JPS6336706Y2 - - Google Patents
Info
- Publication number
- JPS6336706Y2 JPS6336706Y2 JP9305781U JP9305781U JPS6336706Y2 JP S6336706 Y2 JPS6336706 Y2 JP S6336706Y2 JP 9305781 U JP9305781 U JP 9305781U JP 9305781 U JP9305781 U JP 9305781U JP S6336706 Y2 JPS6336706 Y2 JP S6336706Y2
- Authority
- JP
- Japan
- Prior art keywords
- base
- board
- mounting
- slot
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 18
- 230000037431 insertion Effects 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 17
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 12
- 239000000758 substrate Substances 0.000 description 6
- 230000001105 regulatory effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9305781U JPS58467U (ja) | 1981-06-25 | 1981-06-25 | 半導体素子装着用基台 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9305781U JPS58467U (ja) | 1981-06-25 | 1981-06-25 | 半導体素子装着用基台 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58467U JPS58467U (ja) | 1983-01-05 |
| JPS6336706Y2 true JPS6336706Y2 (cg-RX-API-DMAC7.html) | 1988-09-28 |
Family
ID=29888043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9305781U Granted JPS58467U (ja) | 1981-06-25 | 1981-06-25 | 半導体素子装着用基台 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58467U (cg-RX-API-DMAC7.html) |
-
1981
- 1981-06-25 JP JP9305781U patent/JPS58467U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58467U (ja) | 1983-01-05 |