JPS63311792A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS63311792A JPS63311792A JP14705787A JP14705787A JPS63311792A JP S63311792 A JPS63311792 A JP S63311792A JP 14705787 A JP14705787 A JP 14705787A JP 14705787 A JP14705787 A JP 14705787A JP S63311792 A JPS63311792 A JP S63311792A
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- pattern
- board
- screen printing
- photosensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000004020 conductor Substances 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 abstract description 10
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 238000001259 photo etching Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 210000000689 upper leg Anatomy 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリント配線板の製造方法に係り、荷に導体
パターン形成後の高精度なソルダーレジストパターン形
成な心安とするプリント配線板に好適なソルダーレジス
トパターン形成工程に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a printed wiring board, and is suitable for a printed wiring board that provides peace of mind in forming a highly accurate solder resist pattern after forming a conductor pattern on a load. The present invention relates to a solder resist pattern forming process.
絶縁板に導体パターンやスルーホールを形成した後、高
精度なソルダーレジストパターン形成が必要であるプリ
ント板の製造方法は、プリント板全面に感光性ソルダー
レジストを用い、写真法により、所望のパターン形成を
行い、必要に応じて加熱などの硬化処理をソルダーレジ
スト皮膜に付与していた。例えば、日刊工業新聞社発行
の電子技術１９８５年６月臨時増刊号Ｐ１１４〜１１５
のソルダーレジストによる。After forming conductor patterns and through-holes on an insulating board, the printed board manufacturing method requires highly accurate solder resist pattern formation.A photosensitive solder resist is used on the entire surface of the printed board, and the desired pattern is formed using a photographic method. The solder resist film was subjected to curing treatment such as heating as necessary. For example, electronic technology June 1985 special issue P114-115 published by Nikkan Kogyo Shimbun.
by solder resist.
上ｈピ従来技術では、ソルダーレジストパターン露光時
に、例えは露光面のマスクフィルムの透過部分か感光レ
ジスト及び絶縁板のガラス布基材エポキシ樹脂板を通し
て反対面まで光がまわり込みこの感光性レジストの不要
な箇所が硬化し、現像：ａＪ！ｌｔ＆もこれらの一所に
ソルダーレジスト残りが発生する問題があった。In the conventional technology, when exposing a solder resist pattern, for example, light goes around to the opposite side through the transparent part of the mask film on the exposed surface, the photosensitive resist, and the glass cloth base epoxy resin plate of the insulating plate. Unnecessary areas are cured and developed: aJ! lt& also had the problem that solder resist remained in one of these places.
〜又、感光性ソルダーレジストは、高価であり、プリン
ト板の単価が高（なる開祖があった。Also, photosensitive solder resists are expensive, and the unit price of printed circuit boards is high.
本発明が目的とするところは、プリント板の一部が高Ｖ
Ｍ反であっても、比較的安価で、ソルダーレジスト仕上
り品質のよいプリント板ン提供することにある。The object of the present invention is that a part of the printed board has a high V
To provide a relatively inexpensive printed board with good solder resist finish quality even if it is M-sheet.
上記目的は、高密度パターン部にのみ感光性ソルダーレ
ジストを施し、写真法によりパターン形成し、それ以外
の一所はスクリーン印刷によってソルダーレジストパタ
ーン形成を行うことにより達成される。The above object is achieved by applying a photosensitive solder resist only to the high-density pattern area and forming the pattern using a photographic method, and forming the solder resist pattern at other areas by screen printing.
２層以上のプリント板外層両面の同−一所が高密度とな
っている場合な除けば、高密度なパターン部にのみ感光
性ソルダーレジストを画し、写真法により、パターン形
成し、比較的低密度なその他の一所は、スクリーン印刷
で十分に対応することができるため、従来の問題点であ
った露光時の光のまわり込みも、第２図のように問題な
（処理することが出来、しかも、高密度な箇所のみに、
感光性ソルダーレジストを施すため、プリント板の価格
低域にも役立つ。Unless there are two or more layers of high density in the same place on both sides of the outer layer of the printed board, a photosensitive solder resist is applied only to the high density pattern area, and the pattern is formed using a photographic method. Other low-density areas can be adequately covered by screen printing, so the conventional problem of light wrap-around during exposure is now a problem (which cannot be treated) as shown in Figure 2. However, only in high-density areas,
Because it uses a photosensitive solder resist, it also helps lower the price of printed circuit boards.
通常のプリント板の製造方法で、ガラス布基材エポキシ
樹脂板（以下ガラエボ板）４Ｋ、スルホール５や表面導
体パターン２，３を形成する。A glass cloth base epoxy resin board (hereinafter referred to as "Glaevo board") 4K, through holes 5 and surface conductor patterns 2 and 3 are formed using a normal printed board manufacturing method.
従来の感光性ソルダーレジストを使用する製造性は、第
３図のフローチャートにボテ様に、前処理の後に第４図
の両面に感光性ソルダーレジスト１をスクリーン印刷な
どにより両面塗布した後、フィルムマスク７を両面に合
せて露光し、フィルムマスク７な取外した後、現鐵して
パターン形成する。この後、カロ熱などにより皮膜を硬
化し、強固なソルダーレジストとしている。Manufacturability using conventional photosensitive solder resists is as shown in the flowchart in Figure 3.After pretreatment, photosensitive solder resist 1 is coated on both sides of Figure 4 by screen printing, etc., and then a film mask is applied. After exposing both sides of the film 7 and removing the film mask 7, a pattern is formed by exposure. After this, the film is hardened using Calo heat, etc., to form a strong solder resist.
第１図、第２図は、本発明の実画例の一つであり、従来
と同様に前処理した後、一方の面に感光性ソルダーレジ
スト１を塗布し、フィルムマスク７を合せて露光し、フ
ィルムマスク７′ｆ！：外して現像した後、もう一方の
面にソルダーレジスト６をスクリーン印刷でパターン形
成し、加熱などの後処理をして、ソルダーレジストの皮
膜を強化させる。FIGS. 1 and 2 are examples of actual images of the present invention. After pretreatment in the same manner as before, a photosensitive solder resist 1 is applied to one side, a film mask 7 is applied, and exposure is made. And film mask 7'f! : After removing and developing, a pattern of solder resist 6 is formed on the other side by screen printing, and post-treatment such as heating is performed to strengthen the solder resist film.
ソルダーレジスト６は、後処理で加熱して硬化する場合
には、従来から使用している熱硬化性のものでもよい。The solder resist 6 may be a conventionally used thermosetting material when it is cured by heating in post-processing.
また、感光性ソルダーレジストであっても熱硬化するも
のであれば、後処理は、ガロ熱でもよい。但し、熱硬化
しない場合は、「光Ｑζよる全面露光と加熱」を組み盆
せた後処理でもよいＯ
また、別の実施例としては、プリント板の一方の面の特
定の箇所のみ写真法とし、その他をスクリーン印刷法で
パターン形成する方法もできることは言うｆでもない。Further, even if the photosensitive solder resist is used, as long as it is thermally cured, the post-treatment may be performed using Gallo heat. However, if heat curing is not required, post-processing that combines "full-surface exposure and heating with light Q It goes without saying that other patterns can also be formed by screen printing.
本発明によれば、高密度なパターン部にのみ、感光性ソ
ルダーレジストを施し、その池の比較的低密度なパター
ン部は、スクリーン印刷で対応でざるので、従来の全面
に感光性ソルダーレジスト’ｘ ｉＩａシた時に比べ、
ソルダーレジスト費、作業工数も少なくて済むため、プ
リント板を比較的安両に製造することができる。According to the present invention, a photosensitive solder resist is applied only to the high-density pattern area, and the relatively low-density pattern area cannot be covered by screen printing. Compared to when I did x iIa,
Printed boards can be manufactured relatively cheaply because the cost of solder resist and the number of man-hours are reduced.
又、プリント板の外層両面の同−一所が高密度なソルダ
ーレジストパターンを必要とする場合を除けば、感光性
ソルダーレジストを施した面の反対面は、スクリーン印
刷にて、パターン形成されているため、露光時の露光面
かｂバイアホールなどを通して反対面まで光がきても、
従来法のように、対面のソルダーレジストがある程腿ま
で光硬化し、レジスト残りが起こることはないため、ソ
ルダーレジスト仕上り品質がよくなる。Also, unless a high-density solder resist pattern is required at the same location on both sides of the outer layer of the printed board, the pattern is formed on the opposite side of the side to which the photosensitive solder resist is applied by screen printing. Therefore, even if light reaches the exposed surface during exposure or the opposite surface through a via hole,
Unlike the conventional method, the solder resist on the opposite side is photocured up to the thighs, and there is no residual resist, so the quality of the solder resist finish is improved.
第１図は本発明の一実施例のソルダーレジストパターン
形成工程のフローチャート、第２図は、第１図７Ｑ−チ
ャート工程のプリント仮断面図；第３図は従来のソルダ
ーレジストパターン形成工程のフローチャート、第４図
は、第３図７０−チャート工程のプリント板断面図であ
る。
１・・・感光性ソルダーレジスト、２・・・部品リード
接続バンド、３・・・ライン、４・・・絶縁板、５・・
・スルホール、６・・・ソルダーレジスト、７・・・フ
ィルムマスク。
４・・−低＃＆板Fig. 1 is a flowchart of the solder resist pattern forming process according to an embodiment of the present invention; Fig. 2 is a tentative cross-sectional view of printing of the 7Q-chart process in Fig. 1; Fig. 3 is a flowchart of the conventional solder resist pattern forming process. , FIG. 4 is a sectional view of the printed board in the chart step shown in FIG. 3 70. DESCRIPTION OF SYMBOLS 1... Photosensitive solder resist, 2... Component lead connection band, 3... Line, 4... Insulating plate, 5...
・Through hole, 6...Solder resist, 7...Film mask. 4...-Low #& board
Claims (1)
した後、所謂るソルダーレジスタを塗布するプリント板
の製造方法において、少なくても高精度なソルダーレジ
ストパターンなどの必要な箇所を感光性ソルダーレジス
トを用いて、写真法によつてソルダーレジストの所望の
パターンを形成した後、前記の箇所以外をスクリーン印
刷によつてソルダーレジストパターンを形成し、必要に
応じて、加熱などの硬化処理を該ソルダーレジスト皮膜
に付与せしめたことを特徴とするプリント配線板の製造
方法。1. In a printed board manufacturing method in which a so-called solder resist is applied after forming a desired conductor pattern or through hole on an insulating board, the necessary areas such as at least a high-precision solder resist pattern are coated with a photosensitive solder resist. After forming a desired pattern of solder resist using a photographic method using A method for manufacturing a printed wiring board, characterized in that a resist film is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14705787A JPS63311792A (en) | 1987-06-15 | 1987-06-15 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14705787A JPS63311792A (en) | 1987-06-15 | 1987-06-15 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63311792A true JPS63311792A (en) | 1988-12-20 |
Family
ID=15421520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14705787A Pending JPS63311792A (en) | 1987-06-15 | 1987-06-15 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63311792A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250619A (en) * | 1995-03-09 | 1996-09-27 | Nec Corp | Semiconductor device |
| JP2002246750A (en) * | 2001-02-15 | 2002-08-30 | Ibiden Co Ltd | Printed-wiring board and its manufacturing method |
-
1987
- 1987-06-15 JP JP14705787A patent/JPS63311792A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250619A (en) * | 1995-03-09 | 1996-09-27 | Nec Corp | Semiconductor device |
| JP2002246750A (en) * | 2001-02-15 | 2002-08-30 | Ibiden Co Ltd | Printed-wiring board and its manufacturing method |
| JP4691797B2 (en) * | 2001-02-15 | 2011-06-01 | イビデン株式会社 | Printed wiring board and manufacturing method thereof |
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