JPS6338413B2 - - Google Patents
Info
- Publication number
- JPS6338413B2 JPS6338413B2 JP20809685A JP20809685A JPS6338413B2 JP S6338413 B2 JPS6338413 B2 JP S6338413B2 JP 20809685 A JP20809685 A JP 20809685A JP 20809685 A JP20809685 A JP 20809685A JP S6338413 B2 JPS6338413 B2 JP S6338413B2
- Authority
- JP
- Japan
- Prior art keywords
- ppm
- less
- alloy
- lead material
- semiconductor devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 28
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 12
- 229910052760 oxygen Inorganic materials 0.000 claims description 12
- 239000001301 oxygen Substances 0.000 claims description 12
- 229910052726 zirconium Inorganic materials 0.000 claims description 12
- 239000012535 impurity Substances 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 7
- 229910052735 hafnium Inorganic materials 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052748 manganese Inorganic materials 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052758 niobium Inorganic materials 0.000 claims description 5
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052720 vanadium Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 150000002739 metals Chemical class 0.000 description 7
- 239000007789 gas Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20809685A JPS6270541A (ja) | 1985-09-20 | 1985-09-20 | 半導体装置用Ｃｕ合金リ−ド素材 |
| US06/903,514 US4749548A (en) | 1985-09-13 | 1986-09-03 | Copper alloy lead material for use in semiconductor device |
| GB8621958A GB2181742B (en) | 1985-09-13 | 1986-09-11 | Copper alloy lead material for use in semiconductor device |
| DE19863631119 DE3631119A1 (de) | 1985-09-13 | 1986-09-12 | Leitermaterial auf basis von kupferlegierungen zur anwendung fuer halbleitervorrichtungen |
| US07/166,217 US4872048A (en) | 1985-09-13 | 1988-03-10 | Semiconductor device having copper alloy leads |
| GB8907058A GB2219473B (en) | 1985-09-13 | 1989-03-29 | Copper alloy lead material for use in semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20809685A JPS6270541A (ja) | 1985-09-20 | 1985-09-20 | 半導体装置用Ｃｕ合金リ−ド素材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6270541A JPS6270541A (ja) | 1987-04-01 |
| JPS6338413B2 true JPS6338413B2 (es) | 1988-07-29 |
Family
ID=16550568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20809685A Granted JPS6270541A (ja) | 1985-09-13 | 1985-09-20 | 半導体装置用Ｃｕ合金リ−ド素材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6270541A (es) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR940008939B1 (ko) * | 1990-04-09 | 1994-09-28 | 신닛뽕세이데쓰 가부시끼가이샤 | 균질성이 우수한 합금조직을 갖는 Fe-Cu계 합금판 |
| US5445686A (en) * | 1990-04-09 | 1995-08-29 | Nippon Steel Corporation | Fe-Cu alloy sheet having an alloy structure of high uniformity |
| EP0995808B1 (en) * | 1998-03-10 | 2009-08-26 | Mitsubishi Shindoh Corporation | Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold |
| JP3918397B2 (ja) | 2000-04-11 | 2007-05-23 | 三菱マテリアル株式会社 | 耐密着性無酸素銅荒引線、その製造方法及び製造装置 |
-
1985
- 1985-09-20 JP JP20809685A patent/JPS6270541A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6270541A (ja) | 1987-04-01 |
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