JPS6332256B2 - - Google Patents
Info
- Publication number
- JPS6332256B2 JPS6332256B2 JP25015383A JP25015383A JPS6332256B2 JP S6332256 B2 JPS6332256 B2 JP S6332256B2 JP 25015383 A JP25015383 A JP 25015383A JP 25015383 A JP25015383 A JP 25015383A JP S6332256 B2 JPS6332256 B2 JP S6332256B2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- probe holder
- support plate
- contact
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000523 sample Substances 0.000 claims description 136
- 238000007689 inspection Methods 0.000 claims description 22
- 238000012360 testing method Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25015383A JPS60142528A (ja) | 1983-12-28 | 1983-12-28 | 回路基板等の検査装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25015383A JPS60142528A (ja) | 1983-12-28 | 1983-12-28 | 回路基板等の検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60142528A JPS60142528A (ja) | 1985-07-27 |
| JPS6332256B2 true JPS6332256B2 (zh) | 1988-06-29 |
Family
ID=17203606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25015383A Granted JPS60142528A (ja) | 1983-12-28 | 1983-12-28 | 回路基板等の検査装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60142528A (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010101821A (ja) * | 2008-10-27 | 2010-05-06 | Ricoh Co Ltd | 基板検査装置及び基板検査システム |
| JP6559470B2 (ja) * | 2015-06-02 | 2019-08-14 | 日置電機株式会社 | プローブユニットおよび測定装置 |
-
1983
- 1983-12-28 JP JP25015383A patent/JPS60142528A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60142528A (ja) | 1985-07-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |