JPS6331557U - - Google Patents
Info
- Publication number
- JPS6331557U JPS6331557U JP1986124763U JP12476386U JPS6331557U JP S6331557 U JPS6331557 U JP S6331557U JP 1986124763 U JP1986124763 U JP 1986124763U JP 12476386 U JP12476386 U JP 12476386U JP S6331557 U JPS6331557 U JP S6331557U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting device
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986124763U JPS6331557U (de) | 1986-08-14 | 1986-08-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986124763U JPS6331557U (de) | 1986-08-14 | 1986-08-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6331557U true JPS6331557U (de) | 1988-03-01 |
Family
ID=31017079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986124763U Pending JPS6331557U (de) | 1986-08-14 | 1986-08-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6331557U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004082036A1 (ja) * | 2003-03-10 | 2004-09-23 | Toyoda Gosei Co., Ltd. | 固体素子デバイスおよびその製造方法 |
| JPWO2004082036A1 (ja) * | 2003-03-10 | 2006-06-15 | 豊田合成株式会社 | 固体素子デバイスおよびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6196780A (ja) * | 1984-10-17 | 1986-05-15 | Stanley Electric Co Ltd | Ｌｅｄチツプのコ−テイング方法 |
-
1986
- 1986-08-14 JP JP1986124763U patent/JPS6331557U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6196780A (ja) * | 1984-10-17 | 1986-05-15 | Stanley Electric Co Ltd | Ｌｅｄチツプのコ−テイング方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004082036A1 (ja) * | 2003-03-10 | 2004-09-23 | Toyoda Gosei Co., Ltd. | 固体素子デバイスおよびその製造方法 |
| JPWO2004082036A1 (ja) * | 2003-03-10 | 2006-06-15 | 豊田合成株式会社 | 固体素子デバイスおよびその製造方法 |
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