JPS6340055A - Tile type antistatic floor material - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Industrial Field of Application) The present invention has antistatic properties that can be applied to floors in semiconductor assembly factories, hospital operating rooms, clean rooms, computer rooms, other factories, offices, general homes, etc. The present invention relates to tile-type flooring materials.

(Prior art) Conventionally, flooring materials such as aluminum and stainless steel have been used for the floors of rooms that do not like to be charged or generated by static electricity, but they are hard and have problems such as walking noise and vibration. However, there are also problems such as having a monotonous appearance and being expensive, so recently, long soft vinyl flooring materials with conductive or antistatic properties have been developed, and this type of flooring material is often used. It came to be.

(Problem to be solved by the invention) However, with the recent increase in the introduction of OA equipment, wiring is often changed, and these signal cables are routed along the surface of the flooring. In preparation for replacement, it is common practice to take long cables and gather the excess cable wires in a messy manner on the flooring surface behind the OA equipment69.
Not only does it have an unsightly appearance, but because the cables are placed on the surface of the flooring material, the cables have the disadvantage of being caught on one's feet while walking.

In order to improve this drawback, a raised floor type has recently been developed, and this raised floor usually has a double floor structure with another floor formed on top of the original subfloor, and the gap between the subfloor and the floor. It has become possible to store moving cables, communication cables, network equipment, etc. in the space of is one unit. This unit is laid out on the floor, cables, network equipment, etc. are stored in the space formed as described above, and flooring material used as a vestment material is pasted onto the floorboard. This has the advantage that cables and the like do not need to be routed on the surface of the flooring material, giving it a good appearance, and when changing the wiring, the floorboards of the unit can be removed at the necessary locations to easily change the wiring.

Tiled carpets, vinyl chloride tiles, and other tile-shaped flooring materials that have been treated with antistatic treatment are used as floor covering materials for raised access floors. , Dirt, dust, and tiles that adhere to tile carpets are very easy to get dirty, and dirt, dust, and other food and drink residues that have adhered to them cannot be removed, making them look bad, and also causing malfunctions of OA equipment. This method has drawbacks such as the tendency to generate dust such as fiber waste generated from the carpet itself. On the other hand, PVC tiles contain a large amount of powdered inorganic filler to ensure dimensional stability and cost, so they are extremely brittle and often break at the joints during use. The agent came out and this turned into dust and caused the malfunction of the OA equipment.Also, the dimensional stability was not sufficient and the joint part expanded and contracted due to temperature changes in the usage environment (if it expanded). or joint opening (when it shrinks) is likely to occur (
This problem is particularly likely to occur when flooring is installed using a pressure-sensitive adhesive to facilitate wiring changes after a raised floor has been installed.

In addition, when both tile carpet and PVC tiles are laid, the joints are easily noticeable, and after long-term use, carpet tiles tend to fray around the edges, and PVC tiles shrink and stain at the joint openings. There was a problem in that the appearance was very poor due to the accumulation of silica.

(Means for Solving the Problems) The tile-type antistatic flooring material (1) of the present invention has a synthetic resin backing layer of steel with a volume resistivity of 101 to 106 Ω (on the ring, a resistivity of 100 to 1 O'Ω). A conductive base material (3) is laminated, and a volume resistivity value of 1011 to 10''Ω is formed on the conductive base material (3).
The surface layer of the image is laminated, the volume resistivity of the laminate is lO''-106 Ωcm, and a recess is provided at the periphery.

A backing synthetic resin layer with a volume resistivity value of 1011-101Ωα (rumor has it that it is formed from a synthetic resin composition mixed with one or more of an antistatic plasticizer, an antistatic agent, and a conductive substance, and may be a single layer, It may be configured in multiple layers.

In addition, this layer may be a foamed layer or a non-foamed layer, and in the case of a multilayer structure, there is no problem in combining non-foamed layers or foamed layers, or a combination of a non-foamed layer and a foamed layer. It is.

The synthetic resin may be any commonly used synthetic resin such as vinyl chloride resin, acrylic resin, vinyl acetate resin, polyethylene, polypropylene, ethylene-vinyl acetate copolymer resin, urethane resin, etc., but especially vinyl chloride resin. Resins are preferred. In the present invention, the vinyl chloride resin refers to polyvinyl chloride resin, vinyl chloride and other monomers, such as evaporated ethylene, vinyl acetate, vinyl ether,
In addition to copolymers with maleic acid esters, acrylics, urethanes, etc., it also includes blends of polyvinyl chloride resins and other polymers.

Antistatic plasticizers include trytoxyethylphostu-) (TBXP, manufactured by Otoshi Kagaku), butyl diglycol adipate) (BXA, manufactured by Otoshi Kagaku), Sansocizer C
-1100 (manufactured by New Japan Chemical), BK-673,81C-
172, BK-8 Flu (manufactured by Riken Vitamin Oil) is preferable, and general-purpose materials such as dioctyl phthalate, dibutyl 7-thalate, butylbenzyl phthalate, dioctyl phthalate, dioctyl phthalate, diisononyl phthalate, etc. can be used depending on the desired resistance value. It is used to replace part or all of the additive. The blending amount is preferably 5 to 100 parts by weight per 100 parts by weight of the synthetic resin.

The antistatic agent may be any commonly used antistatic agent such as cationic, anionic, or nonionic, and the amount thereof is 0.2 to 10 parts by weight per 100 parts by weight of the synthetic resin. is preferred.

Conductive substances include carbon powder and short fibers, silver, copper,
In addition to metal powders and short fibers such as nickel, aluminum, stainless steel, and iron, inorganic fibers with surface conductivity treatment and inorganic fillers with conductivity treatment (conductive calcium carbonate T1
3O-2500: Nitto Funka, antistatic calcium carbonate 1180-1. Organic powder or short fibers (Dentol WK-100S: made by Otsuka Chemical, Thunderon 5S-N: Japanese silk hair dyeing table, etc.) can be used, and the conductive powder has a small particle size. The conductive short fiber preferably has a diameter of 1 to 600μ and a length of 0.5 to 1000μ.
A range of 20% is preferred. In addition, the blending amount needs to be set appropriately depending on the desired resistance value, but in the case of conductive powder, it is 5 parts by weight or more per 100 parts by weight of resin, and in the case of short fibers, it is 2 parts by weight or more. The addition of is preferred.

The above antistatic performance agents, antistatic agents, and conductive substances may be used alone or in combination of two or more. Other usual additives such as plasticizers, stabilizers, fillers, foaming agents, fungicides, colorants, etc. can be used as necessary.

Conductive substrates (including one type of inorganic or organic fibers such as natural animal or vegetable fibers, asbestos, glass fibers, rock wool, pulp, synthetic fibers, etc. that are commonly used as flooring substrates) In addition to impregnating base materials such as woven fabrics, knitted fabrics, non-woven fabrics, and paper, which are a mixture of at least two types of conductive resin liquid, when manufacturing paper such as cine-woven fabrics and glass-mixed paper using the papermaking method. 1. Conductive fibers and powders as mentioned above,
A woven fabric or a knitted fabric made of a mixture of conductive-treated powder or fibers, or a nine-knit fabric woven with conductive fibers or conductive-treated fibers as described above can be used. Among them, nonwoven fabrics and papers (glass mixed paper, inorganic paper, glass fiber paper, etc.) mixed with carbon fibers and powder during paper making are particularly suitable as base materials for flooring materials in terms of size, viscosity, and price.

A synthetic resin surface layer with a volume resistivity of 10'-10'Ω (
Q is 1' for antistatic plasticizer, antistatic agent, and conductive substance.
It is formed from a synthetic resin composition containing Ia or more, and may have a single layer or a multilayer structure.

In the case of a multi-layer structure, it is composed of a top layer (5) on the top layer and an intermediate layer (6) located below it, and a printed layer is placed between the top layer (5) and the intermediate layer (6). (7) may be interposed.

When the printing layer (7) is interposed, the top layer (5) needs to be transparent. The intermediate layer (6) may be a foamed layer or a non-foamed layer, but if the flooring material is required to have cushioning properties, it is preferably a foamed layer.

Further, this surface layer may be formed from a synthetic resin chip partially using a conductive chip.

The synthetic resin, antistatic plasticizer, antistatic agent, and conductive substance that form the aforementioned backing synthetic resin layer (2) can be used, and the amounts can be used in the same manner. However, since powdered or fibrous solid fillers tend to generate dust due to abrasion, it is preferable to add 100 parts by weight or less to 100 parts by weight of the resin.

The thickness of each layer constituting the flooring material of the present invention is preferably 0.1 to 3 for the synthetic resin surface layer (4), 0.2 to 2 for the conductive base material (3), and 0.2 to 2 for the synthetic resin surface layer (4), and Resin layer (2×0,2
It is preferable that the total thickness of the floor material in which these respective layers are laminated is in the range of 1 to 4.

Further, when the synthetic resin surface layer (4) is a multilayer, the thickness of the uppermost layer (5) is preferably 0.1 to IX.

If the thickness of the uppermost coating layer (5) is less than 0,1X, it will easily wear out during use and become unusable in a short period of time, and if the thickness exceeds 1%, the flooring material will curl against the surface side. This is undesirable because it is easy to use and expensive. If the thickness of the synthetic resin surface layer (4) is less than 0.1%, it is undesirable for the same reason as in the case of the top layer (5), and if the thickness exceeds 3 This is not preferable because it becomes easy to resist, and at the same time, the distance between the conductive resin liquid increases and the antistatic performance deteriorates.

If the thickness of the conductive base material (3) is less than Q, 2X;, the strength will be weak, and especially if the backing synthetic resin layer is a foam layer, the υ base material may break due to local loads and the antistatic performance may deteriorate. If the thickness of the reed exceeds 2 or more, the antistatic performance will improve, but the price will become very high and it will not be economical. If the thickness of the backing synthetic resin layer (2) is less than 0.2X, the flooring material will not easily peel off to the surface side, and if the thickness exceeds 21X, the distance between the conductive adhesive will be large and it will prevent static electricity. This is undesirable because the performance deteriorates.

In addition, any method used for embossing synthetic resin sheets can be used to create recesses to make the joints less noticeable, but for example, it is necessary to synchronize the printed pattern and the uneven pattern. If there is no pattern or if it is plain, use the normal embossing method, or if it is necessary to synchronize the printed pattern and the uneven pattern (that is, make both patterns match), embossing while matching the pattern to the printed pattern. Synchronized embossing method or chemical embossing method that mixes a foaming inhibitor into the printing ink in the areas where depressions need to be formed when performing multicolor printing, allowing the printed pattern to perfectly match the uneven pattern. Other known methods can be used. The tile-shaped flooring material of the present invention is obtained by cutting tiles into tiles using an ordinary cutting machine (a hydraulic cutting machine is particularly preferable in terms of accuracy) according to the concave portion of the peripheral edge formed in this way. be.

The depth of the recess formed here is preferably about 0.1X to 2tX, and the width is preferably in the range of about 5 to 20X. The depth of the dent is 0.
If it is less than 1X, the desired effect cannot be obtained, and if it exceeds 2X, dirt tends to accumulate, resulting in poor appearance, which is not preferable. Further, it is preferable that the depth of the recess is shallower as the width becomes smaller, and conversely, as the width becomes larger, the depth of the recess becomes deeper.

(Function, Effect) The antistatic tile flooring material of the present invention does not contain a large amount of inorganic filler that easily generates dust due to abrasion, and has a volume resistivity of 10'-10'Ω, so it is flexible and transparent. By laminating a light-colored synthetic resin surface layer (4) on the surface, it prevents the adhesion of dirt and the generation of dust that can cause malfunction of OA equipment, and also prevents damage to joints during use. Under the resin surface layer, there is a non-stretchable material that does not expand or contract due to temperature changes in the environment in which the flooring material is used, and has a resistance value of l O' to x ollΩ.
By laminating the conductive base material (3), the expansion and contraction of the flooring material is prevented, and the antistatic performance is improved, and a flexible volume resistivity value of 1011-'- 10
By laminating the backing synthetic resin layer (2) of the 'Ω picture, it suppresses warping towards the surface of the flooring material, and it is easy to peel and re-install when wiring is changed when installed on-site using a pressure-sensitive adhesive. In addition, by creating a recess on one peripheral edge, the conspicuousness of the joint area after installation and long-term use is improved, solving the problem of unsightly appearance, and without impairing the functionality of the raised floor. It is durable enough for practical use and has excellent decorative properties and workability.

In addition, in the antistatic tile flooring material of the present invention, the backing synthetic resin layer, the conductive base material, and the surface layer are all antistatic or conductive, so conduction occurs in the layer direction, and therefore adjacent tiles Static electricity can be removed even if the contact conductivity of the tile flooring materials is incomplete, and if adjacent tile flooring materials are in contact, conduction occurs in the layer direction and horizontal direction, making it even more effective. Static electricity can be removed. In addition, when installing the tile-type antistatic flooring material of the present invention, it is necessary to use a construction adhesive, but in this case,
Antistatic or conductive adhesives, or synthetic rubber latex adhesives (including pressure-sensitive types) or acrylic emulsion-based adhesives (including pressure-sensitive types), which are commonly used for flooring construction.
Adhesives such as ethylene-vinyl acetate copolymer, vinyl acetate, etc., which can impart antistatic properties by transferring antistatic plasticizers, antistatic agents, etc. in the flooring material to the adhesive layer are preferred. In addition, when installing with an adhesive that is not antistatic or conductive, conduction in the layer direction can be inhibited by using a bag pasting method that adheres only the periphery of the tile flooring material, or a method that partially adheres it. It can be constructed without any additional work.

In addition, the flooring material is composed of a flexible synthetic resin layer and a non-stretchable conductive base material, and both sides of the conductive base material are covered with synthetic resin layers, which can cause office equipment to malfunction. In addition to preventing the generation of dust, it also improves the damage to joints during use, the damage to the surface of the flooring material, and the ease of peeling and reinstallation when changing wiring when installed on-site using pressure-sensitive adhesives. However, it is fully usable without impairing the functionality of the raised floor, and has excellent decorativeness and workability.

Of course, the flooring material of the present invention can be attached to the floorboard of a raised floor using the above-mentioned adhesive, and it can be completely integrated with the floorboard and removed together with the floorboard when wiring is changed. It is.

In addition, since the recess (8) is provided on the peripheral edge, the joints can be made inconspicuous after the tile-type antistatic flooring material of the present invention is installed (even after long-term use), resulting in a clean finish. In addition, the joint part will not be lifted up by feet when walking during use, and damage and peeling of the joint part can be prevented.

Next, examples of the present invention will be given, but the present invention is not limited thereto.

(Example) Conductive glass mixed paper made by mixing 5% of charcoal , 4
X) and apply 0.0% of the expandable vinyl chloride resin paste (ri) listed in Table 1 on the surface of the conductive glass mixed paper.
41 thickness, gelatinized by heating at 180°C for 1 minute, and then printed with a printing ink containing a foaming inhibitor using a printing roll with a backing plate that matches the shape of the depressions to be formed on the four peripheries. After printing a predetermined pattern in multiple colors in synchronization with this (printing ink containing a foaming inhibitor is used for a part of the pattern), the transparent vinyl chloride resin paste shown in Table 1 is applied to the surface. After applying it to a thickness of 0.3X, heat it at 210℃ for 1 minute and 40 seconds to foam the foamable vinyl chloride resin paste, and apply it to the area corresponding to the periphery of the tile with a width of 5 to 10% and a depth of 0.2 A total thickness of L8% with a ~0.4% dent and a matching printed pattern and uneven pattern.
- Obtained a sheet. After that, apply the lining vinyl chloride resin paste (I) of Table 1 to the back surface of the sheet, that is, the surface opposite to the surface to which the foamable vinyl chloride resin paste is applied, so that the coating thickness is 0.5X, and The resin foam layer and the vinyl chloride resin transparent layer were heated and gelled under heating conditions (130° C. to 150'CX, 6 minutes to 2 minutes) that did not cause foaming or melting, to obtain a 2.3% flooring material.

The volume resistivity value of this flooring material is 7.7XIO0, and the chargeability according to JIS L 1021 Stroll method is 20
℃ x 40% RH (→O, l 7 K V and 2o℃ x
zo%Raf (→0.21 KV), which revealed that it had excellent antistatic properties.

Table 1 *1 Shinnihon Rika Co., Ltd. M Teiden-preventing lubricant Jujube 2 Daikyo Kasei Kogyo Co., Ltd. Cationic antistatic agent The flooring material obtained in this way was cut into 500 x 500% dimensions using a hydraulic cutting machine. When I cut it out and laid it on a raised floor using an acrylic emulsion pressure-sensitive adhesive (Sumitomo 3M#! Peel Bond), the joints were hard to see and the finish was clean.
It has excellent static electricity removal properties and does not cause openings or creases due to the expansion and contraction of the flooring material, and it can be easily peeled off from the interface between the construction adhesive and the backing vinyl chloride resin layer (2) when changing wiring, so it can also be used during re-installation. The finish was in good condition simply by pressing the flooring material onto the construction adhesive.

(Comparative Example) Glass-mixed paper, which is commonly used as a base material for flooring, was used, and 0.58% of the expandable vinyl chloride resin paste (V) described in Table 2 was applied to the surface of the glass-mixed paper. After coating to give a thick texture and gelling by heating at 180°C for 1 minute, multicolor printing is performed using printing ink that partially contains a foaming inhibitor, and the surface has the transparency listed in Table 2. After applying vinyl chloride resin paste (Ill) to a thickness of 0.3X,
Foaming temperature of foamable vinyl chloride resin paste composition 210
C. for 1 minute and 50 seconds to obtain a flooring material with a total thickness of 2.3% and a printed pattern that matched the uneven pattern. The volume resistivity value of this flooring material is 2, OX I O”Ω equipped, J Engineering S L 10
21 Charging property by Stroll method is 65KV at 20℃ x 40%RH, and (-)) 2.03 at 20℃ x 20%RH.
It was easily charged with KV.

When the floor material obtained in this way was cut into dimensions of 500 x 500% and laid on a raised floor in the same manner as in the example, recoil and associated joint opening occurred in about 3 months, making it difficult to put into practical use. It was a hindrance. In addition, when changing the wiring, it is necessary to peel off the glass-mixed paper between the eyebrows, and when reinstalling, it is necessary to peel off the glass-mixed paper that has adhered to the flooring of the raised floor, making it extremely difficult to reinstall. there were.

By the way, the volume resistivity value referred to in the present invention is the volume resistivity value manufactured by Toa Denpa Kogyo 5.
The resistance value of the conductive base material is the value measured with an M-10E type ultra-super insulation meter, and the resistance value of the conductive base material is the value between two points measured with an ordinary resistance meter.

Further, the resistance value of the synthetic resin layer is the value in the state where each synthetic resin composition is processed into a sheet shape.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an example of the tile-type antistatic flooring material of the present invention. (1)...Tile type antistatic flooring material (2)...
Backing synthetic resin layer (3)... Conductive base material (Xu...
・・Surface layer (5)・・・・Top layer (6)・
...Middle layer (7) ...Printing layer (8)
····dent

Claims (1)

[Claims] A conductive base material having a resistance value of 10^0 to 10^5 Ω is laminated on a backing synthetic resin layer having a volume resistivity value of 10^1^1 to 10^6 Ωcm, and a conductive base material having a volume resistivity value of 10^cm is laminated on the conductive base material. ^1^
A tile antistatic flooring material comprising surface layers of 1 to 10^6 Ωcm laminated, a volume resistivity of the laminate as a laminate of 10^1^1 to 10^6 Ωcm, and a recess provided at the periphery.