JPS63303754A - Ink jet head substrate - Google Patents
Ink jet head substrateInfo
- Publication number
- JPS63303754A JPS63303754A JP14039787A JP14039787A JPS63303754A JP S63303754 A JPS63303754 A JP S63303754A JP 14039787 A JP14039787 A JP 14039787A JP 14039787 A JP14039787 A JP 14039787A JP S63303754 A JPS63303754 A JP S63303754A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- nozzle
- flow path
- nozzle part
- round holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 41
- 238000005304 joining Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 abstract description 2
- 238000005553 drilling Methods 0.000 abstract description 2
- 238000010894 electron beam technology Methods 0.000 abstract description 2
- 239000005357 flat glass Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000003754 machining Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000004927 fusion Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 241001272720 Medialuna californiensis Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000006089 photosensitive glass Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14362—Assembling elements of heads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はインクジェットプリンター等に用いるインクジ
ェットヘッド基板の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of an inkjet head substrate used in an inkjet printer or the like.
従来のインクジェットヘッド基板の構造をfJ2図に示
す。The structure of a conventional inkjet head substrate is shown in Figure fJ2.
第2図ta+は従来の流路基板の平面図、第2図tbl
は同じくの断面図である。1はフォトエツチング加工、
射出成形、プレス加工等により流路を形成した基板であ
り一般にはガラス板、プラスチック板又は金属板が用い
られる。Figure 2 ta+ is a plan view of a conventional channel board, Figure 2 tbl
is the same sectional view. 1 is photo etching processing,
It is a substrate on which a flow path is formed by injection molding, press working, etc., and generally a glass plate, a plastic plate, or a metal plate is used.
2は蓋板であり同じくガラス板、プラスチック板又は金
属板が用いられ、基板1と蓋板2とは融着又は接着剤等
により接合される。Reference numeral 2 denotes a lid plate, which is similarly made of a glass plate, a plastic plate, or a metal plate, and the substrate 1 and the lid plate 2 are joined by fusion, adhesive, or the like.
3はインクの流路であり、ノズル4からインクが噴射す
る。又、ノズル4の近傍にはインク溜まり状態を一定に
し、インク飛行方向を安定させるために満5を設けであ
る。3 is an ink flow path, and ink is ejected from a nozzle 4. In addition, in the vicinity of the nozzle 4, there are provided 5 holes in order to keep the ink accumulation state constant and to stabilize the direction of ink flight.
しかし、従来のインクジェットヘッド基板は、ノズル部
から流路部までを一体で加工するためノズル部の形状は
半月形状又は四角形状が一般的であり、応答周波数を上
げようとすると液体固育の特性により安定噴射を妨げ応
答周波数を低く押さえてしまうという欠点を有していた
。またノズル部の長さ寸度が印字品質に影響するため精
度良(加工することが必要であるが、それには多大な工
数を必要とした。さらにはノズル周辺のインク溜まりを
均一化するために溝入加工を行なっているが、同様に多
大な工数を必要とし、又加工中の不良も発生していた。However, in conventional inkjet head substrates, the nozzle part is generally formed into a half-moon or square shape because the nozzle part and the flow path part are processed as one piece. This has the drawback of hindering stable injection and keeping the response frequency low. In addition, since the length of the nozzle affects the printing quality, it is necessary to process the nozzle with high precision, which requires a large amount of man-hours. Although grooving is performed, it also requires a large number of man-hours and also causes defects during processing.
ここで本発明はかかる従来の問題点を解決するものでそ
の目的とするところは、ノズル形状を丸穴形状にするこ
とにより応答周波数を向上させ、又、ノズル長さ寸度加
工及び溝入れ加工を容易にし、安価で品質のすぐれたイ
ンクジェットヘッドを提供することである。The present invention is intended to solve these conventional problems, and its purpose is to improve the response frequency by making the nozzle shape into a round hole shape, and to process the nozzle length and groove. The purpose of the present invention is to provide an inexpensive and high-quality inkjet head.
本発明のインクジェットヘッドは、ノズル部以外の流路
パターンを形成した基板とノズル部を形成した基板との
接合によりヘッド基板を構成することを特徴とする。The inkjet head of the present invention is characterized in that the head substrate is formed by joining a substrate on which a flow path pattern other than the nozzle portion is formed and a substrate on which the nozzle portion is formed.
本発明の上記の構成によれば、ノズル部を別個に加工す
ることにより、ノズル部の九大形状加工が容易となり、
応答周波数が向上する。又、ノズル長さ寸度加工及び溝
入れ加工時に発生していたワレ・クラックの発生がなく
なる。According to the above configuration of the present invention, by separately processing the nozzle part, it becomes easy to process the nozzle part into the nine major shapes,
Improves response frequency. In addition, cracks and cracks that occur during nozzle length machining and grooving are eliminated.
本発明の実施例をm1図(al、(bl、(C1、td
)、(e)、ffl、Ig)を用いて説明する。Examples of the present invention are shown in m1 diagram (al, (bl, (C1, td
), (e), ffl, Ig).
10は流路を形成した基板、12は蓋板であり材質とし
てガラス板、プラスチック板、又は金属板が一般には用
いられる。10の流路基板にはノズル部は形成されてい
ない、11は流路であり、一般にはエツチング加工によ
り形成され、12の蓋板と10の基板とは融着又は接着
剤等を用いて接合される。13はノズル基板であり、ノ
ズル14と満15を形成している。材質としては流路形
成基板と同様にガラス板、プラスチック板、金属板及び
水晶板等が用いられる。Reference numeral 10 indicates a substrate having a flow path formed therein, and reference numeral 12 indicates a cover plate, which is generally made of a glass plate, a plastic plate, or a metal plate. No nozzle part is not formed on the flow path substrate 10, and 11 is a flow path, which is generally formed by etching, and the cover plate 12 and the substrate 10 are bonded by fusion or adhesive. be done. A nozzle substrate 13 forms a nozzle 14 and a nozzle 15. As for the material, a glass plate, a plastic plate, a metal plate, a quartz plate, etc. are used like the flow path forming substrate.
14の丸穴加工はドリル加工、レーザー加工、電子ビー
ム加工、放電加工、エツチング加工等により行なうが、
穴形状の円滑さにおいてはエツチング加工がすぐれてい
る。水晶Z板、感光性ガラス等を用いれば方向性エツチ
ングが可能である。14 round hole machining is performed by drilling, laser machining, electron beam machining, electrical discharge machining, etching machining, etc.
Etching is superior in terms of the smoothness of the hole shape. Directional etching is possible by using a crystal Z plate, photosensitive glass, or the like.
又従来の方式においては印字品質に影響するノズル長さ
の加工は一品一品多大な工数をかけて加工していたが、
本方式ではノズル基板の厚みがノズル長さに相当するた
め、多数個同時加工を行ない厚み精度も容易に数μの高
精度で仕上げることができる。さらには15の溝加工に
ついても機械加工、エツチング加工等が考えられるが、
エツチング加工方式を採用すれば、ノズル穴加工と同時
に溝加工が可能となり工数上非常に育利である。In addition, in conventional methods, machining the nozzle length, which affects print quality, required a large amount of man-hours for each product.
In this method, since the thickness of the nozzle substrate corresponds to the nozzle length, multiple pieces can be processed simultaneously and the thickness can be easily finished with a high accuracy of several microns. Furthermore, machining, etching, etc. can be considered for the 15 grooves, but
If the etching method is adopted, it is possible to simultaneously process the nozzle hole and groove, which is extremely beneficial in terms of man-hours.
又、第1図tg)に示す様にインク溜りをより安定させ
、印字品質を向上させるために、ノズル間に溝を設ける
こともエツチング加工等により容易に可能となる。流路
を形成した流路基板10とノズル基板13との接合は接
着剤接合、融雪、低融点金rlA接合等の方法により、
ノズル部と流路部の位置精度を確保しながら行なう。Further, as shown in FIG. 1 (tg), in order to further stabilize the ink pool and improve printing quality, grooves can be easily provided between the nozzles by etching or the like. The channel substrate 10 with the channel formed thereon and the nozzle substrate 13 are bonded by adhesive bonding, snow melting, low melting point metal RLA bonding, etc.
This is done while ensuring the positional accuracy of the nozzle section and flow path section.
本発明によれば、流路を形成した基板とノズル基板とを
別々に加工することにより、ノズルの丸穴形状加工を容
易に実現し、応答周波数が向上するという効果を有する
。さらには、ノズル長さ寸度加工と溝入加工の多数個同
時加工がfa度良く行なえるため、ヘッドのコストダウ
ンが図れると共に加工精度向上に伴なう印字品質向上が
可11級となるという効果を打する。According to the present invention, by separately processing the substrate on which the flow path is formed and the nozzle substrate, it is possible to easily process the round hole shape of the nozzle, and the response frequency is improved. Furthermore, since it is possible to simultaneously process multiple nozzle length dimensions and grooves with good fa, it is possible to reduce the cost of the head and improve the printing quality by improving the processing accuracy to level 11. Hit the effect.
第1図+a)は本発明による流路基板の平面図。
10・・・・・・流路基板
11・・・・・・流路
第1図1cIは本発明の流路形成基板の断面図。
12・・・・・・蓋板
第1図1cIは本発明のノズル基板の平面図。
13・・・・・・ノズル基板
14・・・・・・ノズル
15・・・・・・溝
第1図((1)は本発明のノズル基板の右側面図。
15・・・・・・溝
第1図+e)は本発明のノズル穴加工の断面図。
第1図(「)は本発明の流路形成基板とノズル基板との
接合図。
、第1図tg+は本発明のノズル間にも溝を設けた応用
例を示す図である。
16・・・・・・ノズル間溝
第2図(a)は、従来の流路形成基板の平面図である。
1・・・・・・基板
3・・・・・・流路
4・・・・・・ノズル
第2図tb+は従来の流路形成基板の断面図。
2・・・・・・蓋板
5・・・・・・溝
第2図(C1は従来のノズル部断面図。
以 上
出願人 セイコーエプソン株式会社
代理人 弁理士 最 上 務 他1名vJ1図 (a
)
箋1図 (b)
属1図(C)
第1図(e)
箋1図 (1)
冗1図 (g)
第2図 (a)
第2図 (b)
第2図 (C)FIG. 1+a) is a plan view of a channel substrate according to the present invention. 10... Channel substrate 11... Channel 1 FIG. 1cI is a sectional view of the channel forming substrate of the present invention. 12...Lid plate 1. FIG. 1cI is a plan view of the nozzle substrate of the present invention. 13... Nozzle board 14... Nozzle 15... Groove FIG. 1 ((1) is a right side view of the nozzle board of the present invention. 15... Groove FIG. 1+e) is a sectional view of the nozzle hole machining according to the present invention. FIG. 1 ( ) is a diagram of the connection between the flow path forming substrate and the nozzle substrate of the present invention. FIG. 1 tg+ is a diagram showing an application example in which grooves are also provided between the nozzles of the present invention. ...Groove between nozzles Fig. 2(a) is a plan view of a conventional flow path forming substrate.1...Substrate 3...Flow path 4...・Nozzle Figure 2 tb+ is a sectional view of a conventional flow path forming substrate. 2... Lid plate 5... Groove Figure 2 (C1 is a sectional view of a conventional nozzle part. Person Seiko Epson Co., Ltd. Representative Patent attorney Tsutomu Mogami and 1 other person vJ1 diagram (a
) Figure 1 (b) Figure 1 (C) Figure 1 (e) Figure 1 (1) Figure 1 (g) Figure 2 (a) Figure 2 (b) Figure 2 (C)
Claims (2)
ズル部を形成した基板との接合によりヘッド基板を構成
することを特徴とするインクジェットヘッド基板。(1) An inkjet head substrate characterized in that the head substrate is constructed by joining a substrate whose flow path pattern does not include a nozzle portion and a substrate on which a nozzle portion is formed.
クジェットヘッド基板。(2) The inkjet head substrate according to item 1 above in an on-demand system.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14039787A JPS63303754A (en) | 1987-06-04 | 1987-06-04 | Ink jet head substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14039787A JPS63303754A (en) | 1987-06-04 | 1987-06-04 | Ink jet head substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63303754A true JPS63303754A (en) | 1988-12-12 |
Family
ID=15267840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14039787A Pending JPS63303754A (en) | 1987-06-04 | 1987-06-04 | Ink jet head substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63303754A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5588597A (en) * | 1993-09-03 | 1996-12-31 | Microparts Gmbh | Nozzle plate for a liquid jet print head |
US6668454B2 (en) * | 1997-12-10 | 2003-12-30 | Canon Kabushiki Kaisha | Method for manufacturing a liquid-discharging recording head |
JP2008006809A (en) * | 2006-05-31 | 2008-01-17 | Konica Minolta Holdings Inc | Manufacturing method of silicon nozzle plate and manufacturing method of inkjet head |
JP2011084061A (en) * | 2009-09-15 | 2011-04-28 | Ricoh Co Ltd | Liquid ejection head, manufacturing method thereof, and image forming apparatus |
-
1987
- 1987-06-04 JP JP14039787A patent/JPS63303754A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5588597A (en) * | 1993-09-03 | 1996-12-31 | Microparts Gmbh | Nozzle plate for a liquid jet print head |
US6668454B2 (en) * | 1997-12-10 | 2003-12-30 | Canon Kabushiki Kaisha | Method for manufacturing a liquid-discharging recording head |
JP2008006809A (en) * | 2006-05-31 | 2008-01-17 | Konica Minolta Holdings Inc | Manufacturing method of silicon nozzle plate and manufacturing method of inkjet head |
JP2011084061A (en) * | 2009-09-15 | 2011-04-28 | Ricoh Co Ltd | Liquid ejection head, manufacturing method thereof, and image forming apparatus |
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