JPS6336154B2 - - Google Patents
Info
- Publication number
- JPS6336154B2 JPS6336154B2 JP9271680A JP9271680A JPS6336154B2 JP S6336154 B2 JPS6336154 B2 JP S6336154B2 JP 9271680 A JP9271680 A JP 9271680A JP 9271680 A JP9271680 A JP 9271680A JP S6336154 B2 JPS6336154 B2 JP S6336154B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- cutting
- insulator
- pressure sensor
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 74
- 239000012212 insulator Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000005388 borosilicate glass Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9271680A JPS5718370A (en) | 1980-07-09 | 1980-07-09 | Cutting method for semiconductor pressure sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9271680A JPS5718370A (en) | 1980-07-09 | 1980-07-09 | Cutting method for semiconductor pressure sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5718370A JPS5718370A (en) | 1982-01-30 |
JPS6336154B2 true JPS6336154B2 (de) | 1988-07-19 |
Family
ID=14062173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9271680A Granted JPS5718370A (en) | 1980-07-09 | 1980-07-09 | Cutting method for semiconductor pressure sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5718370A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007069456A1 (ja) * | 2005-12-16 | 2007-06-21 | Olympus Corporation | 半導体装置の製造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60207386A (ja) * | 1984-03-31 | 1985-10-18 | Toyota Central Res & Dev Lab Inc | 半導体圧力センサウエハの切断方法 |
JPH02306669A (ja) * | 1989-05-20 | 1990-12-20 | Sanyo Electric Co Ltd | 半導体圧力センサ素子の分離方法 |
JP5436906B2 (ja) * | 2009-03-26 | 2014-03-05 | ラピスセミコンダクタ株式会社 | 半導体装置の製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5062015A (de) * | 1973-10-01 | 1975-05-27 | ||
JPS5384280A (en) * | 1976-12-29 | 1978-07-25 | Daiichi Seitoshiyo Kk | Cutting method and cutting device |
-
1980
- 1980-07-09 JP JP9271680A patent/JPS5718370A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5062015A (de) * | 1973-10-01 | 1975-05-27 | ||
JPS5384280A (en) * | 1976-12-29 | 1978-07-25 | Daiichi Seitoshiyo Kk | Cutting method and cutting device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007069456A1 (ja) * | 2005-12-16 | 2007-06-21 | Olympus Corporation | 半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS5718370A (en) | 1982-01-30 |
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