JPS6333444Y2 - - Google Patents
Info
- Publication number
- JPS6333444Y2 JPS6333444Y2 JP1982031775U JP3177582U JPS6333444Y2 JP S6333444 Y2 JPS6333444 Y2 JP S6333444Y2 JP 1982031775 U JP1982031775 U JP 1982031775U JP 3177582 U JP3177582 U JP 3177582U JP S6333444 Y2 JPS6333444 Y2 JP S6333444Y2
- Authority
- JP
- Japan
- Prior art keywords
- film
- lead wire
- wire
- thin
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 description 28
- 239000010410 layer Substances 0.000 description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 229920000620 organic polymer Polymers 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005405 multipole Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Communication Cables (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3177582U JPS58134819U (ja) | 1982-03-05 | 1982-03-05 | 多極シ−ルド線 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3177582U JPS58134819U (ja) | 1982-03-05 | 1982-03-05 | 多極シ−ルド線 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58134819U JPS58134819U (ja) | 1983-09-10 |
| JPS6333444Y2 true JPS6333444Y2 (fr) | 1988-09-06 |
Family
ID=30043434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3177582U Granted JPS58134819U (ja) | 1982-03-05 | 1982-03-05 | 多極シ−ルド線 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58134819U (fr) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50121987U (fr) * | 1974-03-22 | 1975-10-04 | ||
| JPS57143613U (fr) * | 1981-03-05 | 1982-09-09 |
-
1982
- 1982-03-05 JP JP3177582U patent/JPS58134819U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58134819U (ja) | 1983-09-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6333444Y2 (fr) | ||
| JP7127995B2 (ja) | 配線基板の製造方法 | |
| JPS5915507Y2 (ja) | 半導体取着構造 | |
| JPH057783Y2 (fr) | ||
| JPS6366805A (ja) | フレキシブルケ−ブル | |
| JPS59109019U (ja) | シ−ルド付絶縁電線 | |
| JPS60133697U (ja) | 電磁波シ−ルド材 | |
| JPS6124917U (ja) | シ−ルド線 | |
| JPS5820421U (ja) | 電線用シ−ルドテ−プ | |
| JPS6356443A (ja) | ロツクウ−ル化粧板 | |
| EP0347460A4 (en) | Ion sensor | |
| JPS5632748A (en) | Ic with bump and manufacture thereof | |
| JPS6064521U (ja) | 電力ケーブル | |
| JPS6079768U (ja) | 電気回路を備えたほうろう基板のリ−ド線取付け構造 | |
| JPS61132619U (fr) | ||
| JPS58122401U (ja) | 小型電力用の低抵抗チツプ抵抗器 | |
| JPH0333914U (fr) | ||
| JPS58141201U (ja) | 鏡体 | |
| JPS6142200A (ja) | プリプレグ電磁波シ−ルド材料 | |
| JPS6228314U (fr) | ||
| JPH0226298U (fr) | ||
| JPH01160871U (fr) | ||
| JPS6235594A (ja) | フレキシブル回路基板及びその製造方法 | |
| JPS59104424U (ja) | 遮へいケ−ブル | |
| JPS59136111U (ja) | シ−ルド付絶縁電線 |