temperature increase performance is approximately twice as high as when no infrared absorbing material layer is used.
第３図は受熱面として一定の厚さを有するアルミニウム
板を赤外線吸収材層を使用しないで加熱した場合（点線
示の曲線）と、２倍の板厚を有するアルミニウム板に赤
外線吸収材層を積層したものを加熱した場合（実線示の
曲線）とにおける昇温特性を相互に比較したグラフであ
る。これからも明らかなように後者の方が遥かに昇温性
能が優れている。これは赤外線吸収材層の貢献によるこ
とか明らかである。Figure 3 shows the case where an aluminum plate with a certain thickness is heated as a heat receiving surface without using an infrared absorbing material layer (the curve shown by the dotted line), and the case where an aluminum plate with twice the thickness is heated without using an infrared absorbing material layer. It is a graph comparing the temperature increase characteristics when a stacked product is heated (solid curve). As is clear from this, the latter has far superior temperature raising performance. It is clear that this is due to the contribution of the infrared absorbing material layer.
第４図は金属板等からなる同一の受熱面に対して、赤外
線吸収材層を積層せず単独で使用した場合（点線示の曲
線）と、赤外線吸収材層を積層した場合（実線示の曲線
）とを形成し、これらを同一加熱条件（１５０Ｖキセソ
ンランプ）でそれぞれ加熱し、相互に比較したグラフで
ある。これから明らかなように、赤外線吸収材層を使用
したものの方が昇温速度が早い。なおこのグラフにおけ
る加熱条件はキセノンランプを使用したものであるが、
他の加熱方法を用いてもグラフの傾向は同様のものとな
る。Figure 4 shows the case where the infrared absorbing material layer is used alone without laminating it (the curve shown by the dotted line) and the case where the infrared absorbing material layer is laminated (the curve shown by the solid line) on the same heat receiving surface made of a metal plate etc. This is a graph obtained by heating these curves under the same heating conditions (150V xeson lamp) and comparing them with each other. As is clear from this, the temperature rise rate is faster in the case where an infrared absorbing material layer is used. Note that the heating conditions in this graph are those using a xenon lamp,
Even if other heating methods are used, the trend of the graph will be similar.
［発明の効果］
本発明の樹脂成形装置は、その受熱面の少なくとも一部
に赤外線吸収材層を形成しである。したがって、受熱面
を適宜熱源により加熱したとき、受熱面が吸収し切れな
い熱量までも赤外線吸収材層が吸収する。熱源による直
接加熱に加えて加熱昇温された赤外線吸収材層も受熱面
を加熱する。[Effects of the Invention] The resin molding apparatus of the present invention has an infrared absorbing material layer formed on at least a portion of its heat receiving surface. Therefore, when the heat receiving surface is heated by an appropriate heat source, the infrared absorbing material layer absorbs even the amount of heat that cannot be completely absorbed by the heat receiving surface. In addition to direct heating by the heat source, the heated infrared absorbing material layer also heats the heat receiving surface.
したがって受熱面の昇温性能が向上し、かつ加熱効率が
よくなる。その結果消費電力を節約することも可能とな
る。Therefore, the temperature raising performance of the heat receiving surface is improved and the heating efficiency is improved. As a result, it is also possible to save power consumption.
［実施例］
以下図面に基づいて本発明を具体的な各種成形装置に適
用した実施例を説明する。[Examples] Examples in which the present invention is applied to various specific molding devices will be described below based on the drawings.
（第１実施例）
第５図はポリ塩化ビニールなどの混練りに使用されるミ
キシングロールの輪切断面を示す。すなわちミキシング
ロール１０は中心部にヒータ１１が設けられ、その周囲
を囲む中空ドラム１２の内側面に赤外線吸収材層１３が
形成されている。中空ドラム１２はアルミニウムからな
り本考案における受熱部をなす。また赤外線吸収材層１
３は中空ドラム１２の内側面に直接形成されたメラミン
塗装からなる。但し赤外線吸収材層１３の構成材料は、
受熱面の構成材料に対して相対的に赤外線の吸収能が高
いものであればよく、特定の材料に限定されるものでは
ないことは前記のとうりであるから、各種樹脂材料及び
その他金属材料等適宜選択使用される。以下の説明にお
いても同様である。そこでヒータ１１によって中空ドラ
ム１２を加熱すると、赤外線吸収材層１３の介在により
急速かつ高温まで昇温し、ポリ塩化ビニールなどの混練
りを迅速かつ均一に行うことができ、成形効率を向上で
きる。なおこのようなロールの用途として他に加熱用ド
ラムや熱転写用ドラムなど多くのものがある。(First Example) FIG. 5 shows a cross section of a mixing roll used for kneading polyvinyl chloride or the like. That is, the mixing roll 10 is provided with a heater 11 at its center, and an infrared absorbing material layer 13 is formed on the inner surface of a hollow drum 12 surrounding the heater 11. The hollow drum 12 is made of aluminum and serves as a heat receiving part in the present invention. In addition, the infrared absorbing material layer 1
3 consists of a melamine coating directly formed on the inner surface of the hollow drum 12. However, the constituent material of the infrared absorbing material layer 13 is
As mentioned above, it is not limited to a specific material as long as it has a high infrared absorption ability relative to the constituent material of the heat receiving surface, so various resin materials and other metal materials may be used. etc. are selected and used as appropriate. The same applies to the following description. Therefore, when the hollow drum 12 is heated by the heater 11, the temperature is rapidly raised to a high temperature due to the interposition of the infrared absorbing material layer 13, and the kneading of polyvinyl chloride and the like can be performed quickly and uniformly, thereby improving molding efficiency. There are many other uses for such rolls, such as heating drums and thermal transfer drums.
（第２実施例）
第６図は射出成形機におけるノズル２０の輪切断面であ
る。すなわちノズル本体２１の周囲には赤外線吸収材層
２２が形成され、さらにその周囲をバンドヒータ２３が
包囲している。したがってバンドヒータ２３で、本考案
における受熱部をなすノズル本体２１を加熱するとき、
赤外線吸収材層２２によって急速かつ高温まで昇温する
。そこでノズル本体２１中心部に形成されている樹脂溶
融部２４内の樹脂を熱効率よく加熱できる。したがって
熱可塑性樹脂は勿論のこと、加熱と冷却を反復する必要
がある熱硬化性樹脂を射出成形する場合にも好適である
。なお類似の成形装置としてブロー成形機や押し出し成
形機におけるノズル部分がある。(Second Embodiment) FIG. 6 is a cross section of a nozzle 20 in an injection molding machine. That is, an infrared absorbing material layer 22 is formed around the nozzle body 21, and a band heater 23 surrounds the infrared absorbing material layer 22. Therefore, when the band heater 23 heats the nozzle body 21 which forms the heat receiving part in the present invention,
The temperature is rapidly raised to a high temperature by the infrared absorbing material layer 22. Therefore, the resin in the resin melting portion 24 formed at the center of the nozzle body 21 can be heated with high thermal efficiency. Therefore, it is suitable for injection molding not only thermoplastic resins but also thermosetting resins that require repeated heating and cooling. Note that similar molding devices include nozzle parts in blow molding machines and extrusion molding machines.
（第３実施例）
第７図は真空成形機における真空成形型３０を示す。真
空成形型３０は本考案における受熱部をなし、ＦＲＰな
との樹脂や木さらにはアルミニウムなどからなる。真空
成形型３０の表面には成形パターン３１が形成され、そ
の頂部には赤外線吸収材層３２が形成される。そこで真
空成形型３０上にポリ塩化ビニールなどの被成形シート
３３を置き、その上からヒータ３４によって、被成形シ
ート３３を加熱する。その後真空成形型３゛０を被成形
シート３３の下面に突上げ、真空吸引して公知の真空成
形を行う。このとき成形パターン３１はヒータ３４の輻
射熱で加熱され高温となっているが、成形パターン３１
の頂部は赤外線吸収材層３２によってさらに高温となっ
ている。そこで赤外線吸収材層３２が最初に被成形シー
ト３３の下面に接触しても、被成形シート３３は冷却さ
れにくく、それだけ被成形シート３３の延びを大きくで
きる。したがって深絞り成形が可能となる。なお本発明
は本実施例におけるように必要部分に対してのみ部分的
に赤外線吸収材層を施すことができ、加熱条件を部分的
に変更可能である。(Third Embodiment) FIG. 7 shows a vacuum forming mold 30 in a vacuum forming machine. The vacuum forming mold 30 constitutes a heat receiving part in the present invention, and is made of resin such as FRP, wood, or even aluminum. A molding pattern 31 is formed on the surface of the vacuum molding mold 30, and an infrared absorbing material layer 32 is formed on the top of the molding pattern 31. Therefore, a sheet 33 to be formed, such as polyvinyl chloride, is placed on the vacuum mold 30, and the sheet 33 to be formed is heated by the heater 34 from above. Thereafter, the vacuum forming mold 3'0 is pushed up onto the lower surface of the sheet to be formed 33, and vacuum suction is applied to perform known vacuum forming. At this time, the molded pattern 31 is heated by the radiant heat of the heater 34 and has a high temperature, but the molded pattern 31
The top of the infrared absorbing material layer 32 makes the temperature even higher. Therefore, even if the infrared absorbing material layer 32 first contacts the lower surface of the sheet 33 to be formed, the sheet 33 to be formed is difficult to be cooled, and the extension of the sheet 33 to be formed can be increased accordingly. Therefore, deep drawing is possible. In addition, in the present invention, as in the present embodiment, the infrared absorbing material layer can be partially applied only to the necessary portions, and the heating conditions can be partially changed.
（第４実施例）
第８図はポリ塩化ビニールなどの中空成形の際使用され
る中空成形型や、このようにして成形された中空品内に
ポリウレタン樹脂を注入して発泡成形する場合における
発泡型などの成形型に適用したものである。すなわちア
ルミニウム等からなる成形型４０は本考案における受熱
部をなし分割型として構成される。成形型４０の最も加
熱しにくい部分である、コーナ一部４１の周囲には部分
的に赤外線吸収材層４２が積層されている。そこで成形
型４０の外部から加熱して成形すると、コーナ一部４１
が赤外線吸収材層４２にによって他部よりも熱効率よく
加熱される。その結果、内部の中空成形品は均一に加熱
され、製品の品質が向上する。(Fourth Example) Figure 8 shows a hollow mold used for hollow molding of polyvinyl chloride, etc., and foaming when polyurethane resin is injected into a hollow product molded in this way to perform foam molding. It is applied to molds such as molds. That is, the mold 40 made of aluminum or the like constitutes a heat receiving part in the present invention and is constructed as a split mold. An infrared absorbing material layer 42 is partially laminated around a corner part 41, which is the part of the mold 40 that is most difficult to heat. Therefore, when molding is performed by heating from the outside of the mold 40, the corner part 41
is heated by the infrared absorbing material layer 42 with higher thermal efficiency than other parts. As a result, the internal hollow molded product is heated evenly, improving the quality of the product.
第１図は本発明の原理を示す展開図、第２図乃至第４図
は本発明における昇温特性を示すグラフである。第５図
乃至第８図は実施例を示し、第５図はＳ１°の実施例に
おける要部の断面図、第５図は第１の実施例における要
部の断面図、第６図は第２の実施例における要部の断面
図、第７図は第３の実施例における要部の断面図、第８
図は第４の実施例における要部の断面図である。
（符号の説明）
１・１２・２１・３１・４０・・・受熱部、２・・・受
熱面、３・１３・２２・３２・４２・・・赤外線吸収材
層、４・・・ヒータ、FIG. 1 is a developed diagram showing the principle of the present invention, and FIGS. 2 to 4 are graphs showing temperature increase characteristics in the present invention. 5 to 8 show examples, FIG. 5 is a sectional view of the main part in the S1 degree embodiment, FIG. 5 is a sectional view of the main part in the first embodiment, and FIG. FIG. 7 is a sectional view of the main part in the third embodiment, and FIG. 8 is a sectional view of the main part in the second embodiment.
The figure is a sectional view of main parts in the fourth embodiment. (Explanation of symbols) 1, 12, 21, 31, 40... Heat receiving part, 2... Heat receiving surface, 3, 13, 22, 32, 42... Infrared absorbing material layer, 4... Heater,
Claims (1)
し、該受熱部には前記熱源に対面する受熱面を設け、さ
らに該受熱面上に赤外線吸収能が該受熱面よりも高い材
料からなる赤外線吸収材層を形成したことを特徴とする
樹脂成形装置。It has a heat receiving part that heats the molded resin by receiving radiant heat from a heat source, and the heat receiving part is provided with a heat receiving surface facing the heat source, and further, a material having an infrared absorption ability higher than that of the heat receiving surface is provided on the heat receiving surface. A resin molding device characterized in that an infrared absorbing material layer is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61185617A JP2553334B2 (en) | 1986-08-06 | 1986-08-06 | Resin molding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61185617A JP2553334B2 (en) | 1986-08-06 | 1986-08-06 | Resin molding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6341108A true JPS6341108A (en) | 1988-02-22 |
| JP2553334B2 JP2553334B2 (en) | 1996-11-13 |
Family
ID=16173928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61185617A Expired - Lifetime JP2553334B2 (en) | 1986-08-06 | 1986-08-06 | Resin molding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2553334B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010269541A (en) * | 2009-05-22 | 2010-12-02 | Techno Polymer Co Ltd | Rubber mold for electromagnetic wave irradiation molding and electromagnetic wave irradiation molding method |
| JP2011240539A (en) * | 2010-05-17 | 2011-12-01 | Techno Polymer Co Ltd | Light irradiation molding device and method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5098408A (en) * | 1973-12-29 | 1975-08-05 | ||
| JPS538679A (en) * | 1976-07-14 | 1978-01-26 | Asahi Dow Ltd | Thermoplastic film with improved surface characteristics and air permeability and its process of manufacture |
| JPS58150286A (en) * | 1982-03-03 | 1983-09-06 | 岸本産業株式会社 | Method of heating by infrared ray |
| JPS5997020U (en) * | 1982-12-22 | 1984-06-30 | 日本碍子株式会社 | Infrared heating device for plastic molding machine |
-
1986
- 1986-08-06 JP JP61185617A patent/JP2553334B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5098408A (en) * | 1973-12-29 | 1975-08-05 | ||
| JPS538679A (en) * | 1976-07-14 | 1978-01-26 | Asahi Dow Ltd | Thermoplastic film with improved surface characteristics and air permeability and its process of manufacture |
| JPS58150286A (en) * | 1982-03-03 | 1983-09-06 | 岸本産業株式会社 | Method of heating by infrared ray |
| JPS5997020U (en) * | 1982-12-22 | 1984-06-30 | 日本碍子株式会社 | Infrared heating device for plastic molding machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010269541A (en) * | 2009-05-22 | 2010-12-02 | Techno Polymer Co Ltd | Rubber mold for electromagnetic wave irradiation molding and electromagnetic wave irradiation molding method |
| JP2011240539A (en) * | 2010-05-17 | 2011-12-01 | Techno Polymer Co Ltd | Light irradiation molding device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2553334B2 (en) | 1996-11-13 |
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