JPH0295248U - - Google Patents
Info
- Publication number
- JPH0295248U JPH0295248U JP1989002181U JP218189U JPH0295248U JP H0295248 U JPH0295248 U JP H0295248U JP 1989002181 U JP1989002181 U JP 1989002181U JP 218189 U JP218189 U JP 218189U JP H0295248 U JPH0295248 U JP H0295248U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- coolant
- liquid
- circuit device
- bellows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002826 coolant Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 2
- 239000000110 cooling liquid Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989002181U JPH0295248U (enrdf_load_stackoverflow) | 1989-01-13 | 1989-01-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989002181U JPH0295248U (enrdf_load_stackoverflow) | 1989-01-13 | 1989-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0295248U true JPH0295248U (enrdf_load_stackoverflow) | 1990-07-30 |
Family
ID=31202731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989002181U Pending JPH0295248U (enrdf_load_stackoverflow) | 1989-01-13 | 1989-01-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0295248U (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016119451A (ja) * | 2014-10-14 | 2016-06-30 | インテル・コーポレーション | マルチチップパッケージに対する熱除去アセンブリの自動的な高さ補償、および共平面の水平化 |
-
1989
- 1989-01-13 JP JP1989002181U patent/JPH0295248U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016119451A (ja) * | 2014-10-14 | 2016-06-30 | インテル・コーポレーション | マルチチップパッケージに対する熱除去アセンブリの自動的な高さ補償、および共平面の水平化 |
| US9743558B2 (en) | 2014-10-14 | 2017-08-22 | Intel Corporation | Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages |