JPS6337500B2 - - Google Patents

Info

Publication number
JPS6337500B2
JPS6337500B2 JP57027401A JP2740182A JPS6337500B2 JP S6337500 B2 JPS6337500 B2 JP S6337500B2 JP 57027401 A JP57027401 A JP 57027401A JP 2740182 A JP2740182 A JP 2740182A JP S6337500 B2 JPS6337500 B2 JP S6337500B2
Authority
JP
Japan
Prior art keywords
defect
chip
chips
time
detectors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57027401A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58145139A (ja
Inventor
Satoshi Fushimi
Nakayuki Akyama
Yasuhiko Hara
Yoshimasa Ooshima
Juzo Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2740182A priority Critical patent/JPS58145139A/ja
Publication of JPS58145139A publication Critical patent/JPS58145139A/ja
Publication of JPS6337500B2 publication Critical patent/JPS6337500B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2740182A 1982-02-24 1982-02-24 半導体回路等のパターンの比較検査装置 Granted JPS58145139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2740182A JPS58145139A (ja) 1982-02-24 1982-02-24 半導体回路等のパターンの比較検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2740182A JPS58145139A (ja) 1982-02-24 1982-02-24 半導体回路等のパターンの比較検査装置

Publications (2)

Publication Number Publication Date
JPS58145139A JPS58145139A (ja) 1983-08-29
JPS6337500B2 true JPS6337500B2 (xx) 1988-07-26

Family

ID=12220040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2740182A Granted JPS58145139A (ja) 1982-02-24 1982-02-24 半導体回路等のパターンの比較検査装置

Country Status (1)

Country Link
JP (1) JPS58145139A (xx)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50131469A (xx) * 1974-04-03 1975-10-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50131469A (xx) * 1974-04-03 1975-10-17

Also Published As

Publication number Publication date
JPS58145139A (ja) 1983-08-29

Similar Documents

Publication Publication Date Title
US6021380A (en) Automatic semiconductor wafer sorter/prober with extended optical inspection
EP0179309B1 (en) Automatic defect detection system
US5038048A (en) Defect detection system and method for pattern to be inspected utilizing multiple-focus image signals
WO1998001745A9 (en) Automatic semiconductor wafer sorter/prober with extended optical inspection
JPH04107946A (ja) 自動外観検査装置
US6222629B1 (en) Procedure and system for inspecting a component with leads to determine its fitness for assembly
JPS6337500B2 (xx)
JP2647051B2 (ja) 外観検査装置
US20130258328A1 (en) Disk surface inspection method and disk surface inspection device
JP2648476B2 (ja) 部品の検出装置
JP2669685B2 (ja) 線状物体の形状検査装置
JPS6326510A (ja) 実装部品検査装置
JPS62169040A (ja) プリント基板パタ−ン検査装置
US20020090129A1 (en) Chip inspecting apparatus and method
JPH07209203A (ja) 外観検査装置および外観検査方法
CN221149942U (zh) 一种带有监控组件的晶圆划片装置
JPS60120519A (ja) ホトマスクおよび自動欠陥検査装置
JPH04340740A (ja) 重欠点異物自動検査装置及び検査方法
JP3271622B2 (ja) 半導体デバイスの製造方法
JPH08226900A (ja) 表面状態検査方法
KR20220095320A (ko) 반도체 스트립 절단 및 분류 설비에서 반도체 패키지의 안착 상태를 검사하기 위한 장치 및 방법
JP2622714B2 (ja) パターン検査装置
JPS63135849A (ja) 基板検査システム
JP2002109515A (ja) チップ検査方法及び装置
JPS61198374A (ja) 二次元画像比較検査装置