JPS634054A - Vacuum forming device for thin film - Google Patents

Abstract

PURPOSE:To prevent the soaring up of the particles dropped from a target and stored once in the bottom of a vacuum chamber and the sticking thereof to a substrate to be formed with a thin film and the consequent deterioration in the quality of the formed thin film by providing a specifically constructed dust shutter plate to the lower part of the vacuum chamber of a vacuum forming device for thin films. CONSTITUTION:The target 2 and a substrate holder 3 mounted with the substrate 4 are disposed to face each other in the vacuum chamber 1 and a sputtering gas is supplied through an inlet 6 into the vacuum chamber 1 and is discharged from a discharge port 7. A high- voltage DC voltage is impressed between the target 2 and the substrate holder 3 by a DC power source 8 to generate a plasma discharge 5 between the same. Sputtering gas ions sputter the surface of the target 2 and the sputter particles splashing therefrom form the thin film on the surface of the substrate 4. The shutter plate 11 provided with many holes 13 having inclined vanes 14 inclining downward is disposed to the lower part of the vacuum chamber 1 of the above-mentioned device. The powder 15 dropping from the target 2 drop downward along the inclined wanes, the particles 16 tending to soar upward are blocked by the inclined plates 11 and cannot pass the holes 13; therefore, the particles do not stick to the surface of the substrate 14 and the thin film having excellent quality is obtd.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to an apparatus for forming a thin film on a substrate in a vacuum chamber, and particularly relates to an apparatus for forming a thin film on a substrate in a vacuum chamber. The present invention relates to a vacuum thin film forming apparatus that takes measures against falling particles or dust into consideration.

[Prior Art] Fig. 4 is a cross-sectional view of a sputtering apparatus conventionally used in general, for example, in which 1 is a vacuum chamber, 2 is a target, 3 is a substrate holder, and 4 is a sputtering device attached to the substrate holder 3. 5 is plasma generated during sputter film formation, 6 is a sputter gas inlet for introducing gas during sputter film formation, 7 is an exhaust port to an exhaust device such as a vacuum pump, 8 is a DC power supply (DC power supply), Reference numeral 9 indicates a conductive wire connecting the DC power supply 8 to the target 2 and the substrate holder 3, and 10 indicates fine particles generated during sputtering film formation.

Next, the operation will be explained. After the vacuum chamber 1 is evacuated by an exhaust lower, sputtering gas is introduced through the sputtering gas inlet 6. When the voltage of the DCw source 8 is applied to this, a plasma 5 is generated between the target 2 and the substrate holder 3, ions in this sputter the surface of the target 2, and two molecules of neutral atoms that pop out are attached to the substrate. 4 to form a thin film. Particles that did not participate in the film formation at this time and fallen particles such as minute protrusions formed on the surface of the target 2 fall to the lower part of the chamber as microscopic particles 10 and become dust and accumulate in the vacuum chamber 1. .

[Problems to be Solved by the Invention] However, since such a conventional vacuum thin film forming apparatus is configured as described above, particles that fall into the vacuum chamber 1 and become dust are collected in the vacuum chamber 1. Due to airflow turbulence that occurs during leakage or exhaust work, the particles fly up again and adhere to the substrate 4 and target 2, causing defective films. Furthermore, in a continuous sputtering apparatus for mass production, since the substrate is transported, there is a problem that the vibration and agitation caused by this process further increase the occurrence of defective films.

This invention was made to solve the above-mentioned problems, and its purpose is to provide a vacuum thin film forming apparatus that can effectively prevent the formation of defective films due to dust generated in a vacuum chamber. .

[Means for Solving the Problems] The vacuum thin film forming apparatus according to the present invention easily allows particles generated in the vacuum chamber to pass through by falling, but allows particles and dust that fly up from below to pass through. A dust jacket that is configured to close like a lid is placed at the bottom of the vacuum chamber.

[Function] In the vacuum thin film forming apparatus of this invention, it is easy for falling particles to pass through the dust closing plate placed at the bottom of the vacuum chamber, but it seems to be difficult for particles and dust flying up from below to pass through. By closing the chamber, dust is prevented from entering the film, and the dust is collected below the vacuum chamber.

[Embodiment of the Invention] An embodiment of the invention will be described below with reference to the drawings. 1st
The figure is a cross-sectional view showing a vacuum thin film forming apparatus as an embodiment of the present invention. In this figure, 1 is a vacuum chamber;
is a target, 3 is a substrate holder, 4 is a substrate, 5 is a plasma, 6 is a sputtering gas inlet, 7 is an exhaust port, 8 is a DC power supply, 9 is a conductor, and 10 is a fine particle generated during film formation. , these devices are almost the same as the conventional vacuum thin film forming apparatus shown in FIG.

Further, 11 is a dust cover plate disposed at the lower part of the vacuum chamber 1. The dust cover plate 11 has a large number of holes 13 on its surface, as partially enlarged in FIGS. 2 and 3.
are drilled, and the lower edge of each hole 13 is provided with an inclined wing 14 that slopes downward. Therefore, the falling particles 15 pass through the hole 13 and fall downward along the upper side of the sloped surface of the sloped blade 14, and the particles trying to rise fall from the sloped blade 14.
4, it is blocked from passing through the hole 13, and most of it is repelled and deposited below the vacuum chamber.

Incidentally, although an example of a dust closed plate has been described above, it goes without saying that all configurations having the same geometrical effect can be used.

[Effects of the Invention] As described above, according to the present invention, by arranging the dust barrier plate at the lower part of the tank of the vacuum thin film forming apparatus, it is possible to facilitate the passage of falling particles and prevent the rising particles and dust from passing through. This prevents dust from adhering to the film forming surface during film formation, forming a high-quality thin film, and also collects the dust downward for recovery. There are effects such as making it easier.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a vacuum thin film forming apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged perspective view of a part of the dust jacket plate, FIG. 3 is a partial sectional view of the dust jacket plate, and FIG. The figure is a cross-sectional view of a conventional vacuum thin film forming apparatus. In the figure, 1.-vacuum chamber, lQ-particle, l 1-.-
Dust shield and closed plate, 13-...-hole, 14-...-slanted wing. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (2)

[Claims] (1) In an apparatus that forms a thin film on a substrate in a vacuum chamber, the lower part of the vacuum chamber allows particles generated during film formation in the vacuum chamber to pass through due to falling, but does not allow them to pass through due to upward movement. A vacuum thin film forming apparatus characterized in that a dust shield and a closing plate are arranged. (2) A sloped blade is provided at the lower edge of the hole in the dust shield and closing plate, and the sloped blade causes falling particles to fall down along the upper side of the slope, and particles to rise to the bottom of the slope. The vacuum thin film forming apparatus according to claim 1, wherein the vacuum thin film forming apparatus is arranged in an inclined state so that it hits the lower side and is returned downward.