JPH0430506B2 - - Google Patents

Description

[Detailed description of the invention]

(Field of Industrial Application) The present invention relates to an antistatic tile flooring material that is applied to the floors of semiconductor assembly factories, hospital operating rooms, clean rooms, computer rooms, other factories, offices, general households, etc. It is. (Prior art) As mentioned above, floor materials made of aluminum or stainless steel have been used for floors in rooms where static electricity should not be charged or generated, but they are hard and not only cause problems such as walking noise and vibration. However, in recent years, long soft vinyl flooring materials with conductive or antistatic properties have been developed, and this type of flooring material has come into widespread use. Ivy. (Problem to be solved by the invention) However, with the recent increase in the introduction of OA equipment, wiring is often changed.
It is common practice to route these signal cables along the surface of the flooring, take longer cables in case you need to change the wiring, and gather up the excess cable wires in a messy manner on the flooring surface behind the OA equipment. Not only did it look bad, but the wiring on the surface of the flooring material had the disadvantage that the cables could get caught on your feet while walking. In order to improve this drawback, various types of raised floors have been developed in recent years, and these raised floors usually have a double floor structure with another layer formed on top of the original subfloor, and the gap between the subfloor and the floor. The space is designed to accommodate power cables, communication cables, network equipment, etc. Basically,
A support for forming a floating floor with dimensions of 450 x 450 to 500 x 500 m/m and a floor plate serving as a subfloor for the floating floor form one unit. This unit is laid out on the floor, cables, network equipment, etc. are stored in the space formed as described above, and a flooring material as a floor covering material is pasted onto the floorboard. This has the advantage that cables and the like are not routed on the surface of the floor material, giving a good appearance, and when changing the wiring, the floor plate of the unit can be removed and the wiring changed easily. Tile-shaped flooring materials such as carpet tiles and PVC tiles that have been treated with antistatic treatment are used as floor covering materials for raised access floors.
In the case of carpet tiles, the surface layer is made up of fibers, so it gets dirty very easily, and the only way to remove stains is dirt, dust, and other food and drink residue, which not only makes the carpet look bad, but also makes it difficult to use for office equipment. This method has drawbacks such as the tendency to generate dust such as dirt and dust attached to the tile carpet and fiber waste generated from the tile carpet itself, which can cause malfunctions. On the other hand, PVC tiles contain a large amount of powdered inorganic filler to ensure dimensional stability and cost, so they are extremely brittle and the joints may break during use, or the added filler may wear out due to wear. This dust may come out and cause malfunctions in OA equipment, or may warp (if it expands) or open the joints due to expansion and contraction due to temperature changes in the usage environment due to insufficient dimensional stability. (In case of shrinkage), this problem is likely to occur (particularly when flooring is installed using a pressure-sensitive adhesive to facilitate wiring changes after a raised floor has been installed). (Means for Solving the Problems) The tile-type antistatic flooring material 1 of the present invention has a backing synthetic resin layer 2 having a volume resistivity value of 10 ¹¹ to 10 ⁶ Ωcm,
Conductive base material 3 that is non-stretchable and has a resistance value of 10 ⁰ to ^{10 5} Ω
A synthetic resin surface layer 4 containing 0 to 100 parts by weight of filler per 100 parts by weight of resin and having a volume resistivity of 10 ¹¹ to 10 ⁶ Ωcm is formed on the conductive base material 3. The volume resistivity of the laminate is
10 ¹¹ to 10 ⁶ Ωcm. The backing synthetic resin layer 2 having a volume resistivity value of 10 ¹¹ to 10 ⁶ Ωcm is formed from a synthetic resin composition mixed with one or more of an antistatic plasticizer, an antistatic agent, and a conductive substance, and may be a single layer. However, it may be configured in multiple layers. In addition, this layer may be a foamed layer or a non-foamed layer, and in the case of multiple layers, there is no problem in combining non-foamed layers or foamed layers, or a combination of a non-foamed layer and a foamed layer. It is. The synthetic resin may be any commonly used synthetic resin such as vinyl chloride resin, acrylic resin, vinyl acetate resin, polyethylene, polypropylene, ethylene-vinyl acetate copolymer resin, urethane resin, etc., but especially vinyl chloride resin. Resins are preferred. In the present invention, the vinyl chloride resin refers to polyvinyl chloride resin, vinyl chloride and other monomers,
For example, ethylene, vinyl acetate, vinyl ether,
In addition to copolymers with maleic acid esters, acrylics, urethanes, etc., it also includes blends of polyvinyl chloride resins and other polymers. Antistatic plasticizers include tributoxyethyl phosphate (TBXP, manufactured by Daihachi Chemical), butyl diglycol adipate (BXA, manufactured by Daihachi Chemical), Sansocizer C-1100 (manufactured by Shinnihon Rika), SE-
673, SE-172, SE-871 (manufactured by Riken Vitamin Oil) are preferable, and one of general-purpose plasticizers such as dioctyl phthalate, dibutyl phthalate, butylpenzyl phthalate, dioctyl adipate, dihexyl phthalate, diisononyl phthalate, etc. Use with partial or complete replacement. The blending amount is preferably 5 to 100 parts by weight per 100 parts by weight of the synthetic resin. Antistatic agents include cationic, anionic,
Any commonly used antistatic agent such as nonionic antistatic agent may be used, and the amount thereof is preferably 0.2 to 10 parts by weight per 100 parts by weight of the synthetic resin. Carbon powder and short fibers are used as conductive substances.
silver, copper, nickel, aluminum, stainless steel,
In addition to metal powders such as iron and short fibers, inorganic fibers with surface conductivity treatment and inorganic fillers with conductivity treatment (conductive calcium carbonate T130-250: manufactured by Nitto Funka,
Antistatic calcium carbonate EC-1, EC-5: manufactured by Maruo Calcium, etc.) Organic powder or short fibers, etc. (Dentor WK-100S: manufactured by Otsuka Chemical, Thunderon SS
-N: made by Nippon Kage Sensing Co., Ltd.) can be used, the conductive powder preferably has a particle size of 0.5 to 1000 μm, and the conductive short fiber preferably has a diameter of 1 to 600 μm and a length of 0.5 to 20 m/m. In addition, the blending amount needs to be set appropriately depending on the desired resistance value, but in the case of conductive powder, it should be added at least 5 parts by weight per 100 parts by weight of resin, and in the case of short fibers, it should be added at least 2 parts by weight. is preferred. The above antistatic plasticizers, antistatic agents, and conductive substances may be used alone or in combination of two or more. Other plasticizers, stabilizers, etc. as necessary.
Usual additives such as fillers, blowing agents, antifungal agents, colorants, etc. can be used. As the conductive base material 3, one or at least two of inorganic or organic fibers such as natural animal or vegetable fibers, asbestos, glass fibers, rock wool, pulp, and synthetic fibers commonly used as base materials for flooring materials can be used. Woven fabrics, knitted fabrics, non-woven fabrics made by mixing more than one species,
In addition to base materials such as paper that are impregnated with conductive resin liquid, conductive fibers and powders such as those mentioned above, and conductive treated powders and fibers are It is possible to use woven or knitted fabrics in which conductive fibers or conductive treated fibers such as those described above are woven or knitted, and which are highly non-stretchable. Among them, nonwoven fabrics and papers (glass mixed paper, inorganic paper, glass fiber paper, etc.) mixed with carbon fibers and powder during paper making are particularly suitable as base materials for flooring materials in terms of dimensional viscosity and cost. The synthetic resin surface layer 4 having a volume resistivity value of 10 ¹¹ to 10 ⁶ Ωcm is formed from a synthetic resin composition containing one or more of an antistatic plasticizer, an antistatic agent, and a conductive substance, and may be a single layer. It may be configured in multiple layers. In the case of a multilayer structure, it may be composed of an uppermost layer 5 and an intermediate layer 6 located below it, and a printed layer 7 may be interposed between the upper layer 5 and the intermediate layer 6. When the printed layer 7 is interposed, the upper layer 5 needs to be transparent. The intermediate layer 6 may be a foamed layer or a non-foamed layer, but if the flooring material is required to have cushioning properties, it is preferably a foamed layer. or,
This surface layer may be formed from a synthetic resin chip partially using a conductive chip. Synthetic resins and antistatic plasticizers, antistatic agents,
The conductive material that forms the aforementioned backing synthetic resin layer 2 can be used, and the amount can be used in the same manner. However, since powdery or fibrous solid fillers tend to generate dust due to abrasion, in the present invention, it is necessary to add 100 parts by weight or less of this filler to 100 parts by weight of the resin. Regarding the thickness of each layer constituting the flooring material of the present invention, the synthetic resin surface layer 4 preferably has a thickness of 0.1 to 3 m/m, the conductive base material 3 has a thickness of 0.2 to 2 m/m, and the backing synthetic resin layer 2 has a thickness of 0.2 to 3 m/m. 2 m/m, and the total thickness of the floor material in which these layers are laminated is preferably in the range of 1 to 4 m/m. Further, when the synthetic resin surface layer 4 is a multilayer, the thickness of the uppermost layer 5 is preferably 0.1 to 1 m/m. If the thickness of the top layer 5 is less than 0.1 m/m, it will easily wear out during use and become unusable in a short time, and if the thickness exceeds 1 m/m, the flooring will warp toward the surface. This is undesirable because it is easy to use and expensive. If the thickness of the synthetic resin surface layer 4 is less than 0.1 m/m, it is undesirable for the same reason as the above-mentioned top layer 5, and if the thickness exceeds 3 m/m, the flooring material will warp toward the surface side. This is not preferable because it increases the distance to the conductive substrate and reduces the antistatic performance. The thickness of the conductive base material 3 is 0.2m/
If the thickness is less than 2 m, the strength will be weak, especially if the synthetic resin backing layer is a foam layer, and the base material may break due to local loads, reducing the antistatic performance.
If it exceeds m/m, the antistatic performance will improve, but the price will become very high and it will not be economical. If the thickness of the backing synthetic resin layer 2 is less than 0.2 m/m, the flooring material tends to warp toward the surface, and if the thickness exceeds 2 m/m, the distance to the conductive base material increases, resulting in poor antistatic performance. This is undesirable as it reduces the Next, when installing the tile-type antistatic flooring of the present invention, it is necessary to use a construction adhesive, but in this case, an antistatic or conductive adhesive or a regular flooring material The adhesives used for construction are synthetic rubber latex type (including pressure sensitive type), acrylic emulsion type (including pressure sensitive type),
Adhesives such as ethylene-vinyl acetate copolymer, vinyl acetate, etc. that can impart antistatic performance by transferring antistatic plasticity, antistatic agent, etc. in the flooring material to the adhesive layer are preferred. In addition, when installing with an adhesive that is not antistatic or conductive, conduction in the layer direction can be inhibited by using a bag-applying method that adheres only the periphery of the tile flooring material, or a method that partially adheres it. It can be constructed without any (Functions and Effects) The tile-type antistatic flooring material of the present invention has a layer constituting its surface that contains 0 to 100 parts by weight of filler per 100 parts by weight of resin, which is higher than that of conventional PVC tiles. Since the synthetic resin surface layer 4 does not contain any or a small amount of filler, it is not brittle and prevents damage to the joints during use. Unlike PETSU, there are no exposed fibers on the surface,
A non-stretchable conductive base material 3 that does not expand or contract due to temperature changes in the environment in which the flooring material is used is laminated under the synthetic resin surface layer to prevent the generation of dust that may cause malfunctions of OA equipment. This prevents expansion and contraction of the flooring material, and by laminating the backing synthetic resin layer 2 under the conductive base material, it faces the synthetic resin surface layer through the conductive base material. In addition to suppressing warpage toward the front side due to shrinkage of the synthetic resin surface layer, the back side of the flooring material does not expose the fibrous base material, so
When rewiring is performed on-site using a pressure-sensitive adhesive, the pressure-sensitive adhesive prevents the base material and the fibrous base material from becoming integrated, and peels off at the interface between the base material and the backing synthetic resin layer. In addition, since no fibrous base material remains on the base, there is no need to remove it, which improves the removability and reinstallation of the flooring material, and does not impair the functionality of the raised floor. be. Note that the flooring material of the present invention can be attached to the floorboard of a raised floor using the above-mentioned adhesive, completely integrated with the floorboard, and removed together with the floorboard when wiring is changed. In addition, in the tile-type antistatic flooring material of the present invention, the backing synthetic resin layer, the conductive base material, and the synthetic resin surface layer are all antistatic or conductive, so they are electrically conductive in the layer direction. Static electricity can be removed even if contact conduction between adjacent tile flooring materials is incomplete, and conduction occurs in the layer direction and horizontal direction when adjacent tile flooring materials are in contact. Static electricity can be removed more effectively. Of course, the flooring material of the present invention can be attached to the floorboard of a raised floor using the adhesive described above.
It is also possible to completely integrate with the floorboards and remove the flooring together with the floorboards when changing wiring. (Example) Next, examples of the present invention will be given, but the present invention is not limited thereto in any way. Conductive glass mixed paper (resistance value: 1.5×10 ² Ω, thickness: 0.4 m/m), and the foamable vinyl chloride resin paste () described in Table 1 was applied to the surface of the conductive glass mixed paper at 0.4 m/m.
After applying the coating to a thickness of PVC resin paste ()
After coating to a thickness of 0.3m/m, heat at 210℃ for 1 minute.
The foamable vinyl chloride resin paste was foamed by heating for 40 seconds to obtain a sheet having a total thickness of 1.8 m/m and having a printed pattern and an uneven pattern that matched each other. Thereafter, the backing vinyl chloride resin paste () shown in Table 1 is applied to the back surface of the sheet, that is, the surface opposite to the surface to which the expandable vinyl chloride resin paste is applied, at a thickness of 0.5 m/m. Heating conditions that do not foam or melt the foam layer and vinyl chloride resin transparent layer, i.e. 150
The mixture was gelatinized by heating at °C for 2 minutes and 30 seconds to obtain a 2.3 m/m flooring material. The volume resistivity value of this flooring material is 7.7×10 ¹⁰
Ωcm, and the charging property according to JIS L 1021 Stroll method is (+) 0.17KV at 20℃×40%RH, and 20℃×
It was found to have excellent antistatic properties with (+) 0.21KV at 20%RH.

【table】

[Table] The flooring material obtained in this way was cut into a size of 500 x 500 m/m and laid on a raised floor using an acrylic emulsion pressure-sensitive adhesive (Peel Bond manufactured by Sumitomo 3M). , has excellent static electricity removal properties, does not cause joint opening or warping due to expansion and contraction of the flooring material, and can be easily peeled off from the interface between the construction adhesive and the lining vinyl chloride resin layer 2 when changing wiring, and the construction adhesive remains stable even when re-installation. The finish was good just by pressing the flooring onto the adhesive. (Comparative example) Glass mixed paper, which is commonly used as a base material for flooring, was used, and 0.58% of the expandable vinyl chloride resin paste () described in Table 2 was applied to the surface of the glass mixed paper.
After coating to a thickness of m/m and gelling by heating at 180°C for 1 minute, multicolor printing was performed using printing ink that partially contained a foaming inhibitor, and then Table 2 was applied to the surface.
After applying the transparent vinyl chloride resin paste () described in 2018 to a thickness of 0.3 m/m, the foaming temperature of the foamable vinyl chloride resin paste composition
Heating was carried out at 210°C for 1 minute and 50 seconds to obtain a flooring material with a total thickness of 2.3 m/m and a matching printed pattern and uneven pattern. The volume resistivity value of this flooring material is 2.0×10 ¹² Ωcm, which is JIS L
1021Charging property by Stroll method is 20℃ x 40%RH
(+) 1.65KV and (+) at 20℃×20%RH
It was 2.03KV and easily charged.

[Table] When the flooring material obtained in this way was cut into a size of 500 x 500 m/m and laid on a raised floor in the same manner as in the example, warping and resulting joint opening occurred in about 3 months. This caused problems in practical use. In addition, when changing the wiring, the layers of glass-mixed paper will peel off, and when re-installing, it will be necessary to peel off the glass-mixed paper that has adhered to the flooring of the raised floor, making it extremely difficult to re-install. It was hot. In addition, the volume resistivity value as used in the present invention is a value measured with a SM-10E ultra-super insulation meter manufactured by Toa Denpa Kogyo, and the resistance value of the conductive base material is a value measured at two points with an ordinary resistance meter. The value is between. Further, the resistance value of the synthetic resin layer is the value in the state where each synthetic resin composition is processed into a sheet shape.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an example of the tile-type antistatic flooring material of the present invention. DESCRIPTION OF SYMBOLS 1... Tile-type antistatic flooring material, 2... Backing synthetic resin layer, 3... Conductive base material, 4... Surface layer, 5
...Top layer, 6...Middle layer, 7...Printing layer.

Claims (1)

[Claims] 1 A non-stretchable conductive base material having a resistance value of 10 ⁰ to 10 ⁵ Ω is laminated on a backing synthetic resin layer having a volume resistivity of 10 ¹¹ to 10 ⁶ Ωcm, and a resin layer is placed on the conductive base material. 100
Contains 0 to 100 parts by weight of filler based on parts by weight,
A tile-type antistatic flooring material in which a synthetic resin surface layer having a volume resistivity of 10 ¹¹ to 10 ⁶ Ωcm is laminated, and the laminate has a volume resistivity of 10 ¹¹ to 10 ⁶ Ωcm.