JP2003253822A - Sheet waterproof structure, sheet waterproof method, and sheet waterproof member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide sheet waterproof heat insulating structure for surely joining and fixing a waterproof sheet to a joining plate by high-frequency welding and surely performing a pinhole inspection after the construction. <P>SOLUTION: A heat insulating layer 20 is formed by laying heat insulating materials 21 on a roof substrate 10. A semiconductor layer 30 is formed by laying a semiconductive sheet 31 with a surface resistivity (resistivity) of 0.1-10E+9 Ω in conformity to JISK6911 or JISK7194 on the heat insulating layer 20. The sheet joining plate 50 is disposed on the semiconductor layer 30 and fixed to the roof substrate 10 by a fixing means 55. The waterproof sheet 40 is tensely disposed on the semiconductor layer 30 to cover the sheet joining plate 50. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet waterproof structure in which a waterproof sheet is applied to a building frame by an insulation method or the like, a sheet waterproof method, and a semi-conductive sheet or semi-conductive sheet adopted in the structure or the like. The present invention relates to a sheet waterproof member such as a layer-covered heat insulating material.

[0002]

2. Description of the Related Art When waterproofing the surface of a building frame such as a roof of a building or a roof of a house with a waterproof sheet,
A plurality of sheet joining plates are fixed in a scattered state on the body surface, a waterproof sheet is stretched over the body surface, and the portion of the waterproof sheet corresponding to each sheet joining plate is a resin coating layer of the sheet joining plate. An insulating method is well known in which joining and integration are performed.

Conventionally, as a method of joining and integrating a waterproof sheet and a sheet joining plate, a method of welding with hot air or a solvent, a method of adhering with an adhesive, etc. are mainly used. However, in the method using hot air, it is difficult to blow the heat with high positional accuracy, and heat may be applied to the periphery of the joint, which may have an adverse effect on the periphery of the joint. Further, in the method using a solvent or an adhesive, not only is the work of applying these chemicals troublesome, but depending on the chemicals used, there may be cases where volatile components that affect the surrounding environment are contained, so It is difficult to obtain high reliability.

Therefore, Japanese Patent Publication No. 6-99995 and Japanese Patent Laid-Open No. 2000-179103 disclose a technique for welding a waterproof sheet and a sheet joining plate by high frequency induction heating, that is, a technique for so-called high frequency welding. . Since high-frequency welding uses heat generated by high-frequency vibration to perform welding, it has good energy efficiency and almost no heat is generated in the parts other than the sheet joining plate, and the adverse effects of heat in the peripheral parts can be avoided. Since no solvent or adhesive is used, it does not affect the surrounding environment.

On the other hand, in the waterproof sheet structure, a pinhole inspection for inspecting whether or not the waterproof sheet is scratched is performed after the sheet is constructed. High voltage flaw detector used for this pinhole inspection (pinhole tester)
Applies a high voltage from the surface side of the waterproof sheet, and when there is a scratch, a current flows through the skeleton due to a discharge phenomenon, and the scratch is found by the discharge phenomenon.

In such a pinhole inspection, an electric current is caused to flow through the scratched portion due to a discharge phenomenon, and therefore it is a prerequisite that a conductor is arranged on the lower surface side of the waterproof sheet.
However, in a heat insulating and waterproof structure in which a heat insulating material such as synthetic resin foam is laid on a concrete skeleton and a waterproof sheet is laid on the heat insulating material, the heat insulating material such as resin foam is non-conductive. Since no current flows, even if there is a scratch on the waterproof sheet, a discharge phenomenon does not occur and the scratch cannot be detected, so it is impossible to perform a pinhole inspection.

In view of this, a technique has been proposed in which the above-described pinhole inspection can be performed in a sheet waterproof heat insulating structure in which a non-conductive heat insulating material is arranged on the lower surface side of the waterproof sheet (JP-A-60- No. 133150, JP-A-6-6
0-138156).

As shown in FIG. 2, this sheet waterproof insulation structure capable of inspecting pinholes has an insulating material (2) laid on a concrete skeleton (1) and an aluminum foil or the like on the insulating material (2). A conductive sheet (3) made of is laid. Further, a sheet joining plate (4) in which a resin coating layer is laminated on the surface of a metal core plate is arranged at a required portion of the conductive sheet (3), and the sheet joining plate (4) is a curl plug or a spread leg nail. It is fixed to the concrete skeleton (1) by a fixing means (4a) such as. Then, the waterproof sheet (5) is stretched over the conductive sheet (3), and the portion of the waterproof sheet (5) corresponding to the joining plate (4) is joined and integrated with the resin coating layer of the joining plate (4). It is what is done.

In this waterproof waterproof structure, when a high voltage is applied from the surface side of the waterproof sheet (5) and the waterproof sheet (5) is damaged, the waterproof sheet (5) passes through the conductive sheet (3) due to a discharge phenomenon. Current flows, the above-described pinhole inspection can be performed without any trouble.

[0010]

However, in the above-mentioned conventional waterproof sheet insulation structure capable of inspecting pinholes, the waterproof sheet (5) is joined and fixed to the sheet joining plate (4) by high frequency welding during its construction. I have a problem that I can't.

That is, in the high frequency welding, the metal core plate of the sheet joining plate (4) is heated to melt the joining plate (4) and the waterproof sheet (5) and to fuse them to each other. If a conductor is arranged around the portion to be heated by high frequency, the conductor is also induction-heated to generate heat, which causes so-called energy loss (power loss). That is, the sheet waterproof insulation structure capable of inspecting pinholes has the conductive sheet (3) arranged on the entire lower surface of the waterproof sheet (5), and therefore, when the sheet joining plate (4) is heated by high frequency, energy consumption is reduced. Due to the loss, heat is also generated from the conductive sheet (3) around the joining plate, and harmful heat deformation occurs in the waterproof sheet (5) around the sheet joining plate. Not only that, due to energy loss, the joint plate (4) itself cannot be efficiently heated, which requires a long time for sheet joining work, resulting in a reduction in work efficiency. As described above, the conventional waterproof sheet insulation structure capable of inspecting pinholes has a problem that the waterproof sheet (5) cannot be joined and fixed to the joining plate (4) by high frequency welding.

The present invention solves the above-mentioned problems of the prior art, makes it possible to securely join and fix the waterproof sheet to the joining plate by high-frequency welding, and allows the pinhole inspection to be accurately performed after construction. An object of the present invention is to provide a sheet waterproofing method and a sheet waterproofing member.

[0013]

Means for Solving the Problems The present inventor has repeatedly conducted meticulous experimental research, and as a result of a waterproof structure for waterproofing a sheet by an insulating method, a non-conductive heat insulating material is provided on the lower surface side of the waterproof sheet. In the arranged structure, by forming a peculiar layer on the heat insulating material, the waterproof sheet can be securely joined and fixed to the joining plate by high frequency welding, and the pinhole inspection can be surely performed. Furthermore, paying attention to the above-mentioned peculiar layer, while conducting detailed analysis of the layer, as a result of earnest efforts, as a result of finding the optimum configuration capable of achieving the above object, the present invention can be achieved. I arrived.

That is, according to the first aspect of the present invention, a sheet joining plate having a coating layer made of a thermoplastic resin on the surface is fixed to the front side of a building frame, and a waterproof sheet made of a thermoplastic resin is used for the sheet joining. A sheet waterproof structure which is stretched over the surface side of the structure body so as to cover the plate, and the cover layer of the sheet joint plate and a waterproof sheet portion corresponding to the cover layer are joined and integrated. There is a surface resistivity (JISK) between the building frame and the waterproof sheet.
6911 or JISK7194) 0.1-10
The gist is that a semiconductive layer of E + 9Ω is provided.

In this sheet waterproof structure, since the semiconductive layer having a high resistance and having a specific structure is provided on the lower surface side of the waterproof sheet, the semiconductive layer is not heated when a high frequency is applied. It is possible to heat only the sheet joint plate with energy efficiency, and by the heating, the resin coating layer of the sheet joint plate and the waterproof sheet can be melted and integrated by welding. That is, the waterproof sheet can be reliably welded and integrated with the sheet joining plate by high frequency welding.

Further, when a high voltage is applied from the surface side of the waterproof sheet, if the waterproof sheet is scratched, a discharge phenomenon occurs, and a current flows through the semiconductive layer, so that the pinhole inspection can be performed accurately. Can be done accurately and accurately.

Here, in the present invention, the surface resistivity is
JISK6911 (surface resistivity) or JISK7194
It is measured according to (resistivity), and any measuring method may be used, but in general, when the surface resistivity is large, the resistance is measured according to JIS K6911 and the resistivity ( When the surface resistivity is small, JISK719
It is customary to measure according to 4.

In the present invention, JISK6911 is used.
Alternatively, the surface resistivity according to JIS K7194 is 0.1
Materials less than Ω are referred to as conductive materials, and materials exceeding 10E + 9Ω are referred to as non-conductive materials. As a reference, J in aluminum foil with a thickness of 7 μm as a conductive material
The surface resistivity according to ISK7194 is 0.01 to
It is about 0.05Ω. In addition, JISK for a polyolefin resin sheet with a thickness of 1 mm as a non-conductive material
The resistivity according to 6911 is 10E + 15 to 10E +
It is about 16Ω.

On the other hand, the second aspect of the present invention specifies an example of a construction method for the waterproof waterproof structure for a sheet related to the first aspect.

That is, according to the second aspect of the present invention, the first step of arranging the heat insulating material on the building frame to form the heat insulating layer and the semiconductivity having a surface resistivity (according to JISK6911 or JISK7194) of 0.1 to 10E + 9Ω A second step of disposing a conductive sheet on the heat insulating layer, and fixing a sheet joining plate having a thermoplastic resin coating layer on the surface thereof to the building frame in a state of being disposed on the semiconductive sheet. A third step, a fourth step of stretching a thermoplastic resin waterproof sheet on the semiconductive sheet in a manner to cover the sheet bonding plate with the sheet, and a high-frequency induction heating process for forming the sheet bonding plate. A gist includes a fifth step of welding and integrating a coating layer and a waterproof sheet portion corresponding to the coating layer.

The third invention specifies a semiconductive sheet applicable to the first and second inventions.

That is, the third aspect of the present invention is a semiconductive sheet disposed between a building frame and a waterproof sheet made of thermoplastic resin, which is laid on the surface side of the building frame, and has a surface resistivity (JISK6911 or The gist is that it is adjusted to 0.1 to 10E + 9Ω according to JIS K7194).

The fourth aspect of the present invention specifies a semiconductive layer-covered heat insulating material applicable to the sheet waterproof heat insulating structure and construction method related to the first and second aspects.

That is, the fourth aspect of the present invention is a semiconductive layer-covered heat insulating material disposed between a building frame and a thermoplastic resin waterproof sheet laid on the surface side thereof, which has a surface resistivity ( The gist is that a semiconductive layer adjusted to 0.1 to 10E + 9Ω according to JISK6911 or JISK7194) is laminated on the surface of the heat insulating material.

The structure of the present invention will be described in detail below with reference to an example.

The sheet waterproof structure of the present invention, for example, as shown in FIG. 1, has a heat insulating layer (20), a semiconductive layer (30) and a waterproof layer (4) on a roof substrate (10) as a building frame.
0) are laminated, and a plurality of sheet bonding plates (50) are fixed in a scattered state at required positions on the semiconductive layer (30).

In the present invention, the roof substrate (10) is made of a concrete plate such as reinforced concrete (RC), lightweight foam concrete (ALC) or precast concrete (RC), and has a slope. The roof shape may be a horizontal flat roof shape without a slope, or an arched roof shape, and the material and shape are not particularly limited. Furthermore,
The roof substrate (10) may be made of a conductive material or a non-conductive material.

Insulating material (21) constituting the insulating layer (20)
As the resin, a resin foam such as a polystyrene resin, a polyvinyl chloride resin, a polyurethane resin, or a polyethylene resin can be preferably used, and among them, a polystyrene resin foam is particularly preferable. It should be noted that these resin foams are non-conductive ones that do not pass an electric current.

The shape of the heat insulating material (21) is not particularly limited, but in consideration of workability, it is preferable to use a panel type having a rectangular shape in plan view.

A large number of this heat insulating material (21) is spread on the roof substrate (10) in a plane to form a heat insulating layer (20).

In the present invention, as the semiconductive layer (30), a semiconductive sheet (31) having high resistance can be preferably used. As this semi-conductive sheet (31), JISK6911 or JISK71
Surface resistance (resistivity) according to 94 is 0.1-10E
It is necessary to use one having a + 9Ω, preferably a lower limit value of 0.4Ω or more and an upper limit value of 10E + 8Ω or less, more preferably a lower limit value of 1.0Ω or more and an upper limit value of 10E + 7Ω or less.

That is, if the surface resistivity is too small, the discharge phenomenon is unlikely to occur and the pinhole inspection may be difficult to perform reliably. On the other hand, if the surface resistivity is too large, energy loss increases when induction heating is performed by high frequency, and it may be difficult to reliably perform high frequency welding.

In the present invention, the semiconductive sheet (31)
Examples include a laminated structure in which a conductive material or the like is laminated on a non-conductive sheet (including film) -shaped carrier made of synthetic resin or the like, a synthetic resin binder, conductive carbon, conductive A single layer structure obtained by molding a resin composition in which a conductive fiber and a conductive material such as metal powder are mixed can be preferably used.

The semiconductive sheet (31) having a laminated structure is obtained by laminating a metal such as aluminum or a metal oxide by vapor deposition on a carrier made of polyester resin such as polyethylene terephthalate (PET), or made of PET. A material obtained by applying (including printing) a coating material containing a conductive material such as conductive carbon, conductive fibers and metal powder on a support and stacking the coating can be preferably used.

In the present invention, the semiconductive sheet (31)
The amount of the conductive material applied, the amount of vapor deposition, the thickness, and the amount of the conductive material compounded may be appropriately adjusted so as to obtain the specific surface resistivity (resistivity).

For example, when aluminum is vapor-deposited on the carrier, the vapor deposition thickness is preferably adjusted to 200 to 2000 Å, preferably the upper limit value is 1000 Å or less, more preferably 800 Å or less. That is, when adjusting within this thickness range, the semiconductive sheet (31) having the above-mentioned specific surface resistivity can be efficiently manufactured.

In the structure shown in FIG. 1, the semiconductive sheet (31) is laid on the heat insulating layer (20) to form the semiconductive layer (30).

In the present invention, the semiconductive layer (3
0) does not necessarily have to be composed of the semiconductive sheet (31). For example, the semiconductive layer coating material containing the resin composition for the semiconductive layer is applied to a nonconductive layer such as a heat insulating layer (20) or a base (10) to form a semiconductive layer (30). You may do it.

A large number of sheet joining plates (50) are arranged in a scattered state at important points on the semiconductive sheet (31).

The sheet joining plate (50) is composed of a resin-coated steel plate or the like in which a resin coating layer is laminated on the upper surface of a metal core plate such as a steel plate.

The covering layer of the sheet joining plate (50) is not particularly limited as long as it is made of a thermoplastic resin, but the same kind of resin as the resin constituting the waterproof sheet (41) to be joined. In particular, it is preferable to use the same resin, which makes it possible to further improve the compatibility between the resins at the time of welding and joining by high-frequency welding or the like, and to make the sheet joining plate (50) and the waterproof sheet (41) compatible. The bonding strength can be further improved. Specific examples of the resin that constitutes the coating layer include polyolefin resins such as polyethylene resin and polypropylene resin, polyvinyl chloride resin, and the like.

Needless to say, in the present invention,
The resin coating layer as described above may be formed on the back surface side of the sheet bonding plate (50).

The sheet-bonding plate (50) is usually in the form of a disc having a central hole, and the semiconductive layer (3
0) In a state of being placed on the roof base (1), fixing means (55) such as open leg nails and curl plugs are inserted into the central hole.
It is fixed to the roof substrate (10) by being fixed to 0).

In the present invention, the fixing means (55)
May be integrally formed with the sheet joining plate (50).

The waterproof sheet (4) which constitutes the waterproof layer (40)
1) is made of a thermoplastic resin, and preferable examples include those made of polyolefin resin such as polyethylene resin and polypropylene resin, and those made of polyvinyl chloride resin. As the waterproof sheet (41), in addition to a single sheet made of a single synthetic resin, a composite sheet in which a plurality of synthetic resins are laminated, or a sheet having a reinforcing layer or the like interposed in the middle may be used. it can.

The waterproof sheet (41) is stretched over the entire semiconductive layer (30) including the sheet joining plate (50) from above, and in that state, the sheet joining plate (50) is covered with a resin. The layer and the portion of the waterproof sheet (41) corresponding thereto are joined and integrated to form the waterproof layer (40).

The waterproof sheet (41) and the sheet joining plate (5
As a method of joining with 0), high frequency welding is preferably used. In this welding method, a high-frequency generator such as a high-frequency horn is placed at the position where the joining plate (50) is arranged on the upper surface side of the waterproof sheet (41) to generate a high frequency.
Thereby, the waterproof sheet (41) and the sheet joining plate (50)
The resin portions that are joined with each other are melted and integrated by welding.

During the high frequency welding, the semiconductive layer (3
Since 0) has high resistance, the semiconductive layer (30) around the sheet-bonded plate is not heated by induction, and energy loss can be reduced. Therefore, only the sheet joining plate (50) can be heated with energy efficiency, and the welding can be performed with high positional accuracy in a short time.

In the present invention, the high frequency used for the high frequency welding is usually 20 to 800 KHz, and the high frequency of 30 to 500 KHz is preferably used.

In the present invention, the waterproof sheet (4
It is not always necessary to join 1) and the joining plate (50) by high-frequency welding, but they may be joined by hot air or a solvent, or may be joined by an adhesive. However, when the waterproof sheet (41) made of a polyolefin resin is used, it is difficult to melt and the amount of an appropriate solvent is small.

Although the construction procedure of the sheet waterproof structure having the above construction is not limited, it is constructed as follows, for example.

First, the heat insulating material (21) is applied to the roof substrate (10).
A large number of layers are laid on top to form a heat insulating layer (20).

Next, the semiconductive sheet (31) is laid on the heat insulating layer (20) to form the semiconductive layer (30).

Here, in the present invention, the heat insulating material (21)
A semiconductive layer-covered heat insulating material having a semiconductive layer (30) provided thereon is prepared in advance, and this semiconductive layer-coated heat insulating material is applied to a roof substrate (20) to obtain a heat insulating material (21). The laying work of 1) and the laying work of the semiconductive sheet (31) may be performed at the same time.

The semiconductive layer-covered heat insulating material is obtained by joining the above semiconductive sheet (31) onto the heat insulating material (21), or above the heat insulating material (21) for the above semiconductive layer resin. The thing etc. which applied the paint of the composition can be used.

After the semiconductive layer (30) is formed, the sheet joining plate (50) is arranged at a required position and the fixing means (55).
And fix it to the roof base (20).

After that, the waterproof sheet (41) is stretched over the semiconductive layer (30), and the waterproof sheet (41) is joined and fixed to the sheet joining plate (50) by the above-mentioned high frequency welding or the like, and the waterproof layer ( 40), thereby forming a sheet waterproof structure (sheet waterproof heat insulating structure) related to the present invention.

On the other hand, in the waterproof structure of the sheet, when a pinhole inspection is performed, a high voltage may be applied from the surface side of the waterproof sheet (41) as in the conventional case. If the waterproof sheet (41) is damaged by the application of this high voltage, an electric current flows through the semiconductive layer (30) due to a discharge phenomenon, so that the damage can be accurately detected and high inspection accuracy can be obtained. Can be obtained.

In the sheet waterproof structure of the present invention, it is not always necessary to form the heat insulating layer (20), and the semiconductive layer (30) such as the semiconductive sheet (31) is used for the roof substrate (10) or the like. It may be laid directly on the surface of the body. In this case, even if the conductivity of the concrete as the roof substrate (10) is low due to low humidity,
Since the semiconductive layer (30) is present on the lower surface side of the waterproof sheet (41), the pinhole inspection can be performed accurately and accurately.

Further, in the waterproof structure of the sheet of the present invention,
A non-conductive layer may be formed on the roof substrate (10) with a calcium silicate plate, a calcium carbonate plate, or the like. In this case, by forming the semi-conductive layer (30) on the non-conductive layer, the high frequency welding and the pinhole inspection can be surely performed as in the above.

Further, even when the heat insulating layer and the non-conductive layer are formed on the roof substrate (10), the high frequency welding and the pinhole inspection can be surely performed in the same manner as above.

[0062]

EXAMPLES Examples related to the present invention and comparative examples for verifying the effects thereof will be described below. In the following description, in order to facilitate understanding of the invention, portions corresponding to the structure of FIG. 1 are denoted by the same reference numerals as those in FIG.

[0063]

[Table 1]

<Example 1> By applying a coating material containing conductive carbon to the upper surface of a PET resin sheet, the surface resistivity according to JIS K6911 was 10E + 4Ω.
A semiconductive sheet (31) was prepared.

Then, on the concrete skeleton (10),
The heat insulating material (21) is placed on a heat insulating material (21) made of a polystyrene resin foam and having a thickness of 50 mm.
The semiconductive sheet (31) was laid on the top.

Further, a sheet joining plate (50) made of steel plates having a polyolefin resin as a coating layer on the surface thereof.
Was placed on the semi-conductive sheet (31) and fixed to the concrete skeleton (10) with an open leg nail (55).

A waterproof sheet (41) made of polyolefin resin was laid so as to cover these.

From the surface side of the waterproof sheet (41),
High frequency (30KH
When z) was applied and high-frequency welding was performed, the waterproof sheet (41) and the sheet joining plate (50) were welded and integrated accurately and reliably.

Further, after making holes (pinholes) in the waterproof sheet (41) with a needle, a high voltage was applied from the surface side of the waterproof sheet (41), and a pinhole inspection was conducted. ) Could be detected accurately.

Example 2 By changing the coating amount of the conductive carbon-containing paint on the PET resin sheet, the surface resistivity according to JIS K6911 was 10E + 6Ω.
A semiconductive sheet (31) was prepared.

Other than that, in the same manner as in Example 1 above,
When high-frequency welding was performed, it was possible to perform accurate and reliable welding integration. Furthermore, the pinhole was able to be detected accurately by the pinhole inspection.

<Embodiment 3> By changing the coating amount of the conductive carbon-containing paint on the PET resin sheet, the surface resistivity according to JIS K6911 is 10E + 9Ω.
A semiconductive sheet (31) was prepared.

Other than that, in the same manner as in the first embodiment,
When high-frequency welding was performed, it was possible to perform accurate and reliable welding integration. Furthermore, the pinhole was able to be detected accurately by the pinhole inspection.

Example 4 Without using the heat insulating material (21),
When high frequency welding was performed in the same manner as in Example 1 except that the semiconductive sheet (31) was directly placed on the concrete skeleton (10), it was possible to perform welding integration with high accuracy and reliability. Furthermore, the pinhole was able to be detected accurately by the pinhole inspection.

<Example 5> High frequency welding was performed in the same manner as in Example 1 except that a calcium silicate plate having a thickness of 6 mm was used in place of the heat insulating material (21). Could be integrated by welding. Furthermore, the pinhole was able to be detected accurately by the pinhole inspection.

<Example 6> 450 liters of aluminum is vapor-deposited on a PET resin sheet to obtain JISK71.
A semiconductive sheet (31) having a resistivity of 1.8Ω according to 94 was produced.

Other than that, in the same manner as in Example 1 above,
When high-frequency welding was performed, it was possible to perform accurate and reliable welding integration. Furthermore, the pinhole was able to be detected accurately by the pinhole inspection.

<Example 7> 800K of aluminum was vapor-deposited on a PET resin sheet to obtain JISK71.
A semiconductive sheet (31) having a resistivity of 1.1Ω by 94 was produced.

Other than that, in the same manner as in Example 1 above,
When high-frequency welding was performed, it was possible to perform accurate and reliable welding integration. Furthermore, the pinhole was able to be detected accurately by the pinhole inspection.

<Comparative Example 1> By changing the coating amount of the conductive carbon-containing paint on the PET resin sheet, the surface resistivity according to JIS K6911 was 10E.
A non-conductive sheet of + 10Ω was prepared.

The procedure of Example 1 was repeated except that this non-conductive sheet was used instead of the semi-conductive sheet.
When high-frequency welding was performed, it was possible to perform accurate and reliable welding integration.

However, in the pinhole inspection, the pinhole could not be detected although it existed.

<Comparative Example 2> By attaching an aluminum foil having a thickness of 7 microns on a PET resin sheet, the resistivity according to JIS K7194 is 0.01Ω.
A conductive sheet of was prepared.

The procedure of Example 1 was repeated except that this non-conductive sheet was used instead of the semi-conductive sheet.
High frequency welding was tried, but due to energy loss, the periphery of the sheet-bonded plate was also heated, and welding could not be performed satisfactorily.

In the pinhole inspection, the pinhole could be detected accurately.

[0086]

As described above, according to the present invention, since the semiconductive layer having a specific structure is arranged on the lower surface side of the waterproof sheet, the waterproof sheet can be securely joined and fixed to the joining plate by high frequency welding. At the same time, there is an effect that the pinhole inspection can be accurately performed after the construction.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of a waterproof waterproof insulation structure related to the present invention.

FIG. 2 is a cross-sectional view showing a conventional waterproof waterproof structure for a sheet.

[Explanation of symbols]

10 ... Roof base (building frame) 20 ... Insulation layer 21 ... Insulation 30 ... Semi-conductive layer 31 ... Semi-conductive sheet 40 ... Waterproof layer 41 ... Tarpaulin 50 ... Sheet joining plate

Claims (11)

[Claims] 1. A sheet joining plate having a thermoplastic resin coating layer on its surface is fixed to the front side of a building frame, and a waterproof sheet made of thermoplastic resin covers the sheet joining plate. A sheet waterproof structure which is stretched over the surface side of the structure body so that the cover layer of the sheet joint plate and a waterproof sheet portion corresponding to the cover layer are joined and integrated. A sheet waterproof structure, characterized in that a semiconductive layer having a surface resistivity (according to JISK6911 or JISK7194) of 0.1 to 10E + 9Ω is provided between the body and the waterproof sheet. 2. The sheet waterproof structure according to claim 1, wherein the semiconductive layer is formed by a semiconductive sheet laid on the front surface side of the building frame. 3. The sheet waterproof structure according to claim 1, wherein a non-conductive layer made of a non-conductive material is provided between the building frame and the semi-conductive layer. 4. The waterproof sheet structure according to claim 1, wherein a heat insulating layer made of a heat insulating material is provided between the building frame and the semiconductive layer. 5. A first step of disposing a heat insulating material on a building frame to form a heat insulating layer, and having a surface resistivity of (JISK6911 or JISK7194).
A semiconductive sheet of 0.1 to 10E + 9Ω,
A second step of arranging on the heat insulating layer, and a third step of fixing a sheet joining plate having a coating layer made of a thermoplastic resin on the surface thereof to the building frame in a state of being arranged on the semiconductive sheet. A fourth step of stretching a waterproof sheet made of a thermoplastic resin on the semiconductive sheet in such a manner that the sheet covers the sheet bonding plate with the sheet, and a covering layer of the sheet bonding plate and its layer by high frequency induction heating. A sheet waterproofing method including a fifth step of welding and integrating a waterproof sheet portion corresponding to the coating layer. 6. A heat insulating material with a sheet, in which the semiconductive sheet is bonded onto the heat insulating material, is prepared in advance,
The sheet waterproofing method according to claim 5, wherein the first and second steps are performed at the same time by arranging the heat insulating material with a sheet on the building frame. 7. A semi-conductive sheet arranged between a building frame and a thermoplastic resin waterproof sheet laid on the surface side thereof, which has a surface resistivity (in accordance with JISK6911 or JISK7194). A semiconductive sheet characterized by being adjusted to 0.1 to 10E + 9Ω. 8. A carrier comprising a synthetic resin sheet,
The semiconductive sheet according to claim 7, further comprising a conductive layer laminated on the surface of the carrier. 9. The semiconductive sheet according to claim 7, which is composed of a resin composition in which a synthetic resin binder and a conductive material are blended. 10. A semiconductive layer-covered heat insulating material arranged between a building frame and a waterproof sheet made of a thermoplastic resin laid on the surface side thereof, which has a surface resistivity (in accordance with JISK6911 or JISK7194). ) Is adjusted to 0.1 to 10E + 9Ω, and a semiconductive layer is laminated on the surface of the heat insulating material. 11. The semiconductive layer-covered heat insulating material according to claim 10, wherein the semiconductive layer is formed of a semiconductive sheet.