JPS63305538A - Jig for batch-joining lcc - Google Patents
Jig for batch-joining lccInfo
- Publication number
- JPS63305538A JPS63305538A JP13992487A JP13992487A JPS63305538A JP S63305538 A JPS63305538 A JP S63305538A JP 13992487 A JP13992487 A JP 13992487A JP 13992487 A JP13992487 A JP 13992487A JP S63305538 A JPS63305538 A JP S63305538A
- Authority
- JP
- Japan
- Prior art keywords
- lcc
- holding plate
- printed board
- temperature
- lccs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 16
- 239000006071 cream Substances 0.000 abstract description 8
- 238000002844 melting Methods 0.000 abstract description 4
- 230000008018 melting Effects 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 5
- 239000000155 melt Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 101150069416 lcc3 gene Proteins 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Abstract
Description
【発明の詳細な説明】
〔概 要〕
Ｌ ＣＣ（Ｌｅａｄｌｅｓｓ Ｃｅｒａｍｉｃ Ｃａｒ
ｒｉｅｒ）一括接合用治具であって、複数のＬＣＣをプ
リント板の両面に半田付けで搭載する場合、プリント板
の下面のＬＣＣを形状記憶合金製の保持板で保持するこ
とにより、該保持板は半田溶融後ＬＣＣより離れ、ＬＣ
Ｃの自己整合を可能とする。[Detailed description of the invention] [Summary] LCC (Leadless Ceramic Car)
When mounting multiple LCCs on both sides of a printed board by soldering using a jig for batch bonding, by holding the LCC on the bottom surface of the printed board with a holding plate made of a shape memory alloy, the holding plate is separated from LCC after solder melting, and LC
Allows self-alignment of C.
本発明は複数、個のＬＣＣをプリント板の両面に同時に
半田接合することができるＬＣＣ一括接合用治具に関す
るものである。The present invention relates to a jig for collectively bonding LCCs that can simultaneously solder-bond a plurality of LCCs to both sides of a printed board.
近時、プリント板ユニットはますます高密度、小型化、
低価格化が要求されており、それによりプリント板に実
装する部品は一部リードのないＬＣＣが用いられるよう
になって来ている。In recent years, printed circuit board units have become increasingly denser, smaller, and
There is a demand for lower prices, and as a result, LCCs without leads are being used for some parts mounted on printed circuit boards.
第３図はプリント板の両面にＬＣＣを実装する場合の従
来方法を説明するための図である。この方法は、先ずａ
図に示すようにプリント板ｌの片面に半田クリーム２を
印刷塗布し、その上にｂ図の如＜ＬＣＣ３を載置し、こ
れをペーパー炉にて加熱して０図の如く半田付けを行な
う。次にｄ図の如（プリント板ｌを反転して裏面に半田
クリーム２′を印刷塗布し、その上にｅ図の如＜ＬＣＣ
３′を載置し、これをベーパー炉にて加熱してｆ図の如
く半田付けを完了す生。この加熱時に下面のＬＣＣの半
田も溶融するが、２５ Ｌ ＣＣは溶融した半田の表面
張力によってプリント板から黒膜することはない。FIG. 3 is a diagram for explaining a conventional method for mounting LCCs on both sides of a printed board. In this method, first a
As shown in the figure, print and apply solder cream 2 on one side of the printed board l, place LCC3 on top of it as shown in figure b, heat it in a paper oven, and perform soldering as shown in figure 0. . Next, as shown in figure d (turn the printed board l over, print and apply solder cream 2' on the back side, and apply solder cream 2' on top of it as shown in figure e).
3' and heat it in a vapor furnace to complete the soldering as shown in figure f. During this heating, the solder on the lower LCC also melts, but the 25 L CC does not form a black film on the printed board due to the surface tension of the molten solder.
上記従来のＬＣＣの接合方法では、プリント板の両面の
ＬＣＣを各面別々に接合するため工程が多くなるという
欠点があった。The above-mentioned conventional LCC bonding method has the disadvantage that the LCCs on both sides of the printed board are bonded separately for each side, resulting in a large number of steps.
本発明はこのような点にかんがみて創作されたもので、
複数個のＬＣＣをプリント板の両面に同時に接合するこ
とができるＬＣＣ一括接合用治具を提供することを目的
としている。The present invention was created in view of these points.
The object of the present invention is to provide an LCC batch bonding jig that can simultaneously bond a plurality of LCCs to both sides of a printed board.
このため本発明においては、第１図に例示するように、
ＬＣＣ１０を搭載するプリント板１１と少なくとも同等
の面積を有する台板１２に、前記ＬＣＣ１０がプリント
板１１に搭載される位置に対応して該ＬＣＣ１０を遊挿
できる凹部１３を設け、該凹部１３の底部に前記ＬＣＣ
１０をプリント板１１の下面に押圧保持することができ
る形状記憶合金製の保持板１４と、該保持板１４が温度
により形状変化したときに係合してその戻りを阻止する
保合片１５を設けたことを特徴としている。Therefore, in the present invention, as illustrated in FIG.
A recess 13 into which the LCC 10 can be loosely inserted is provided in a base plate 12 having at least the same area as the printed board 11 on which the LCC 10 is mounted, corresponding to the position where the LCC 10 is mounted on the printed board 11, and a bottom of the recess 13 is provided. The said LCC
A retaining plate 14 made of a shape memory alloy that can press and hold 10 on the lower surface of the printed board 11, and a retaining piece 15 that engages and prevents the retaining plate 14 from returning when its shape changes due to temperature. It is characterized by the fact that it has been established.
ＬＣＣ１０をプリント板１１の下面に押圧保持すること
ができる形状記憶合金製の保持板１４により、半田が溶
融するまではＬＣＣ１０を保持し、半田溶融後は保持し
ないようにしてＬＣＣ１０のセルフアライメントを行な
わせることにより、プリント板１１の両面に同時にＬＣ
Ｃ１０を接合することが可能となる。A holding plate 14 made of a shape memory alloy that can press and hold the LCC 10 against the lower surface of the printed board 11 holds the LCC 10 until the solder melts, and does not hold the LCC 10 after the solder melts, thereby performing self-alignment of the LCC 10. By placing the LC on both sides of the printed board 11 at the same time,
It becomes possible to join C10.
第１図は本発明の実施例を示す断面図である。 FIG. 1 is a sectional view showing an embodiment of the present invention.
同図において、１１はＬＣＣ１０を搭載したプリント板
、１６は本実施例の治具である。In the figure, 11 is a printed board on which the LCC 10 is mounted, and 16 is a jig of this embodiment.
本実施例は図に示すようにＬＣＣ１０を搭載するプリン
ト板１１と少なくとも同等の面積を有する台板１２に、
前記ＬＣＣ１０がプリント板１１に搭載される位置に対
応してＬＣＣ１０を緩く挿入できる（ＬＣＣ１０のセル
フアライメントを可能とする余裕を有する。）凹部１３
を設け、該凹部１３の底部に前記ＬＣＣ１０をプリント
板１１の下面に押圧して保持することができる形状記憶
合金で形成されたばね性を有する保持板１４と、該保持
板１４が温度により形状変化しその高さが低くなったと
きに該保持板１４に係合してその戻りを阻止する係止片
１５を設けたものである。なお１７はガイドピンである
。また前記の形状記憶合金製保持板１４は常温では前記
のようにＬＣＣ１０をプリント板１１に押圧保持できる
高さに形成されているが、使用される半田の溶融温度よ
り若干高い温度、例えば半田の融点が１８３℃とすれば
保持板１４は１９０゜゛ で点線で示すようにその高さ
が低くなりＬＣＣ１０を保持しないように設定しておく
。In this embodiment, as shown in the figure, a base plate 12 having at least the same area as a printed board 11 on which the LCC 10 is mounted,
A recess 13 into which the LCC 10 can be inserted loosely (having a margin that allows self-alignment of the LCC 10) corresponding to the position where the LCC 10 is mounted on the printed board 11.
A holding plate 14 having spring properties made of a shape memory alloy that can hold the LCC 10 by pressing it against the lower surface of the printed board 11 is provided at the bottom of the recess 13, and a holding plate 14 whose shape changes depending on temperature. A locking piece 15 is provided which engages with the holding plate 14 to prevent it from returning when the height of the plate becomes low. Note that 17 is a guide pin. Further, the shape memory alloy holding plate 14 is formed at a height that can press and hold the LCC 10 against the printed circuit board 11 at room temperature as described above, but at a temperature slightly higher than the melting temperature of the solder used, e.g. If the melting point is 183°C, the holding plate 14 is set at 190° and its height is low as shown by the dotted line so that it does not hold the LCC 10.
このように構成された本実施例の使用方法を第２図によ
り説明する。先ずａ図のようにプリント板１１の両面の
ＬＣＣ搭載予定位置に半田クリーム１８を印刷塗布し、
次いでｂ図の如く治具１６に下側のＬＣＣ１０、をセッ
トし、その上にプリント板１１をガイドビン１７により
位置合わせして載置し、さらに上側のＬＣＣ１０を搭載
する。次にこれをベーパー炉ににて加熱する。そして温
度が１８３°Ｃになると半田クリーム１８は溶融し、１
９０℃になると下側のＬＣＣ１０を保持している保持板
１４は形状変化してＬＣＣ１０から離れ、係合片１５に
係合する。これによりＬＣＣ１０はセルフアライメント
し、精度よく位置決めが完了する。このあと常温に戻す
と、保持板１４が係合片１５に係合した状態を保持して
いるため、ＬＣＣ１０はアライメントされた状態を保持
したまま冷却され、０図に示すように両面のしＣＣ１０
は一括して半田付けされることになる。A method of using this embodiment configured in this way will be explained with reference to FIG. 2. First, as shown in figure a, solder cream 18 is printed and applied to the LCC mounting position on both sides of the printed board 11.
Next, as shown in Figure b, the lower LCC 10 is set on the jig 16, the printed circuit board 11 is placed thereon with alignment using the guide bins 17, and the upper LCC 10 is further mounted. Next, this is heated in a vapor furnace. When the temperature reaches 183°C, the solder cream 18 melts and 1
When the temperature reaches 90° C., the holding plate 14 holding the lower LCC 10 changes shape, separates from the LCC 10, and engages with the engagement piece 15. As a result, the LCC 10 self-aligns and completes positioning with high accuracy. After that, when the temperature is returned to room temperature, the holding plate 14 remains engaged with the engaging piece 15, so the LCC 10 is cooled while maintaining the aligned state, and as shown in FIG.
will be soldered all at once.
以上述べてきたように、本発明によれば、形状記憶合金
の保持板を有する治具を用いることにより両面実装する
ＬＣＣを一度に半田付けすることが可能となり、工程が
簡単で、大量にしかも安価に半田付けすることができ、
実用的には極めて有用である。As described above, according to the present invention, by using a jig having a holding plate made of a shape memory alloy, it is possible to solder LCCs mounted on both sides at once, and the process is simple and can be carried out in large quantities. Can be soldered inexpensively,
It is extremely useful in practical terms.
第１図は本発明の実施例を示す断面図、第２図は本発明
の実施例の使用方法を示す図、第３図は従来のＬＣＣ実
装方法を説明するための図である。
第１図、第２図において、
１０はＬＣＣ。
１１はプリント板、
１２は台板、
１３は凹部、
１４は保持板、
１５は係止片、
１６は治具、
１７はガイドピン、
１８は半田クリームである。FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a diagram showing how to use the embodiment of the present invention, and FIG. 3 is a diagram for explaining a conventional LCC mounting method. In Figures 1 and 2, 10 is LCC. 11 is a printed board, 12 is a base plate, 13 is a recess, 14 is a holding plate, 15 is a locking piece, 16 is a jig, 17 is a guide pin, and 18 is solder cream.
Claims (1)
なくとも同等の面積を有する台板（１２）に、前記ＬＣ
Ｃ（１０）がプリント板（１１）に搭載される位置に対
応して該ＬＣＣ（１０）を遊挿できる凹部（１３）を設
け、該凹部（１３）の底部に前記ＬＣＣ（１０）をプリ
ント板（１１）の下面に押圧保持することができる形状
記憶合金製の保持板（１４）と、該保持板（１４）が温
度により形状変化したときに係合してその戻りを阻止す
る係合片（１５）を設けたことを特徴としたＬＣＣ一括
接合用治具。1. The LCC (10) is mounted on a base plate (12) having at least the same area as the printed board (11) on which the LCC (10) is mounted.
A recess (13) into which the LCC (10) can be loosely inserted is provided corresponding to the position where the C (10) is mounted on the printed board (11), and the LCC (10) is printed on the bottom of the recess (13). A retainer plate (14) made of a shape memory alloy that can be pressed and held on the lower surface of the plate (11), and an engagement that engages and prevents the retainer plate (14) from returning when its shape changes due to temperature. A jig for bulk joining LCC characterized by providing a piece (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13992487A JPS63305538A (en) | 1987-06-05 | 1987-06-05 | Jig for batch-joining lcc |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13992487A JPS63305538A (en) | 1987-06-05 | 1987-06-05 | Jig for batch-joining lcc |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63305538A true JPS63305538A (en) | 1988-12-13 |
Family
ID=15256831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13992487A Pending JPS63305538A (en) | 1987-06-05 | 1987-06-05 | Jig for batch-joining lcc |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63305538A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5369879A (en) * | 1992-06-05 | 1994-12-06 | Eaton Corporation | Method of mounting a semiconductor device to a heat sink |
| FR2826231A1 (en) * | 2001-06-19 | 2002-12-20 | Wavecom Sa | Electronic module assembly technique uses spring clip in to secure components to circuit board, in addition to soldered joints |
| WO2015195194A1 (en) * | 2014-06-19 | 2015-12-23 | Raytheon Company | Active electronically scanned array antenna |
| US9685707B2 (en) | 2012-05-30 | 2017-06-20 | Raytheon Company | Active electronically scanned array antenna |
-
1987
- 1987-06-05 JP JP13992487A patent/JPS63305538A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5369879A (en) * | 1992-06-05 | 1994-12-06 | Eaton Corporation | Method of mounting a semiconductor device to a heat sink |
| FR2826231A1 (en) * | 2001-06-19 | 2002-12-20 | Wavecom Sa | Electronic module assembly technique uses spring clip in to secure components to circuit board, in addition to soldered joints |
| WO2002104088A1 (en) * | 2001-06-19 | 2002-12-27 | Wavecom | Method for assembly and/or disassembly of an electronic module on an application card method for production and corresponding mechanical fixing clip |
| US9685707B2 (en) | 2012-05-30 | 2017-06-20 | Raytheon Company | Active electronically scanned array antenna |
| WO2015195194A1 (en) * | 2014-06-19 | 2015-12-23 | Raytheon Company | Active electronically scanned array antenna |
| JP2017523746A (en) * | 2014-06-19 | 2017-08-17 | レイセオン カンパニー | Active electronic scanning array antenna |
| US9876283B2 (en) | 2014-06-19 | 2018-01-23 | Raytheon Company | Active electronically scanned array antenna |
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