JPS6340054A - Tile type antistatic floor material - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Industrial Field of Application) The present invention has antistatic properties that can be applied to floors in semiconductor assembly factories, hospital operating rooms, clean rooms, computer rooms, other factories, offices, general homes, etc. The present invention relates to tile-type flooring materials.

(Prior art) Conventionally, flooring materials such as aluminum and stainless steel have been used for the floors of rooms where static electricity should not be charged or generated, but they are hard and have problems such as walking noise and vibration. However, there are also problems such as a monotonous appearance and high cost.Recently, long soft vinyl flooring materials with conductive or antistatic properties have been developed, and this type of flooring material is often used. reached.

(Problem to be solved by the invention) However, with the recent increase in the introduction of OA equipment, wiring is often changed, and these signal cables are routed along the surface of the flooring. It is common practice to lengthen the cables in case of replacement, and to gather the excess cable wires in a messy manner on the flooring surface behind the OA equipment).
Not only does it look bad, but because the cables are laid on the surface of the flooring material, the cables can easily get caught on the feet while walking.

In order to improve this drawback, various types of raised floors have been developed in recent years, and these raised floors usually have a double floor structure with another layer formed on top of the original subfloor, and the gap between the subfloor and the floor. It has become possible to store moving cables, communication cables, network equipment, etc. in the space, and basically the support for forming a floating floor with dimensions of 450 x 450 ~ 50 x 50% and the floor plate that will be the base of the floating floor. It is one unit. This unit is laid out on the floor, cables, network equipment, etc. are stored in the space formed as described above, and flooring material as a vestment material is laid on the floorboard.
It has the advantage that signal cables, etc. do not have to be routed on the surface of the flooring material, giving it a good appearance, and when changing the wiring, it is possible to easily remove the floorboards at the required locations and change the wiring. Ta.

Tiled carpets, vinyl chloride tiles, and other tile-shaped flooring materials that have been treated with antistatic treatment are used as floor covering materials for raised access floors. Not only dirt, dust, and other stains such as leftover liquid from food and drinks that get dirty easily and can be difficult to remove and make the carpet look bad, but also dirt and dust that sticks to tile carpets and can cause malfunctions in OA equipment. This method has drawbacks such as the tendency to generate dust such as fiber waste generated from the tile carpet itself. On the other hand, PVC tiles contain a large amount of powdered inorganic filler to ensure dimensional stability and cost, so they are extremely brittle and often break at the joints during use. The agent may come out and turn into dust, causing malfunctions in OA equipment.Also, the dimensional stability may not be sufficient and the joints may warp (in case of expansion) due to expansion and contraction due to temperature changes in the usage environment. Joint opening (when contracted) is likely to occur (
This problem is particularly likely to occur when flooring is installed using a pressure-sensitive adhesive to facilitate wiring changes after a raised floor has been installed.

(Means for Solving the Problem) The antistatic tile flooring material (1) of the present invention has a lining synthetic resin layer (2) with a volume resistivity of 1011 to 1060, and a resistivity of 10'' to 10'. A conductive base material (3) with a volume resistivity of 10u-10'Ω is laminated on the conductive base material (3).
The mouth surface layer (4) is laminated, and the volume resistivity value of the laminated body is 10"-10"0.

The backing synthetic resin layer (2) with a volume resistivity value of 10"% l O"Ωa is formed from a synthetic resin composition mixed with one or more of an antistatic plasticizer, an antistatic agent, and a conductive substance,
It may be a single layer or may be configured to have multiple layers.

Also, this layer may be a foam layer or a non-foam layer, and in the case of multiple layers, there is no problem even if the non-foam layer and the foam layer are combined. It is something.

Synthetic resins include vinyl chloride resin, acrylic resin, vinyl acetate resin, polyethylene, polyethylene, and ethylene.
Any commonly used synthetic resin such as vinyl acetate copolymer resin or urethane resin may be used, but vinyl chloride resin is particularly preferred. In the present invention, the vinyl chloride resin refers to polyvinyl chloride resin, vinyl chloride and one other 7-mer, ethylene, vinyl acetate, vinyl ether,
In addition to copolymers with maleic acid esters, acrylics, urethanes, etc., it also includes blends of polyvinyl chloride resins and other polymers.

Antistatic plasticizers include tributoxyethylphos-7A (TBXP, manufactured by Oiri Kagaku), butyl diglycol azibe) (BXA, manufactured by Oiri Chemical), Tennsizer 〇-1100 (manufactured by Shin Nippon Rika), BE -673,5FX-
-871 (manufactured by Riken Vitamin Oil) is preferred for 172,8, and dioctyl 7 talate, dibutyl phthalate, butyl benzyl phthalate, dioctyl adipate, dibutyl phthalate, diisononyl 7
Used to replace part or all of general-purpose plasticizers such as tallate. This compounding amount is 100% of the synthetic resin. 5 to i quantity part
100 parts by weight is preferred.

The antistatic agent may be any commonly used antistatic agent such as cationic, anionic, or nonionic antistatic agents, and the amount thereof is 0.2 to 10 parts by weight per 100 parts by weight of the synthetic resin. part is preferred.

Conductive substances include carbon powder and short fibers, silver, copper,
In addition to metal powders and short fibers such as nickel, aluminum, stainless steel, and iron, inorganic fibers with surface conductivity treatment and inorganic fillers with conductivity treatment (conductive calcium carbonate T1
3O-2500: Nitto powdered membrane, antistatic calcium carbonate IC-1, EC-5: manufactured by Maruo Calcium, etc.) organic powder or short fiber, etc. (Dentol WK-100S: manufactured by Otsuka Chemical, etc.)
Sanderon 5S-N (manufactured by Nippon Kasuke Sengyo Co., Ltd.) can be used, and the conductive powder preferably has a particle size of 0.5 to 10oOμ.
The conductive short fibers have a diameter of 1 to 600 μm and a length of 0.5 to 20 μm.
A range of % is preferred. In addition, the blending amount needs to be set appropriately depending on the desired resistance value, but in the case of conductive powder, it is 5 parts by weight or more per 100 parts by weight of resin, and in the case of short fibers, it is 2 parts by weight or more. may be used alone or in combination of two or more. Other plasticizers as necessary,
Conventional additives such as stabilizers, fillers, blowing agents, antifungal agents, colorants, etc. can be used.

The conductive base material (3) is one type of inorganic or organic fiber such as natural animal or vegetable fiber, asbestos, glass fiber, rock wool, pulp, or synthetic fiber that is commonly used as a base material for flooring. Or, in addition to impregnating base materials such as woven fabrics, knitted fabrics, non-woven fabrics, and paper, which are a mixture of at least two types, with a conductive resin liquid, paper such as cine-woven fabrics and glass-mixed paper are manufactured using papermaking methods. In this case, the above-mentioned conductive fibers and powders, conductive treated powders and fibers are mixed, and the above-mentioned conductive fibers and conductive treated fibers are woven into woven fabrics, knitted fabrics, etc. can be used. Among them, nonwoven fabrics and papers (glass mixed paper, inorganic paper, glass fiber paper, etc.) mixed with carbon fibers and powder during paper making are particularly suitable as base materials for flooring materials in terms of size, viscosity, and price.

The synthetic resin surface layer (4) with a volume resistivity value of 10"l O'Ωm is formed from a synthetic resin composition containing one or more of an antistatic plasticizer, an antistatic agent, and a conductive substance, and can be formed as a single layer. It is fine and may be configured in multiple layers.

In the case of a multilayer structure, it is composed of a top layer (0) as the top layer and an intermediate layer (6) located below it, and a printing layer ( )) may be used.

When the printing layer (7) is interposed, the top layer (5) needs to be transparent. The intermediate layer (6) may be a foamed layer or a non-foamed layer, but if the flooring material is required to have cushioning properties, it is preferably a foamed layer.

Further, this surface layer may be formed from a synthetic resin chip using a conductive chip in part.

The synthetic resin, antistatic plasticizer, antistatic agent, and conductive substance that form the aforementioned backing synthetic resin layer (2) can be used, and the amounts can be used in the same manner. However, since powdery or fibrous solid fillers tend to generate dust due to abrasion, it is preferable to add 100 parts by weight or less to 100 parts by weight of the resin.

Regarding the thickness of each layer constituting the flooring of the present invention, the synthetic resin surface layer (4) preferably has a thickness of 0.1 to 3%, and the conductive base material (3) has a thickness of 0.2 to 2'XN or a synthetic resin backing. Resin layer (2) is 0
It is preferable that the total thickness of the floor material in which these respective layers are laminated is in the range of 1 to 4.

Further, when the synthetic resin surface layer (4) is a multilayer, the thickness of the uppermost layer (5) is preferably 0.1 to x%.

If the thickness of the uppermost layer (5) is less than 0.1X, it will easily wear out during use and become unusable in a short period of time.If the thickness exceeds 1, the flooring will be on the surface side. It is undesirable because it is easy to break down and the price is high. If the thickness of the synthetic resin surface layer (4) is less than O or IX, it is unfavorable for the same reason as the above-mentioned top layer (5), and if the thickness exceeds 3%, the floor material will not be on the surface side. This is not preferable because it becomes easy to resist, and at the same time, the antistatic performance of υ decreases when the distance between the conductive base salt is large.

If the thickness of the conductive base material (3) is less than 0.2, the strength will be weak, especially if the backing synthetic resin layer is a foam layer, and it will not be strong due to local load.
There is a risk that the base material may be damaged and the antistatic performance may deteriorate;
If the thickness exceeds 2X, the antistatic performance will improve, but the price will be very high9, which is not economical. Lining synthetic resin layer (
If the thickness of 2) is less than 0.2%, the floor material will not easily peel on the surface side, and if the thickness exceeds 2X, the distance M of the conductive base salt will be large. This is undesirable as it reduces the

(Functions and Effects) The tile-type antistatic flooring material of the present invention does not contain a large amount of inorganic filler that easily generates dust due to abrasion, and has a volume resistivity value of 1 O" = 1 O'Qcm and is flexible. By laminating a transparent or light-colored synthetic resin surface layer (4) on the surface, it prevents the adhesion of dirt and the generation of dust that may cause malfunction of OA equipment, and also prevents damage to joints during use. Under the synthetic resin surface layer, there is a non-stretchable material that does not expand or contract due to temperature changes in the environment in which the flooring material is used, and has a resistance value of 10° to l.
By laminating the conductive base material (3) of O'Ω, it prevents expansion and contraction of the flooring material, improves antistatic performance, and has a flexible volume resistivity value of 10 below the conductive base material. '-10
By laminating Ω pieces of backing synthetic resin layer (2), it suppresses the peeling on the surface side 7 of the flooring material, and improves the removability and removability when wiring is changed when installed on-site using pressure-sensitive adhesive. It improves workability and does not impair the functionality of the raised floor.

In addition, in the tile-type antistatic flooring material of the present invention, the backing synthetic resin layer, the conductive base material, and the surface layer are all conductive in the direction of the antistatic or conductive base layer, so that adjacent tiles Static electricity can be removed even if contact conduction between molded flooring materials is incomplete, and if adjacent tile-type flooring materials are in contact, conduction occurs in the layer direction and horizontal direction, making it even more effective. Static electricity can be removed. In addition, when installing the tile-type antistatic flooring material of the present invention, it is necessary to use a construction adhesive, but in this case,
Antistatic or conductive adhesives, or adhesives normally used for flooring construction, such as synthetic rubber latex type (including pressure-sensitive dust) or acrylic emulsion type (including pressure-sensitive dust)
Adhesives such as ethylene-vinyl acetate copolymer, vinyl acetate, etc., which can impart antistatic properties by transferring antistatic plasticizers, antistatic agents, etc. in the flooring material to the adhesive layer are preferred. In addition, when installing with an adhesive that is not antistatic or conductive, conduction in the layer direction is inhibited by using a bag-applying method that adheres only the periphery of the tile flooring material, or a method that partially adheres it. It can be constructed without any

In addition, the flooring material is composed of a flexible synthetic resin layer and a non-stretchable conductive base material, and both sides of the conductive base material are covered with synthetic resin layers, which can cause office equipment to malfunction. In addition to preventing the generation of dust, it also improves the damage to joints during use, the damage to the surface of the flooring material, and the ease of peeling and reinstallation when changing wiring when installed on-site using pressure-sensitive adhesives. However, it is fully usable without impairing the functionality of the raised floor, and has excellent decorativeness and workability.

Of course, the flooring material of the present invention can be attached to the floorboard of a raised floor using the adhesive described above, and it can be completely integrated with the floorboard and removed together with the floorboard when wiring is changed. It is.

(Example) Next, examples of the present invention will be given, but the present invention is not limited thereto in any way.

Conductive glass mixed paper made by mixing 5% carbon fiber as a conductive base material (others include glass fiber, pulp synthetic resin binder, etc.) (resistance value: L5 x 10"Ω, thickness = 0.4
~), and apply 0.4% of the expandable vinyl chloride resin paste (seal) listed in Table 1 on the surface of the conductive glass-mixed paper.
% thickness, heat gelatinized at 180°C for 1 minute, then print in multiple colors using a printing ink that partially contains a foaming inhibitor, and then print on the surface with the transparency listed in Table 1. After coating (1) to a thickness of 0.3X, the foamable vinyl chloride resin paste was foamed by heating at 210°C for 1 minute and 40 seconds to create a printed pattern and unevenness with a total thickness of 8%. A sheet with a matching pattern was obtained. After that, the back side of the sheet, that is, the side opposite to the side to which the expandable vinyl chloride resin paste was applied, was coated with the lining vinyl chloride resin paste (Table 1).
1) was coated to give a concentration of 0.5%, and the foamed vinyl chloride resin layer and transparent vinyl chloride resin layer of the sheet were heated to gel under heating conditions that do not foam or melt, i.e., 150°C x 2 minutes 30 seconds, resulting in a gelation of 2.3N. obtained flooring materials. The volume resistivity value of this flooring material is 7.7 x 10", QcIn Deashi, J Engineering SI, 10
21 Charging property by Stroll method at 20℃ x 40%RH (
→O, l'7KV and at 20℃ x 20chiRH (A) 0,
It was found that it had an excellent antistatic property of 21 KV.

*1 Antistatic plasticizer manufactured by Shin Nippon Rika Co., Ltd. Hata 2 Cationic belt anti-turtle agent manufactured by Daikyo Kasei Kogyo Co., Ltd. The flooring material obtained in this way was cut into a size of 500 x 500% and placed on a raised floor. Acrylic emulsion pressure sensitive adhesive (
When I installed it using Sumitomo sv;, 'M Beer Pond), it had excellent static electricity removal properties, and there were no joints or cracks due to the expansion and contraction of the flooring material. It was easily peeled off from the interface of layer (2), and even when re-installing, the finish was good just by pressing the flooring material onto the construction adhesive.

(Comparative example) Glass mixed paper, which is commonly used as a base material for flooring, was used, and the foamable vinyl chloride resin paste (v) shown in Table 2 was applied to the surface of the glass mixed paper to a thickness of 0.58%. After coating to give a desired taste and gelling by heating at 180°C for 1 minute, multicolor printing was performed using a printing ink that partially contained a foaming inhibitor. After applying vinyl chloride resin paste (F/) to a thickness of 0.3%, the foaming temperature of the foamable vinyl chloride resin paste composition was 210°C.
Heating was performed for 1 minute and 50 seconds to obtain a flooring material with a total thickness of 2.3 mm or more and a printed pattern and an uneven pattern that matched each other. The volume resistivity value of this flooring material is λOX I O'Ω, and the charging property by the J Engineering S L 1021 Stroll method is (-)3 at 20°C x 40cm RE.
L65KV Also, at 20° C. and 20% RH, it was easily charged as [2,03xv].

4゜When the flooring material obtained in this way was cut into dimensions of 500 x 500% and laid on a raised floor in the same manner as in the example, recoil and associated joint opening occurred in about 3 months. This was a practical problem. In addition, when changing the wiring, the layers of glass-mixed paper will peel off, and when re-installing, it will be necessary to peel off the glass-mixed paper that has adhered to the flooring of the raised floor, making it extremely difficult to re-install. there were.

Similarly, the volume resistivity value referred to in the present invention is 5
The resistance value of the conductive base material is the value measured with an ordinary resistance meter.

Further, the resistance value of the synthetic resin layer is the value in the state where each synthetic resin composition is processed into a sheet shape.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an example of the tile-type antistatic flooring material of the present invention.

Claims (1)

[Claims] A conductive base material having a resistance value of 10^0 to 10^5 Ω is laminated on a backing synthetic resin layer having a volume resistivity value of 10^1^1 to 10^6 Ωcm, and a conductive base material having a volume resistivity value of 10^cm is laminated on the conductive base material. ^1^
A tile-type antistatic flooring material in which surface layers of 1 to 10^6 Ωcm are laminated, and the volume resistivity of the laminate is 10^1^1 to 10^6 Ωcm.