JPH01167065U - - Google Patents

Info

Publication number
JPH01167065U
JPH01167065U JP1988063522U JP6352288U JPH01167065U JP H01167065 U JPH01167065 U JP H01167065U JP 1988063522 U JP1988063522 U JP 1988063522U JP 6352288 U JP6352288 U JP 6352288U JP H01167065 U JPH01167065 U JP H01167065U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
recess
diode chip
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988063522U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0639464Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988063522U priority Critical patent/JPH0639464Y2/ja
Publication of JPH01167065U publication Critical patent/JPH01167065U/ja
Application granted granted Critical
Publication of JPH0639464Y2 publication Critical patent/JPH0639464Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP1988063522U 1988-05-13 1988-05-13 発光ダイオード Expired - Lifetime JPH0639464Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988063522U JPH0639464Y2 (ja) 1988-05-13 1988-05-13 発光ダイオード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988063522U JPH0639464Y2 (ja) 1988-05-13 1988-05-13 発光ダイオード

Publications (2)

Publication Number Publication Date
JPH01167065U true JPH01167065U (de) 1989-11-22
JPH0639464Y2 JPH0639464Y2 (ja) 1994-10-12

Family

ID=31289018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988063522U Expired - Lifetime JPH0639464Y2 (ja) 1988-05-13 1988-05-13 発光ダイオード

Country Status (1)

Country Link
JP (1) JPH0639464Y2 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005537665A (ja) * 2002-08-30 2005-12-08 ゲルコアー リミテッド ライアビリティ カンパニー Ｌｅｄ平面型光源及びこれを備えた薄型ヘッドライト
JP2006313896A (ja) * 2005-05-02 2006-11-16 Samsung Electro Mech Co Ltd 発光素子パッケージ
JP2008258413A (ja) * 2007-04-05 2008-10-23 Rohm Co Ltd 半導体発光装置
WO2013161295A1 (ja) * 2012-04-24 2013-10-31 パナソニック株式会社 Ｌｅｄパッケージおよびｌｅｄ発光素子
JP2016502289A (ja) * 2013-01-08 2016-01-21 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス半導体コンポーネント用のトラフ型反射体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5577874U (de) * 1978-11-21 1980-05-29
JPS58220480A (ja) * 1982-06-16 1983-12-22 Toshiba Corp 光半導体装置
JPS59115669U (ja) * 1983-01-25 1984-08-04 三洋電機株式会社 発光素子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5577874U (de) * 1978-11-21 1980-05-29
JPS58220480A (ja) * 1982-06-16 1983-12-22 Toshiba Corp 光半導体装置
JPS59115669U (ja) * 1983-01-25 1984-08-04 三洋電機株式会社 発光素子

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005537665A (ja) * 2002-08-30 2005-12-08 ゲルコアー リミテッド ライアビリティ カンパニー Ｌｅｄ平面型光源及びこれを備えた薄型ヘッドライト
JP2006313896A (ja) * 2005-05-02 2006-11-16 Samsung Electro Mech Co Ltd 発光素子パッケージ
JP2008258413A (ja) * 2007-04-05 2008-10-23 Rohm Co Ltd 半導体発光装置
WO2008126696A1 (ja) * 2007-04-05 2008-10-23 Rohm Co., Ltd. 半導体発光装置
WO2013161295A1 (ja) * 2012-04-24 2013-10-31 パナソニック株式会社 Ｌｅｄパッケージおよびｌｅｄ発光素子
JP2013229395A (ja) * 2012-04-24 2013-11-07 Panasonic Corp Ｌｅｄパッケージおよびｌｅｄ発光素子
JP2016502289A (ja) * 2013-01-08 2016-01-21 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス半導体コンポーネント用のトラフ型反射体

Also Published As

Publication number Publication date
JPH0639464Y2 (ja) 1994-10-12

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