JPS63311796A - Apparatus for laminating and coupling printed board - Google Patents

Abstract

PURPOSE:To manufacture a material stack automatically by a method wherein a transfer apparatus which transfers the material stack to a magazine and a conveying apparatus which conveys the material stack from a laminating apparatus to an arranging apparatus and a drilling and pinning apparatus successively are provided. CONSTITUTION:A transfer apparatus 8 is composed of a base 48 on which a material stack 5 is placed, a lifter 50 which is moved vertically by a pneumatic cylinder 49 and lifts the material stack 5 from the base 48 to a required height by its movement and a robot 52 which has a chuck 51 and transfers the material stack 5 from the lifter 50 to a magazine 9. A conveying apparatus 6 is composed of a pneumatic cylinder, a traverse 54 moved by the pneumatic cylinder and six chucks 55 which are provided at three positions of the traverse 54 two at each position. The chucks 55 hold the material stacks 5 placed on the rails 11 of a laminating apparatus 1, on the base of an arranging apparatus 6 and on the base of a drilling and pinning apparatus 7. With this constitution, the whole process can be carried out without manual handling.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a printed circuit board stacking and bonding device for combining and bonding several PM printed circuit boards in a stacked state.

(Prior art) In the case of a board with through-holes, before forming the through-holes, multiple printed circuit boards are stacked on a bottom board, and a top board is placed on top to form a material stack. ,
In order to connect them and to use them as a reference when forming through holes, holes are drilled at a plurality of predetermined locations in the material stack and pins are driven into the holes. Incidentally, the reason why the upper plate and the bottom plate are provided on both sides of the upper and lower sides of the printed circuit board is to prevent the formation of cracks on the printed circuit board when drilling and through-holes are formed for pin driving.

(The problem to be solved by the invention) However, in the past, the bottom plate, the printed circuit board and the J-
Because the board lamination, drilling, and pinning were all done by hand, sweat and oil tended to adhere to the surface of the printed circuit board even when wearing gloves, which caused oxidation of the copper surface and caused quality problems. It was happening.

In addition, recently, the performance of processing machines for forming through-holes has improved, but if the material stack was produced manually, the production of the material stack would not be possible due to the speed of the processing machine. It was not possible to follow the flow, which hindered high efficiency.

The present invention has been made in view of the circumstances mentioned above, and its purpose is to be able to automatically produce a material stack,
An object of the present invention is to provide a printed circuit board lamination and bonding device that can improve the efficiency of manufacturing a material stack and is free from the risk of sweat or oil adhering to the printed circuit board.

[Structure of the Invention] (Means for Solving the Problems) The printed circuit board lamination bonding device of the present invention
a laminating device that takes out a plurality of printed circuit boards and a top board and stacks them in order to form a material stack; an aligning device that corrects and aligns the misalignment of a plurality of printed circuit boards in the material stack; and this aligning device A punching and bottling device that punches holes in several places and drives bottles into the holes, and a transfer device that transfers the material stack that has been bottled by the punching and bottling device to a magazine. and a conveying device that sequentially conveys the material stack from the stacking device to the aligning device and the punching/binning device.

(Function) According to the above means of the present invention, it is possible to automatically produce a material stack without human intervention.

Therefore, there is no risk of sweat or oil getting onto the printed circuit board.
Further, it is possible to improve the efficiency of manufacturing the material stack.

(Example) An example of the present invention will be described below based on FIGS. 1 to 10. In FIG. 1 showing the overall configuration, 1 is a Bakelite bottom plate 2. a laminating device that sequentially laminates a large number of printed circuit boards 3 and an aluminum upper tliii 4 to form a material stack 5; 6 is an alignment device that corrects misalignment of the plurality of printed circuit boards 3 in the material stack 5 and aligns them; 7; Reference numeral 1 indicates a perforating and bottling device for punching holes in a plurality of predetermined locations in the aligned cable stack 5 and driving bottles into the holes, 8 a transfer device for transferring the bottled material stack 5 to the magazine 9, and 10 a material. The stack 5 is transferred from the laminating device 1 to r+'+ii
This is a conveyance device that sequentially conveys to the punching device 6 and the punching/binning device 7, and each of these devices will be explained in order below.

First, the laminating apparatus 1 will be explained with reference to FIGS. 2 and 3. Reference numeral 11 is a rail, and on both sides of this rail 11 there are first lifters 14 that are moved up and down by a screw mechanism 13 that is rotationally driven by a motor 12. Three units are arranged as shown in the figure, and the two glue lids 14 on the left side in Figure 1
The pallet 15 on which the bottom plates 2 are stacked is attached to the middle glue lid.
A pallet 15 on which printed circuit boards 3 are laminated is placed on 14, and a pallet 15 on which upper plates 4 are laminated is placed on the right side lid 14, respectively. 16 is the bottom plate 2. A total of six loaders are used to supply the printed circuit board 3 and plate plate 4 from the pallet 15 to the rail 11[-. The main part 19 is reciprocated between the main parts 19 and the pneumatic cylinder 20 attached to the main part 19.
It is composed of two downwardly movable suction cups 21. 22 is the bottom plate 2 supplied to the rail 11''2. This is a feeding device that feeds the printed circuit board 3 and the upper board 4 one pitch at a time in the direction of arrow A.
4, three feed pawls 25 rotatably attached to the slider 24, and the feed pawls 25 are reciprocated between the state shown by the solid line and the state shown by the two-dot chain line in FIG. It is composed of a pneumatic cylinder 26 for Reference numeral 27 denotes a temporary alignment pin provided at the end portion of the rail 11 in the direction of arrow A, and this pin is moved up and down by a pneumatic cylinder 28.

Next, in FIGS. 4 and 5 showing the alignment device 6,
Reference numeral 29 denotes a base, on which bins 31 and 32, which are moved up and down by a pneumatic cylinder 30, are provided corresponding to two perpendicular surfaces of the material stack 5. 33 is a roller for pressing the material stack 5 against the bin 30, and this roller is attached to a support frame 35 that is reciprocated by a pneumatic cylinder 34. 36 is a pin for pressing the material stack 5 against the pin 32; this pin is provided on a support frame 38 that is reciprocated by a pneumatic cylinder 37;
It is moved up and down by 88. 39 is a positioning pin, which is moved up and down by a pneumatic cylinder 40 shown in FIG. This positioning pin 39 is used when the printed circuit board 3 is a multilayer printed circuit board. In other words, in the case of a multilayer printed circuit board, the positioning pin 39 is used to print a pattern on a pre-formed positioning hole rather than on two perpendicular surfaces. Since this is done based on a standard, multiple puddings can be made using two orthogonal surfaces as the basis.

If you try to correct the misalignment of the printed circuit board, when forming through holes, the positional relationship between the through hole and the pattern will be inconsistent for each printed circuit board. Pudding!・This is because it is necessary to correct the misalignment of the board.

As shown in FIGS. 7 and 8, the punching/pin driving device 7 has a lower XY gutter 43 driven by a servo motor 42 below a base 41 on which the material stack 5 is placed. At the same time, a drill head 44 is attached to the base 41 and an XY gutter 46 driven by a servo motor 45 is disposed on the upper part of the base 41.
It is constructed by attaching a pin driving head 47 to the.

As shown in FIG. 9, the transfer device 8 is moved downward by a base 48 on which the material stack 5 is placed and by a pneumatic cylinder 49, and is raised to move the material stack 5 to a predetermined height from the base 48. It is composed of a lifter 50 that raises the material stack 5 to a position, and a robot 52 that is equipped with a chuck 51 that grips the material stack 5 and transfers the material stack 5 from the lifter 50 to the magazine 9.

As shown in FIG. 7, the conveying device 10 includes a pneumatic cylinder 5.
3 and a traverse 54 that is moved by a pneumatic cylinder (not shown) in the arrow B direction, the counter arrow C direction, and the arrow C direction and the counter arrow C direction, and chucks 55 (two chucks 55 ( (See Figure 10)
and the chuck 55 is connected to the rail 11. of the laminating device t1. It is possible to grip the material stack 5 placed on the base 29 of the aligning device 6 and on the base 41 of the punching and pinning device 7.

Next, the operation of the second configuration will be explained. First, the loader 16 corresponding to the left-hand lid 14 in FIG. 1 is operated, and its main portion 19 is moved onto the pallet 15. In this state, the suction cup 21 is lowered and raised by the pneumatic cylinder 20, so that one bottom plate 2 of the pallet 1-15-1 is attracted to the suction cup 21 and pulled up. After that, the main part 19 is moved onto the rail 11, and in this state, the suction cup 21 is lowered by the pneumatic cylinder 20 to place the bottom plate 2 on the rail 11, and then raised by the pneumatic cylinder 20. .

When one bottom plate 2 is placed on the rail 11 in this way, the slider 24 is moved to the pneumatic cylinder 23 with the feeding claw 25 of the feeding device 22 standing up as shown by the solid line in FIG. As a result, the bottom plate 2 on the rail 11 is moved one pitch from the position indicated by D to the position indicated by E in FIG. 1. When the bottom plate 2 is fed one pitch, the feeding claw 2
5 is pushed down by the pneumatic cylinder 26 as shown by the two-dot chain line in FIG.
It is moved in the opposite direction of arrow A and returns to its original position.

Now, when the bottom plate 2 is sent to the E position, the loader 16 in the middle is activated, and in the same manner as described above, one printed circuit board 3 is taken out from the pallet 15 and placed on the bottom plate 2 on the rail 11. . Repeat this operation several times to remove the bottom plate 2.
When a plurality of printed circuit boards 3 are stacked on top, the slider 24 moves in the direction of arrow A in the same manner as described above, and sends the stacked printed circuit boards 3 together with the bottom plate 2 one pitch from position E to position F. Then, when the printed circuit board 3 is sent to the F position, the loader 16 on the right side is activated, and in the same manner as described above, one plate plate 4 is taken out from the pallet 15 and placed on the printed circuit board 3, and then According to the floor plate 2. A material stack 5 is formed by sequentially stacking a plurality of printed circuit boards 3 and upper plates 4.

Incidentally, the lifter 14 moves from the pallet 15 to the bottom plate 2. Each time one printed circuit board 3 and one upper board 4 are taken out, they are raised one step at a time.

When the material stack 5 is formed in this way, the temporary alignment pin 27 is raised by the pneumatic cylinder 28 and protrudes from the rail 11, and in this state, the slider 24 is moved in the direction of arrow A in the same manner as described above. and move material stack 5 to the first
Move one pitch from the F position to the G position shown in the figure. For this reason,
The material stack 5 is temporarily aligned with the pin 2 at the final stage of feeding.
7, thereby causing the bottom plate 2. Temporary alignment of the plurality of printed circuit boards 3 and upper board 4 is performed. Note that when the slider 24 returns, the feed claw 15 is in the folded state, so there is no risk of sending the monthly stacks 5 and the like placed at the D, E, and F positions in the opposite direction.

After this temporary alignment, when the temporary alignment pin 27 is lowered by the pneumatic cylinder 28, the traverse 54 is moved in the direction shown by arrow C by the pneumatic cylinder (not shown), and the lower claw 55a of the chuck 55 is temporarily moved. Aligned material stack 5
The claw 55b on the -L side closes as shown by the two-dot chain line in FIG. 10 and grips the material stack 5. Then, with the material stack 5 gripped by the chuck 55, the traverse 54 is moved by one pitch in the direction shown by arrow B by the pneumatic cylinder 53, and the cable key stack 5 after temporary alignment is moved from the G position to the H position shown in FIG. , that is, transported onto the base 29 of the aligning device 6. After this, the claws 55b of the chuck 55 open as shown by solid lines in FIG. 10 to release the grip on the material stack 5, and the traverse 54
is moved in the direction opposite to the arrow C by a pneumatic cylinder (not shown), and moved in the direction opposite to the arrow B by the pneumatic cylinder 53 to return to the original position.

When the material stack 5 is conveyed onto the base 29 of the aligning device 6, the pins 31 and 32 are first moved upward by the pneumatic cylinder 30 and protrude from the base 29, and then the roller 33 is moved by the pneumatic cylinder 34 in the direction of the arrow! The pin 36 is then raised by the pneumatic cylinder 38a and moved in the direction of the arrow J by the pneumatic cylinder 37 to press the material stack 5 against the pin 32. As a result, deviations in both the front and back and left and right directions between the plurality of printed circuit boards 3 are corrected, and each printed circuit board 3 is aligned in a normal state with the side surfaces, which serve as a reference for pattern printing, etc., flush. in this case,
When the printed circuit board 3 is a multilayer printed circuit board, pattern printing, etc. is performed based on the reference holes 5a (see the figure) formed in advance on the printed circuit board. It is made to protrude upward and inserted into the reference hole 5a, thereby aligning the reference holes 5a of each printed circuit board in a normal state in which they are coaxial.

When each printed circuit board 5 is properly aligned in this way, the pins 31 and 32 are lowered by the pneumatic cylinder 30, and the roller 33 and pin 36 are moved by the pneumatic cylinders 34 and 37, respectively, to The pin 36 is moved in the opposite direction of arrow J, and the pin 36 is further lowered by the pneumatic cylinder 38a. After this, traverse 5 in the same manner as described above.
The chuck 55 of No. 4 grips the aligned material stack 5, and the traverse 54 is moved one pitch in the direction of arrow B to position the material stack 5 from the H position in FIG.
That is, it is transported onto the base 41 of the pin driving device 7. Then, first, the lower XY gutter 43 sequentially moves the drill head 44 to predetermined positions and drills holes at predetermined locations of the monthly stack 5, for example, at four locations along the outer edge of the monthly stack 5, as shown in FIG. form 56. Thereafter, the upper XY garter 46 sequentially moves the pin driving head 47 to the formation position of the porous hole 56, and as shown in FIG.
Drive it into the bottom plate 2. A plurality of printed circuit boards 3 and upper board 4 are combined.

After this pin driving, traverse 54 in the same manner as described above.
The chuck 55 grips the pinned material stack 5, and the traverse 54 is moved one pitch in the direction of arrow B to move the material stack 5 from the position to the L position in FIG.
That is, it is transferred onto the base 48 of the transfer device 8. Then,
The lifter 50 is raised by the pneumatic cylinder 49 to raise the material stack 5 to a predetermined height position. Then,
The robot 52 operates and grips the cable key stack 5, which has been raised to a predetermined height position, by the chuck 51.

In synchronization with this gripping, the lifter 50 is lowered by the pneumatic cylinder 49 and returns to its original position. Then, the robot 52 places the material stack 5 held by the chuck 51 into the magazine 9.

As described above, the material stacks 5 are sequentially manufactured, and when the magazine 9 is fully loaded with the material stacks 5, the magazine 9 is transported to the through-hole forming and pattern printing steps. In the above explanation, the operations for manufacturing the cable stack 5 were performed in sequence at each position D to H and L shown in FIG. 1, but in reality each operation is performed in sequence. All movements in position occur simultaneously. Further, each operation is controlled by a computer (not shown).

As described above, according to this embodiment, the bottom plates 2. The entire process from taking out the printed circuit board 3 and the top board 4, stacking them one on top of the other, drilling holes, and pinning to complete the material stack 5 can be performed without human intervention. It is possible to produce high-quality printed circuit boards without the risk of sweat or oil adhering to the copper surface. Moreover, since all of the above steps can be performed automatically, the material stack 5 can be manufactured efficiently, and the drilling for forming the through holes can cope with the increase in the speed of the processing machine.

FIG. 11 shows another embodiment of the present invention, and the difference from the previous embodiment is that the magazine delivery station 58.
9, and a closed loop magazine feeder 60 is provided between both stations 58 and 59. In this way, the magazine 9 full of material stacks 5 is transferred from the magazine delivery station 58 to the magazine feeder 60, and the magazine 9 full of material stacks 5 is transferred between the magazine 9 and the automatic guided vehicle 61 at the magazine delivery station 59. It is possible to transfer the magazine 9 to the next process unattended, such as transferring the empty magazine 9 from the magazine feeder 60 to the transfer stage run 58. can. Furthermore, each operation for manufacturing the material stack 5 and the delivery of the magazine 9 can be controlled in series by the first computer, thereby further saving labor.

[Effects of the invention] The entire process from taking out the printed circuit board and top board, stacking them in order, drilling holes, and driving pins to complete the cable stack can be performed without human intervention. Therefore, there is no risk of sweat or oil adhering to the copper surface of the printed circuit board, and a high quality printed circuit board can be obtained. Furthermore, since all of the above steps are performed automatically, excellent effects such as the ability to efficiently form a material stack are achieved.

[Brief explanation of drawings]

1 to 10 show an embodiment of the present invention,
FIG. 1(a) is a plan view showing the arrangement of each device, FIG. 1(b) is a perspective view showing the work content performed by each device, FIG. 2 is a front view of the laminating device, and FIG. 4 is a plan view of the aligning device, FIG. 5 is a side view of the same, FIG. 6 is an enlarged longitudinal sectional side view taken along line VI-VI in FIG. 4, and FIG. The figure is a plan view of the drilling/pinning device, FIG. 8 is a front view thereof, FIG. 9 is a side view of the transfer device, FIG. 10 is an enlarged front view of the chuck portion of the transfer device, and
The figure is a plan view showing the arrangement of devices in another embodiment of the present invention. In the figure, 1 is a laminating device, 2 is a bottom plate, 3 is a printed wipe board, 4
5 is the upper plate, 5 is the material stack, 6 is the alignment device, 7 is the perforation/
Pin driving device, 8 transfer device, 9 magazine, 10 transfer device, 11 rail, 14 lifter, 15 pallet, 16 loader, 121 sucker, 22 feed device, 3
1.32 is a pin, 33 is a roller, 36 is a pin, 39 is a positioning pin, 43 is an XY garter, 44 is a drill head, 46 is an XY garter, 47 is a pin driving head, 50 is a lifter, 52 is a robot, 54 is Traverse, 55 is a chuck.

Claims (1)

[Claims] 1. A laminating device that takes out a bottom board, a plurality of printed circuit boards, and a top board and laminates them in order to form a material stack; and an aligning device that corrects misalignment and aligns the plurality of printed circuit boards in the material stack; A punching/pin driving device that punches holes in a plurality of predetermined locations on the material stack aligned by the aligning device and drives pins into the holes, and a transfer device that transfers the material stack pinned by the punching/pin driving device to a magazine. 1. An apparatus for laminating and bonding printed circuit boards, comprising: an apparatus for laminating and bonding printed circuit boards; and a conveying apparatus for sequentially conveying the material stack from the laminating apparatus to an aligning apparatus and a punching and pinning apparatus.