JPS58105594A - Method of producing hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for soldering a mold type semiconductor component with a flat lead for face bonding onto a hybrid integrated circuit board. The present invention relates to a method of manufacturing a hybrid integrated circuit device in which soldering is completed while dropping 7 lux onto the surface of the hybrid integrated circuit device.

2. Description of the Related Art Conventionally, methods for mounting semiconductor components in a hybrid integrated circuit device include die bonding or wire bonding of bare chips, wire bonding such as flip chip, and the like.

Semiconductor components 1: As ICs increase in integration, ICs
Many products are being used that are equipped with flat leads for face bonding, which enable sufficient characteristic testing on their own and are easy to assemble and handle during testing.

The flat lead type can be mounted on a hybrid integrated circuit board at the same time as other passive and active chip components.

The mounting method is generally soldering (in particular, a method in which solder paste is printed on the board and then temporarily placed on the board, hereinafter referred to as "placing"), and a method that completes the soldering by reflowing the solder is often used. ing.

Here, a conventional method for manufacturing a hybrid integrated circuit device will be briefly described with reference to the drawings. FIG. 1 is a plan view showing a hybrid integrated circuit board in which semiconductor components with flat leads are assembled, and semiconductor components 5 with flat leads are soldered onto the hybrid integrated circuit board 1 at the same time as passive and active chip components 4. This shows where it is attached.

This assembly process will be explained with reference to FIGS. 2 to 4. First, as shown in FIG. 2, solder paste 3 is applied to the conductor 2 on the hybrid integrated circuit board 1 using a metal mask or the like as shown in FIG. 3a (cross-sectional view) and FIG. 3b (plan view). Use and print.

Thereafter, as shown in FIG. 4, the chip component 4 and the semiconductor component 5 provided with the flange are brazed.

Next, it is placed on a heating table (hot plate) and the solder is reflowed to complete the soldering. At this time, if the amount of solder paste 3 is too small, leads may fail to open or the soldering strength may be weak. Therefore, the amount of solder is controlled slightly larger, but as shown in Figure 5, the flat lead 6
When the lead spacing is narrow, solder bridges 7 occur, which tends to cause electrical defects.

Furthermore, when there are many terminals leading out to the outside and a large number of flat leads are provided, the lead spacing becomes narrower, and solder bridges occur between adjacent leads during soldering, reducing the assembly yield.

Furthermore, the cause of the above-mentioned solder bridge 7 is the large amount of solder paste (some of the solder paste on adjacent lead patterns mixes during preheating, and even during solder reflow, the flux contained in the solder paste alone cannot be used). It is sufficient to spread the solder onto the flat leads and to return the solder existing between the leads to the respective leads by surface tension.

On the other hand, if the amount of solder paste is reduced, the adhesion strength of the leads will decrease, and open failures between the leads and the substrate conductor pattern will likely occur.

This invention was made to eliminate the above-mentioned conventional drawbacks, and includes printing solder paste on a hybrid integrated circuit board,
After temporarily attaching mold-type semiconductor components with a large number of flat leads and other chip components,
During solder reflow, soldering is performed while dripping flux onto the molded part of the flat lead component, so that the flux adheres to the flat lead part as well, improving solder wettability and improving solder compatibility.
It is an object of the present invention to provide a hybrid integrated circuit device in which the surface tension of solder is increased and all solder bridges between leads can be eliminated.

Embodiments of the method for manufacturing a hybrid integrated circuit device of the present invention will be described below with reference to the drawings. FIG. 6 is a sectional view for explaining one embodiment, and in this FIG. 6,
The same parts as in Figures 1 to 4 are designated by the same reference numerals.
state

As shown in Fig. M6, when placing the chip component 4 and the semiconductor component 5 of the flat lead 6 on the hybrid integrated circuit board l and reflowing the solder, insert the drip container 8 etc. from above the semiconductor component 5. Using the same method, drop flux 9 onto the center of the mold.

This flux 9 is applied to each flat lead 6 from the mold part.
The solder 3a increases the surface tension between the flat leads 6 and the solder 3a, and completes the soldering as shown in FIG. 7 without any solder bridging between the flat leads 6.

In addition, in the manufacturing method of the present invention, the mold part is temporarily exposed to extremely high temperature freezing air during solder reflow by dropping 7 lux to cool the mold part, and the semiconductor element inside the mold is cooled. This is a groundbreaking product that is said to be effective in reducing heat stress.

As described above, according to the method for manufacturing a hybrid integrated circuit device of the present invention, a solder paste is printed on a hybrid integrated circuit board, and a mold type semiconductor having a large number of flat leads for face bonding is printed on the solder paste. After temporarily attaching the parts, when reflowing the solder, we completed the soldering while dripping flux onto the mold part of the semiconductor part, so the flux also adhered to the flat lead part, improving solder wettability. At the same time, it has the advantage that solder compatibility is improved, and the surface tension of the solder can be increased, so that all solder bridges between leads are eliminated.

[Brief explanation of the drawing]

Figure 1 is a plan view showing a hybrid integrated circuit board assembled with semiconductor components equipped with 5 flat leads; Figures 2 to 4;
The figures are cross-sectional views showing steps for explaining a conventional method for manufacturing a hybrid integrated circuit device, FIG. 5 is a plan view of the hybrid integrated circuit device assembled by the conventional method for manufacturing a hybrid integrated circuit device, and FIG. The figure is a sectional view for explaining one embodiment of the hybrid integrated circuit manufacturing apparatus of the present invention, and FIG. 7 is a plan view of the hybrid integrated circuit device assembled by the hybrid integrated circuit device manufacturing method of the present invention. DESCRIPTION OF SYMBOLS 1... Hybrid integrated circuit board, 2... Conductor, 3... Solder base, 4... Chip component, 5... Semiconductor component with flat lead, 6... Flat lead, 8
...Drip container, 9...Flux, 3a...Solder. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Shin Kuzuno - Child 1

Claims (1)

[Claims] A solder paste is printed on a hybrid integrated circuit board, and a mold type semiconductor component with many flat leads for face bonding is temporarily attached onto the solder paste. A method for manufacturing a hybrid integrated circuit device, characterized in that soldering is completed while dropping 7 lux onto a mold part.