JPS6338337U - - Google Patents

Info

Publication number
JPS6338337U
JPS6338337U JP1986129489U JP12948986U JPS6338337U JP S6338337 U JPS6338337 U JP S6338337U JP 1986129489 U JP1986129489 U JP 1986129489U JP 12948986 U JP12948986 U JP 12948986U JP S6338337 U JPS6338337 U JP S6338337U
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductor element
flow path
substrate
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986129489U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986129489U priority Critical patent/JPS6338337U/ja
Publication of JPS6338337U publication Critical patent/JPS6338337U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73253Bump and layer connectors
JP1986129489U 1986-08-27 1986-08-27 Pending JPS6338337U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986129489U JPS6338337U (enrdf_load_stackoverflow) 1986-08-27 1986-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986129489U JPS6338337U (enrdf_load_stackoverflow) 1986-08-27 1986-08-27

Publications (1)

Publication Number Publication Date
JPS6338337U true JPS6338337U (enrdf_load_stackoverflow) 1988-03-11

Family

ID=31026101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986129489U Pending JPS6338337U (enrdf_load_stackoverflow) 1986-08-27 1986-08-27

Country Status (1)

Country Link
JP (1) JPS6338337U (enrdf_load_stackoverflow)

Similar Documents

Publication Publication Date Title
JPS57103337A (en) Heat transfer connecting device and manufacture thereof
JPS6338337U (enrdf_load_stackoverflow)
JPS6347959A (ja) 熱伝達装置
JPS6112246U (ja) 冷却構造
JPS593549U (ja) 半導体装置
JPH02104642U (enrdf_load_stackoverflow)
JPS6057139U (ja) 集積回路チツプ冷却装置
JPS58175641U (ja) 半導体部品の取付装置
JPS6141238Y2 (enrdf_load_stackoverflow)
JPH0530392Y2 (enrdf_load_stackoverflow)
JPH0230863U (enrdf_load_stackoverflow)
JPH0379450U (enrdf_load_stackoverflow)
JPS61162059U (enrdf_load_stackoverflow)
JPH0295248U (enrdf_load_stackoverflow)
JPS6175139U (enrdf_load_stackoverflow)
JPS5936254U (ja) 発熱素子の冷却装置
JPH02120893U (enrdf_load_stackoverflow)
JPS6221544U (enrdf_load_stackoverflow)
JPS5842950U (ja) 半導体装置
JPS5952666U (ja) 3次元多層構造をもつ半導体装置
JPS6054395U (ja) 電子機器
JPS6221543U (enrdf_load_stackoverflow)
JPS60101795U (ja) 厚膜回路基板
JPS5818351U (ja) 半導体素子冷却装置
JPS61146954U (enrdf_load_stackoverflow)