JP2003090123A - Synthetic resin-made conductive floor material - Google Patents
Synthetic resin-made conductive floor materialInfo
- Publication number
- JP2003090123A JP2003090123A JP2001280779A JP2001280779A JP2003090123A JP 2003090123 A JP2003090123 A JP 2003090123A JP 2001280779 A JP2001280779 A JP 2001280779A JP 2001280779 A JP2001280779 A JP 2001280779A JP 2003090123 A JP2003090123 A JP 2003090123A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- layer
- synthetic resin
- conductive material
- floor material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Floor Finish (AREA)
- Synthetic Leather, Interior Materials Or Flexible Sheet Materials (AREA)
Abstract
Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、表層に隣接する領
域層に、線状、格子状または網状の導電材料を埋め込ん
だ合成樹脂製導電性床材に関する。
【０００２】
【従来の技術】実願昭５２−７５２３０号マイクロフィ
ルムによれば、図１に示すように、接地用金属細帯など
の導電性材料２をプラスチック製タイル１と一体化した
静電防止タイルが提案されているが、このような形で導
電性部分を設けることは、床タイルの意匠にいちじるし
い制約を受けることになる。
【０００３】このような事情から、本出願人は先に特開
２０００−１９７７号により、シート状基材上に、表面
抵抗率が１０３〜１０５Ω・ｃｍの導電塗料層または導
電樹脂層よりなる中間層を、さらにその上に体積抵抗値
１０５〜１０９Ω・ｃｍの帯電防止層よりなる表面層を
設けた合成樹脂製シートと、それに貫通孔を設け、該貫
通孔に導電性端子を挿入することをそれぞれ提案してい
る。しかし、この技術もシート状の導電塗料層または導
電樹脂層を使用するので、コストが高い。また、中間層
と上下の層の接着性も留意しないと層間剥離などの問題
も生じやすい。
【０００４】前記考案や発明の流れは、いずれも導電性
の層を床材中に存在させるという考え方を一歩もでるも
のではない。そして、本出願人の発明のように合成樹脂
製積層床材の１つまたは２つの層を導電性とする場合、
使用する合成樹脂と導電材料を混合してなる導電性層の
薄膜化にはどうしても限界があるためコスト高となるこ
とは避けられなかった。
【０００５】
【発明が解決しようとする課題】そこで、本発明の目的
は、前記先行技術より一層簡単な手段で目的とする帯電
防止を達成できる合成樹脂製床材を提供する点にある。
【０００６】
【課題を解決するための手段】本発明は、表層に隣接す
る領域層に、線状、格子状または網状の導電材料を埋め
込んだ合成樹脂製導電性床材であって、前記導電材料の
体積固有抵抗値が表層の体積固有抵抗値より１桁以上低
い値をもつことを特徴とする合成樹脂製導電性床材に関
する。
【０００７】合成樹脂製床材には、全体が均一組成の単
層構成のものと、表面層と下層との組成が異なる積層構
成のものとがあるが、本発明はいずれのタイプのものに
も適用できる。積層タイプの場合は、上層と下層との間
に前記導電材料を埋め込めばよいが、単層の場合には、
これを上下に分けて、その間に前記導電材料を埋め込む
ことになる。このような埋め込み部位を請求項では表層
に隣接する領域層と表現している。なお、いずれのタイ
プの場合においても、上層の厚みは、通常０．１〜１．
０ｍｍ、好ましくは０．３〜０．５ｍｍである。
【０００８】前記上層の体積固有抵抗値は通常１０６〜
１０９Ω・ｃｍ程度であるので、本発明の導電材料は通
常それより１桁以上低い１０５〜１０８Ω・ｃｍ程度の
範囲で設定するが、これより低い値であってもよいこと
は当然である。
【０００９】前記線状または網状の導電材料としては、
金属線、金網、炭素繊維、炭素繊維布、炭素繊維不織
布、炭素繊維製網、導電性インクでの線状印刷、格子状
印刷あるいは網目状印刷、導電材料や帯電防止剤（界面
活性剤など）を練りこんだ樹脂よりなる繊維、ひも、網
状物などを挙げることができる。
【００１０】本発明では、導電材料がフィルムのように
上下を遮蔽する層を構成していないため、その隙間から
直接上下層の樹脂をラミネートすることができるので、
樹脂と接着性や親和性のない導電材料の組合せでも何の
問題もなく使用できるという大きなメリットが生ずる。
線状、格子状、網状の導電性材料は、幅０．１〜２０ｍ
ｍ、好ましくは０．５〜１０ｍｍ、間隔は０．５〜１０
０ｍｍ、好ましくは１０〜５０ｍｍ、厚さは５〜５００
μｍ、好ましくは２０〜３００μｍが適当である。また
導電性材料は必要に応じてアースをとるとよい。また、
本発明は、タイル状床材にもシート状床材のいずれにも
適用できる。
【００１１】本発明においては、床材の表面抵抗値が改
善される。その理由は以下のように考えられる。まず、
床材表層の表面固有抵抗をρＳ１、体積固有抵抗をρ
Ｖ１、厚みをＭとし、導電性材料の表面固有抵抗をρ
Ｓ２とする。ＪＩＳ Ｋ ６９１１の測定方法によれば
表面抵抗は、図１に示すとおり電極ＡＤ間（電極間距離
をＬとする）で測定される。表層単体の表面抵抗をＲと
するとＲは、
【数１】Ｒ＝ρＳ１・Ｌ
で表される。一方、導電性材料を積層した場合の表面抵
抗をｒとし、電流がＡＢＣＤの経路で流れるものとする
と、表面抵抗ｒは、
【数２】ｒ＝ρＶ１・２Ｍ＋ρＳ２・Ｌ
となる。ここで、Ｌ＝１０ｍｍ、Ｍは通常Ｍ≦１．０ｍ
ｍである。ここで、ρＳ２≦１／１０ρＳ１（なぜなら
体積固有抵抗値を１／１０以下にすれば、当然表面固有
抵抗値も１／１０以下となる）、またρＶ１・２Ｍの項
は、Ｍ≦１．０ｍｍであるので、厚み的にＬ＝１０に対
して１／１０以下となるので、無視してさしつかえな
い。よって、
【数３】ｒ≦１／１０ρ１・Ｌ≦１／１０Ｒ
となる。電気は、通常抵抗の低い経路を流れるので、本
床材の場合Ａ→Ｂ→Ｃ→Ｄの経路で流れることにより、
Ａ−Ｄ間の表面抵抗はみかけ上低くなるものと考えられ
る。
【００１２】
【実施例】以下に実施例を挙げて本発明を説明するが、
本発明はこれにより何ら限定するものではない。
【００１３】
実施例１
＜上層タイル成分組成＞
ポリ塩化ビニル ５０．０重量％
ジオクチルフタレート（可塑剤） １２．０重量％
炭酸カルシウム（充填剤） ２７．０重量％
導電可塑剤 １０．０重量％
安定剤 １．０重量％
＜下層タイル成分組成＞
ポリ塩化ビニル ２３．０重量％
ジオクチルフタレート（可塑剤） １３．０重量％
炭酸カルシウム（充填剤） ６０．０重量％
帯電防止剤 ３．０重量％
安定剤 １．０重量％
【００１４】前記成分組成の下層タイル成分を混練して
得られた下層シート（厚さ１．５ｍｍ）上に、カーボン
ブラックを主体とするエマルジョンタイプの導電性イン
クを用いて格子状模様にスクリーン印刷した。これを１
２０℃のオーブン中で２分間乾燥する。ついで、前記成
分組成の上層タイル成分を混練して得られた上層シート
（厚さ０．５ｍｍ）を前記格子状模様を印刷した下層シ
ート上に熱ラミネートした。
【００１５】得られた製品（厚さ２．０ｍｍ）は、２０
℃、４０％ＲＨ雰囲気下（２４時間養生）で測定（ＪＩ
Ｓ Ｋ ６９１１）したときの、表面抵抗値が８．０×
１０ ６Ωであった。なお、上層のみを同様にして測定し
たときの表面抵抗値は４．０×１０８Ω、体積抵抗値は
２．０×１０６Ω、導電性インクの表面抵抗値は１．０
×１０４Ωであった。
【００１６】
【発明の効果】（１）本発明は、極めて簡単な構造で高
い帯電防止効果を達成することができた。
（２）導電材料を層として設けることをしないので、導
電材料の使用量が激減するため、コストを低く抑えるこ
とができる。
（３）導電材料を線状、格子状または網状で使用するの
で、上や下の樹脂層と導電材料との間に接着性や親和性
がなくても、導電材料の隙間を通して、上と下の樹脂層
が融合できるという利点がある。そのため導電材料選択
の自由度が飛躍的に向上した。DETAILED DESCRIPTION OF THE INVENTION
[0001]
BACKGROUND OF THE INVENTION The present invention relates to a region adjacent to a surface layer.
Embed a linear, lattice, or mesh conductive material in the area layer
The present invention relates to conductive flooring made of synthetic resin.
[0002]
2. Description of the Related Art Japanese Patent Application No. 52-75230
According to Lum, as shown in Fig. 1, a metal strip for grounding
Conductive material 2 was integrated with plastic tile 1
Antistatic tiles have been proposed, but are
Providing an electrically conductive part is very different from the floor tile design.
Restrictions.
[0003] Under such circumstances, the present applicant has previously disclosed
According to 2000-1977, a surface is formed on a sheet-like substrate.
10 resistivity3-105Ω · cm conductive paint layer or conductive
An intermediate layer consisting of an electric resin layer, and a volume resistance value
105-109A surface layer consisting of an antistatic layer of Ωcm
The synthetic resin sheet provided, and a through hole provided in the sheet,
It is proposed to insert conductive terminals into through holes respectively.
You. However, this technique also requires a sheet of conductive paint layer or conductive
The cost is high because the resin layer is used. Also the middle layer
If you do not pay attention to the adhesiveness of the upper and lower layers, problems such as delamination
Is also likely to occur.
[0004] All of the above ideas and the flow of the invention are conductive.
The idea of having a layer of wood in the flooring
Not. And, like the applicant's invention, synthetic resin
If one or two layers of the laminated flooring made of electricity are conductive,
The conductive layer made by mixing the synthetic resin used and the conductive material
There is a limit to thinning, so costs will increase.
And was inevitable.
[0005]
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above problem.
Is the desired charging method by simpler means than the prior art.
An object of the present invention is to provide a synthetic resin flooring material that can achieve prevention.
[0006]
SUMMARY OF THE INVENTION The present invention is directed to a method for adhering to a surface layer.
Line, grid or mesh conductive material
Embedded synthetic resin conductive floor material, wherein the conductive material
Volume resistivity is lower by at least one order of magnitude than surface resistivity
The conductive flooring made of synthetic resin,
I do.
[0007] Synthetic resin flooring has a simple composition that is entirely uniform.
Layered structure and laminated structure with different composition of surface layer and lower layer
The present invention is applicable to any type
Is also applicable. In the case of multilayer type, between upper layer and lower layer
Although the conductive material may be embedded in a single layer,
This is divided into upper and lower parts, and the conductive material is embedded between them.
Will be. In the claims, such an embedded portion is a surface layer.
Is expressed as a region layer adjacent to. Any Thai
Also in the case of a loop, the thickness of the upper layer is usually 0.1 to 1.
0 mm, preferably 0.3 to 0.5 mm.
The volume resistivity of the upper layer is usually 106~
109Ωcm, the conductive material of the present invention is generally used.
10 which is at least one digit lower than usual5-108Ωcm
Set in range, but lower value may be used
Is natural.
As the linear or net-like conductive material,
Metal wire, wire mesh, carbon fiber, carbon fiber cloth, non-woven carbon fiber
Cloth, carbon fiber net, linear printing with conductive ink, grid
Printing or mesh printing, conductive materials and antistatic agents (interface
Fibers, cords, and nets made of resin mixed with activator
And the like.
[0010] In the present invention, the conductive material such as a film
Because there is no layer that shields the top and bottom,
Since the upper and lower resin layers can be directly laminated,
No matter what the combination of resin and conductive material with no adhesive or affinity
There is a great merit that it can be used without any problems.
Linear, lattice, and mesh conductive materials have a width of 0.1 to 20 m.
m, preferably 0.5 to 10 mm, with an interval of 0.5 to 10
0 mm, preferably 10 to 50 mm, thickness 5 to 500
μm, preferably 20 to 300 μm, is suitable. Also
The conductive material may be grounded as needed. Also,
The present invention is applicable to both tile flooring and sheet flooring.
Applicable.
In the present invention, the surface resistance of the flooring material is improved.
Be improved. The reason is considered as follows. First,
Let ρ be the surface resistivity of the floor materialS1, The volume resistivity is ρ
V1, The thickness is M, and the surface resistivity of the conductive material is ρ
S2And According to the measurement method of JIS K 6911
The surface resistance is measured between the electrodes AD (the distance between the electrodes) as shown in FIG.
Is L). The surface resistance of the surface layer alone is R
Then R
## EQU1 ## R = ρS1・ L
It is represented by On the other hand, surface resistance when conductive materials are laminated
Let r be the resistance, and let the current flow through the ABCD path
And the surface resistance r is
## EQU2 ## r = ρV1・ 2M + ρS2・ L
It becomes. Here, L = 10 mm, M is usually M ≦ 1.0 m
m. Where ρS2≤ 1/10 ρS1(Because
If the volume resistivity is reduced to 1/10 or less, the surface
The resistance value is also 1/10 or less.V1・ 2M term
Is less than L = 10 because M ≦ 1.0 mm.
It will be less than 1/10, so you can ignore it
No. Therefore,
Equation 3 r ≦ 1 / 10ρ1・ L ≦ 1 / 10R
It becomes. Electricity usually flows through a path with low resistance.
In the case of flooring, by flowing in the route of A → B → C → D,
The surface resistance between A and D is considered to be apparently low.
You.
[0012]
The present invention will be described below with reference to examples.
The present invention is not limited thereby.
[0013]
Example 1
<Upper layer tile component composition>
50.0% by weight of polyvinyl chloride
Dioctyl phthalate (plasticizer) 12.0% by weight
Calcium carbonate (filler) 27.0% by weight
Conductive plasticizer 10.0% by weight
1.0% by weight of stabilizer
<Lower-layer tile component composition>
23.0% by weight of polyvinyl chloride
Dioctyl phthalate (plasticizer) 13.0% by weight
Calcium carbonate (filler) 60.0% by weight
Antistatic agent 3.0% by weight
1.0% by weight of stabilizer
[0014] The lower layer tile component of the above component composition is kneaded.
On the obtained lower sheet (thickness: 1.5 mm), carbon
Emulsion type conductive ink mainly composed of black
Screen printing was carried out using a grid. This one
Dry in an oven at 20 ° C. for 2 minutes. Then,
Upper layer sheet obtained by kneading the upper layer tile component
(Thickness: 0.5 mm) is printed on the lower layer
It was heat laminated on a plate.
The obtained product (2.0 mm thick) has a thickness of 20 mm.
C., 40% RH atmosphere (cured for 24 hours) (JI
SK 6911), the surface resistance was 8.0 ×
10 6Ω. Note that only the upper layer was measured in the same manner.
Is 4.0 × 108Ω, volume resistance is
2.0 × 106Ω, the surface resistance of the conductive ink is 1.0
× 104Ω.
[0016]
(1) The present invention has a very simple structure and a high
A good antistatic effect could be achieved.
(2) Since conductive material is not provided as a layer,
Because the use of electrical materials is drastically reduced, costs can be kept low.
Can be.
(3) The conductive material is used in the form of a line, a lattice or a net.
Adhesion and affinity between the upper and lower resin layer and conductive material
The upper and lower resin layers
There is an advantage that can be fused. Therefore, select the conductive material
The degree of freedom has been dramatically improved.
【図面の簡単な説明】
【図１】床材の表面抵抗値を測定する方法を説明するた
めの床材断面と電極の配置関係を示す図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing a floor material cross section and an arrangement relationship of electrodes for explaining a method of measuring a surface resistance value of a floor material.
Claims (1)
または網状の導電材料を埋め込んだ合成樹脂製導電性床
材であって、前記導電材料の体積固有抵抗値が表層の体
積固有抵抗値より１桁以上低い値をもつことを特徴とす
る合成樹脂製導電性床材。Claims: 1. A synthetic resin conductive flooring in which a linear, lattice or net-like conductive material is embedded in a region layer adjacent to a surface layer, wherein the conductive material has a volume resistivity. A conductive resin flooring made of synthetic resin, having a value that is at least one digit lower than the volume resistivity of the surface layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001280779A JP2003090123A (en) | 2001-09-14 | 2001-09-14 | Synthetic resin-made conductive floor material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001280779A JP2003090123A (en) | 2001-09-14 | 2001-09-14 | Synthetic resin-made conductive floor material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003090123A true JP2003090123A (en) | 2003-03-28 |
Family
ID=19104712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001280779A Pending JP2003090123A (en) | 2001-09-14 | 2001-09-14 | Synthetic resin-made conductive floor material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003090123A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013011457A (en) * | 2011-06-28 | 2013-01-17 | Hioki Ee Corp | Electrode device for resistance measurement and resistance measurement system |
| JP2017031700A (en) * | 2015-08-03 | 2017-02-09 | 住友ゴム工業株式会社 | Antistatic floor and building comprising the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4941825U (en) * | 1972-07-14 | 1974-04-12 | ||
| JPS6340054A (en) * | 1986-08-04 | 1988-02-20 | アキレス株式会社 | Tile type antistatic floor material |
| JPS64397A (en) * | 1987-03-13 | 1989-01-05 | Nippon Denso Co Ltd | Blower fan |
| JP2000001977A (en) * | 1998-06-15 | 2000-01-07 | Tajima Inc | Electrification preventive synthetic resin floor material |
-
2001
- 2001-09-14 JP JP2001280779A patent/JP2003090123A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4941825U (en) * | 1972-07-14 | 1974-04-12 | ||
| JPS6340054A (en) * | 1986-08-04 | 1988-02-20 | アキレス株式会社 | Tile type antistatic floor material |
| JPS64397A (en) * | 1987-03-13 | 1989-01-05 | Nippon Denso Co Ltd | Blower fan |
| JP2000001977A (en) * | 1998-06-15 | 2000-01-07 | Tajima Inc | Electrification preventive synthetic resin floor material |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013011457A (en) * | 2011-06-28 | 2013-01-17 | Hioki Ee Corp | Electrode device for resistance measurement and resistance measurement system |
| JP2017031700A (en) * | 2015-08-03 | 2017-02-09 | 住友ゴム工業株式会社 | Antistatic floor and building comprising the same |
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