JPH1191117A - Manufacture of ink jet printer head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To bond a top plate and a nozzle plate to a substrate without protruding an adhesive into an ink chamber. SOLUTION: A plurality of trenches 9 are made in a flat adhesive plane 18 on one side of a substrate 4 and filled with a sublimation substance 17 which takes solid state under normal temperature and pressure. The sublimation substance 17 protruding from the adhesive plane 18 is removed by machining thus forming a substantially flat plane having no recess by the adhesive plane 18 and the sublimation substance 17. A top plate is then bonded to the flat plane through a adhesive and the sublimation substance 17 is removed from the trench 9 after the top plate is bonded to the substrate 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a line type ink jet printer head by an on-demand system.

[0002]

2. Description of the Related Art Conventionally, in this type of line type ink jet printer head, the arrangement pitch of ink ejection ports for ejecting ink droplets is extremely high, and in the field of manufacturing technology, manufacturing technology in a micromachine is required. . Therefore, formation of an ink chamber by groove processing in an ink jet printer head and the like correspond to a fine processing portion of a micro machine. In the manufacture of an ink jet printer head, a substrate having a large number of grooves, a top plate for forming an ink chamber, a nozzle plate having ink ejection ports, and the like are integrated with each other by bonding. Therefore, the use of an adhesive for micro components has become an essential requirement.

At present, micromachines or MEMS
Research on micromachines called (Micro Electro Mechanical Systems) has been earnestly researched and developed around the world.
Such micromachines have been realized as micromachines (motors and the like) by applying semiconductor microfabrication technology, and have come to attract attention at once. On the other hand, research on miniaturizing conventional industrial products is also being actively conducted at the same time. M
As represented by EMS, micromachines using semiconductor processes (etching and lithography) generally do not require assembly or adjustment, and can realize a system integrated with electronic circuits and sensors on one substrate. It is said to be. However, at present, the structure of a MEMS using a semiconductor process is far from a three-dimensional structure, so that a method of manufacturing a three-dimensional micromachine has been researched and developed at present. In addition, in the conventional microfabrication of machines, development has been carried out in a form that takes over the conventional method of assembling smaller parts and devices three-dimensionally, and is very important in assembling micromachines. Micro factory technology such as joining technology, handling technology and transport technology has been researched and developed. Under these circumstances, manufacturing of micromachines using semiconductor technology,
Alternatively, in the production of micromachines by conventional techniques, it is very important to create a three-dimensional structure by joining and bonding components, devices, and the like. This is because, in a micromachine, it is very difficult to use the joining and the like using screws, which are widely used in current machines, because the machine is minute. From this point of view, especially in micromachines utilizing a semiconductor process, Si
Bonding technologies that do not use various adhesives, such as direct bonding between substrates and anodic bonding between a Si substrate and a glass substrate, have been developed.
On the other hand, in the conventional micromachine, only the joining by a magnet (not the strong joining but the temporary joining) and the joining technique using an adhesive described later are merely developed.

Although not specifically described herein, a micromachine usually has a component or a device having a micromachined portion such as a micro gap, a micro movable portion, a membrane, a diaphragm, and the like. is there. When such parts and devices are joined together to assemble a micromachine, the protrusion of the adhesive into the micromachined portion is a very serious problem. For example, if the microfabricated part is a movable part and the adhesive protrudes into the movable part, the movable part is fixed and cannot move. Micro machines
If it can be composed entirely of a material such as Si or glass, it is possible to join and assemble directly or using anodic bonding as described above, and there will be no major problem such as sticking out of the adhesive, but parts and equipment It is not the case that all can be made of materials such as Si, glass, etc., but metal, plastic, rubber, ceramic, etc.
It is usually composed of various materials. From these points,
Alternatively, bonding with an adhesive is very important for assembling a micromachine from the viewpoint that bonding in a low-temperature process is possible.

[0005] The bonding of micro parts and devices using an adhesive is described in The Ninth Annual International Workshop.
on Micro Electro Mechnical Systems,
[FABRICATION OF MICROCOMPONENTS USING ADHESIVE BO
NDING TECHNIQES]. First, an example of the bonding technique shown in this paper will be briefly described. 1) A method in which, for example, the components are aligned with each other using a guide pin and pressed, and then joined by using a capillary phenomenon of a contact surface between the components so that the adhesive does not enter the concave portion and the opening. Devise the shape of the opening. 2) When bonding a membrane or the like, a cavity portion for injecting an adhesive is formed on the opposing member surface, the membrane and the surface on which the cavity is formed are pressed, and the adhesive is injected into the cavity portion and cured. How to let. 3) A new method of the bonding method utilizing the capillary phenomenon between closely-contacted surfaces described in 1) is shown. A glass plate is to be bonded to a component having a movable part formed on a substrate. However, this is a case where the clearance of the movable part is as small as about 1 μm. If a conventional bonding method using capillary action is used (the inner wall is brought into close contact with the glass plate, a very small amount of adhesive [for example, several nanoliters] is injected between the surfaces using capillary action), Even if the amount is very strictly controlled, the adhesive will protrude into the clearance, and the drive unit will adhere to the wall. In order to solve this problem, an outer wall is provided on the outer side of the inner wall, and bonding is performed at the outer wall portion.

Next, known examples of the sublimable substance used in the present invention will be described. First, JP-A-63-4185
No. 5 discloses a method of forming a protective film temporarily by spin-coating a solvent of a sublimable substance on a mask substrate to prevent dust from adhering to the mask substrate. .

Alternatively, as disclosed in JP-A-8-18069 and JP-A-8-258035,
Filling the microstructure (cavity or movable part) with a sublimable substance to protect the sublimable substance from damage of micromachines during machining such as dicing, prevention of intrusion of chips, and prevention of water intrusion. Or a method of using as a solvent for preventing sticking of a micromachine. However, there is no description about using the sublimable substance in an assembling step such as a bonding step or processing a filled sublimable substance.

[0008]

A groove formed on a substrate of an ink jet printer head has a width of 100 μm.
Since the depth is several hundred μm, it is very difficult to fix the top plate with an adhesive to close those grooves. That is, it is difficult to bond the top plate to prevent the adhesive from flowing into the groove portion and to ensure the cutoff between the grooves serving as the ink chambers. In addition, in an ink jet printer head, it is necessary to bond a nozzle plate to an end surface of a head body formed by a substrate and a top plate, and it is desired to simplify a process of bonding each member.

[0009]

According to the first aspect of the present invention,
A plurality of grooves are formed on a flat adhesive surface on one side of the substrate, and these grooves are filled with a solid sublimable substance under normal temperature and normal pressure, and the sublimable substance protruding from the adhesive surface is removed by machining. Forming a substantially flat surface without dents due to the bonding surface and the sublimable substance, bonding a top plate to the flat surface with an adhesive, bonding the substrate and the top plate, and then forming The sublimable substance is removed. Therefore, when bonding the top plate to the substrate, the bonding surface is flat,
The top plate can be easily bonded in a state where the adhesive does not wrap around, the volume of each ink chamber can be made uniform, and the volume of ejected ink droplets can be kept constant to improve print quality. It can be enhanced.

According to a second aspect of the present invention, there is provided a substrate on which at least one or more piezoelectric members polarized in a thickness direction are laminated, and a plurality of grooves and at least a portion separating the grooves are formed on the substrate. Side walls made of a member are formed at equal intervals, electrodes for applying a voltage to the piezoelectric members forming the side walls, and wiring patterns connected to these electrodes are formed on the substrate, and a top covering the top of the groove is formed. In a method for manufacturing an ink jet printer head, wherein a plurality of ink chambers are formed by attaching a plate and a nozzle plate covering a front portion of the groove, a solid sublimable substance is formed in each groove of the substrate at normal temperature and normal pressure. Is filled, and the sublimable material protruding from the surface of the substrate is removed by machining to form a substantially flat surface without dents due to the surface of the substrate and the sublimable material. Forming a head main body by adhering the top plate by adhesive, in which so as to remove the sublimation material in the groove after bonding the substrate and the top plate. Therefore, when the top plate is bonded to the substrate, the bonding surface is flat, and the bonding of the top plate can be easily performed in a state where the adhesive does not wrap around, and the piezoelectric member locally biases the substrate. Ink chambers can be formed without applying excessive stress, and the volume of each ink chamber can be made uniform, thereby improving the print quality by keeping the volume of ink droplets ejected constant. You can do it.

According to a third aspect of the present invention, in the first or second aspect of the invention, after the substrate and the top plate are bonded, the substrate and the top plate are integrated before removing the sublimable substance. The head body is divided into a plurality of divided head bodies, and after the division, the sublimable substance in the groove of the head body is removed. Therefore, productivity can be significantly improved.

According to a fourth aspect of the present invention, there is provided a substrate on which at least one or more piezoelectric members polarized in a thickness direction are laminated, and a plurality of grooves and at least a part separating the grooves are formed on the substrate. Side walls made of a member are formed at equal intervals, electrodes for applying a voltage to the piezoelectric members forming the side walls, and wiring patterns connected to these electrodes are formed on the substrate, and a top covering the top of the groove is formed. In a method for manufacturing an ink jet printer head, wherein a plurality of ink chambers are formed by attaching a plate and a nozzle plate covering a front portion of the groove, a solid sublimable substance is formed in each groove of the substrate at normal temperature and normal pressure. Is filled, and the sublimable material protruding from the surface of the substrate is removed by machining to form a substantially flat surface without dents due to the surface of the substrate and the sublimable material. A top plate with an adhesive to form a head body, and a flattening process for making the substrate and the top plate on the same end surface of the head body, and sublimation in the groove after the flattening process It is intended to remove sexual substances. Therefore, since the flattening process is performed in a state where the substrate is reinforced by the sublimable substance, there is no possibility that cracks may be generated on the side wall of the substrate forming the ink chamber, and a soft electrode may protrude from the bonding surface of the nozzle plate. ,
Cracks do not occur in the protective film.

According to a fifth aspect of the present invention, there is provided a substrate on which at least one or more piezoelectric members polarized in the thickness direction are laminated, and a plurality of grooves and at least a part separating the grooves are formed on the substrate. Side walls made of a member are formed at equal intervals, electrodes for applying a voltage to the piezoelectric members forming the side walls, and wiring patterns connected to these electrodes are formed on the substrate, and a top covering the top of the groove is formed. In a method for manufacturing an ink jet printer head, wherein a plurality of ink chambers are formed by attaching a plate and a nozzle plate covering a front portion of the groove, a solid sublimable substance is formed in each groove of the substrate at normal temperature and normal pressure. Is filled, and the sublimable material protruding from the surface of the substrate is removed by machining to form a substantially flat surface without dents due to the surface of the substrate and the sublimable material. A head plate is formed by bonding a top plate to the head plate with an adhesive, and a flattening process is performed on the end surface of the head body so that the substrate and the top plate are flush with each other. A plurality of ink discharge ports are formed in the bonded nozzle plate so as to match the positions of the grooves, and the sublimable substance in the grooves is removed through these ink discharge ports. It is. Therefore, the ink chamber can be formed without locally biasing the substrate by the piezoelectric member,
In addition, the volumes of the respective ink chambers can be made uniform, whereby the volume of the ejected ink droplets can be made constant to improve the printing quality.

[0014]

FIG. 1 shows a first embodiment of the present invention.
7 will be described with reference to FIG. First, the structure of an inkjet printer head 1 employed in an on-demand type inkjet printer using a piezoelectric member is shown in FIGS. That is, the inkjet printer head 1 has a laminated substrate 4 composed of a lower substrate 2 and an upper substrate 3 at least one of which is made of a piezoelectric member.
After the head body 6 is formed by integrating the head body 6 with the top plate 5 by bonding, a nozzle plate 8 having a thickness of about 10 to 100 μm
The structure is adhered. More specifically, the substrate 4 is formed with a large number of grooves 9 which reach from the upper surface of the upper substrate 3 to the inside of the lower substrate 2, and have a front portion 7 opened and a rear portion closed. That is, the groove 9
Is formed by opening one surface of the head main body 6 and the front portion 7, and is ground in parallel by a diamond wheel or the like of a dicing saw used for cutting an IC wafer. Further, electrodes 10 and wiring patterns 11 are formed in the grooves 9 by electroless nickel plating so as to extend from the rear portions of the grooves 9 to the rear end of the upper surface of the substrate 4. A drive circuit is connected to the wiring pattern 11 by an FPC or the like. At this time, each of the grooves 9 formed in the substrate 4 is cut off by the side walls 12 and the top plate 5 formed on both sides of the grooves 9 to form an ink chamber 13 also serving as an ink flow path. Further, a common liquid chamber 14 serving as an ink supply port communicating with all of these ink chambers 13 is provided.
Is formed on the lower surface of the top plate 5, and the top plate 5 is formed with ink supply ports 15 communicating with both side portions of the common liquid chamber 14. Further, the nozzle plate 8 is formed with an ink discharge port 16 which is opened for each of the ink chambers 13. Thus, the size of the groove 9 in the substrate 4 varies depending on the specifications of the inkjet printer head 1,
For example, the depth of the groove 9 is 0.4 mm, the groove width is 80 μm, and the length of the groove 9 is about 10 mm.

In such a configuration, the side walls 12 located on both sides of the ink chamber 13 which is driven in a state where the ink is supplied to the ink chamber 13 of the head body 6 are curved by shear mode deformation and gradually separated from each other. The ink droplets are ejected from the ink ejection port 16 by rapidly returning to the initial position and pressurizing the ink in the ink chamber 13. At this time, in order to prevent crosstalk, driving is performed such that the even-numbered ink chambers 13 and the odd-numbered ink chambers 13 are alternately pressed by the side walls 12. In addition, since the cross-sectional shape of the ink discharge port 16 is formed in a tapered shape such that the rear portion is expanded and the front portion is reduced, the ink pressurized in the ink chamber 13 is discharged efficiently.

Next, a process of bonding the top plate 5 to the substrate 4 in the process of manufacturing the ink jet printer head 1 having the above-described structure will be described with reference to FIGS. First, FIG.
(a) As shown in (b), the sublimable substance 17 is filled. The filling of the sublimable substance 17 is performed until the filled sublimable substance 17 rises from the bonding surface 18 of the substrate 4. However, if the protrusion of the sublimable substance 17 is large, the polishing step in the subsequent flattening step becomes long. Therefore, it is desirable to suppress the protrusion to a minimum height. If the protrusion is too high, it is advisable to use a dropper or the like to absorb the liquid in a molten state. However, it should be noted that the opening of the front portion 7 of the head main body 6 is desirably completely covered with the sublimable substance 17 as shown in the figure. By doing so, it becomes possible to completely fill the sublimable substance 17 up to the tip of the groove 9 on the nozzle plate 8 side. If this is not done, the sublimable substance 17 will be completely
When the top plate 5 is adhered, the adhesive protrudes from the front part 7 to which the nozzle plate 8 is adhered, and the opening of the ink chamber 13, particularly, the part where the sublimable substance 17 is not properly filled. It is because it covers. If only the adhesive is protruded, the adhesive can be removed by shaving the adhesive. However, when the adhesive covers the opening of the ink chamber 13 and the adhesive enters the groove 9, the front part 7 of the head main body 6 is removed. That is, the substrate 4 and the top plate 5 must be polished. Even if it is only polished, since the penetration amount differs in each part, it is not possible to judge how much should be polished, and the working efficiency becomes very poor. When the opening of the ink chamber 13 is closed, it means that the ink does not fly, which is a serious defect.

The substrate 4 having the groove 9 filled with the sublimable substance 17 is subjected to a flattening process on the adhesive surface 18 as shown in FIGS. 5 (a) and 5 (b). That is, the sublimable substance 17 protruding from the bonding surface 18 is removed by machining to form a substantially flat surface without any depression due to the bonding surface 18 and the sublimable substance 17. After the flattening process, the top plate 5 is bonded as shown in FIGS. When the sublimable substance 17 is not filled, the adhesive in the groove 9 is kept even if the thickness of the applied adhesive (usually applied to the top plate 5) or the pressing pressure is strictly controlled. It often occurred that it protruded. The protrusion affects the flying of the ink (the amount of the flying droplet varies greatly among the ink discharge ports 16), and greatly affects the product yield. However, by filling the sublimable substance 17 as described above, even if the thickness of the adhesive, the pressing pressure, and the like fluctuate, the overflow of the adhesive into the groove 9 is completely prevented.
This means that the volume of the ink chamber 13 is completely equal for each individual ink chamber 13,
Is equivalent for all ink chambers 13, which means that the volume of flying ink droplets is equal for each ink ejection port 16, and that the printing quality is greatly improved. When comparing the droplet volume of each ink ejection port 16 of the ink jet printer head 1 actually manufactured by this method, in fact, the dot diameter printed on paper, the variation is much smaller than in the case of normal bonding. became.
In addition, when the top plate 5 is bonded, the adhesive protrudes from the front portion 7 to which the nozzle plate 8 is bonded. Therefore, in practice, a process for removing the protruding adhesive from the front portion 7 is performed.

Next, since the front face 7 side of the groove 9 is open, the sublimable substance 17 is sublimated and removed from the front face 7 and the ink supply port 15 of the top plate 5. Next, as a final step, as shown in FIG.
The nozzle plate 8 was adhered. Here, sublimable substance 1
The reason for bonding the nozzle plate 8 after removing the nozzle 7 is that the nozzle plate 8 has an ink ejection port 1 of several tens μmφ.
This is because the adhesive 6 protrudes into the ink discharge port 16 when the sublimable substance 17 is filled in the groove 9 because a large number of the sublimable substances 6 are provided.

FIGS. 8 to 1 show a second embodiment of the present invention.
2 will be described. The present embodiment relates to a polishing process of the front portion 7 to which the nozzle plate 8 is bonded, that is, a flattening process including removal of the protruding adhesive.
As described above, the sublimable substance 17 is filled in the groove 9 of the substrate 4 as shown in FIG. Thereafter, as shown in FIG. 9, a flattening process is performed on the bonding surface 18 of the top plate 5 and the sublimable substance 17. Next, the top plate 5 is bonded as shown in FIG. At this time,
It is very difficult to position the top plate 5 exactly on the front portion 7 of the substrate 4 which is the bonding surface to which the nozzle plate 8 is bonded. In addition, the protrusion of the adhesive cannot be completely eliminated. As for the alignment, the front portion 7 of the substrate 4 is flattened, and this surface can be adjusted to about several tens of μm by positioning with a pin or the like using this surface as a reference surface. And nozzle plate 8
Bonding is very difficult and presents a major problem. That is, (1) If there is a step, the orifice cannot be vertically bonded to the recess.

(2) In order to prevent the ink from leaking from the gap between the steps, it is necessary to make the adhesive very thick (at least the distance between the steps: several tens μm or more). As a result, the protrusion of the adhesive into the groove 9 becomes conspicuous.

(3) Also in the bonding of the nozzle plate 8 (drilling with a laser later), the thickness of the adhesive fluctuates similarly to the above (2), and the laser drilling diameter (ink ejection port 1) is changed.
6) becomes large.

The following problem arises. In addition, the adhesive itself cannot be prevented from protruding.

As described above, the nozzle plate 8 of the top plate 5
(FIG. 10 shows only the protruding state, but it is the same even if it is retracted) and the problem of the adhesive protruding. It is necessary to perform a flattening process (polishing process) on the front portion 7 to which the plate 8 is bonded. This step is desirably performed with the sublimable substance 17 filled as described above. If the top 5 is protruding, basically the top 5
And the sublimable substance 17 are polished. When the top plate 5 is concave, the sublimable substance 17 and the substrate 4 are basically polished. Actually, although not shown, the top plate tilts in the longitudinal direction of the head, so that the top plate 5, the sublimable substance 17, and the substrate 4 are polished together. FIG. 11 shows this. On this occasion,
Since the sublimable substance 17 is filled, it is possible to prevent a solvent such as an abrasive and water from entering the ink chamber 13 during polishing. Also, the side wall 12 of the very fragile substrate 4
There is also an effect of reinforcing the strength of the electrode 10 or an effect of reinforcing the electrode 10 and the protective film formed on the inner wall of the groove 9. Therefore, the sublimable substance 17 plays a useful role in the next step instead of being removed as it is by using it for bonding. In such a case, it is desirable to remove the substance when it is no longer necessary. It is. Next, the groove 9
Is removed, and the nozzle plate 8 is adhered. This is the state shown in FIG.

In the state shown in FIG. 12, it is also useful to bond the nozzle plate 8 on which the ink discharge ports 16 are not formed. In this case, bonding is performed on the nozzle plate 8 having no hole formed therein while the sublimable substance 17 is filled, and then laser processing is performed with the sublimable substance 17 filled in the groove 9. To form an ink discharge port 16 and finally remove the sublimable substance 17.

Next, a third embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIGS. In each of the above-described embodiments, the case where one inkjet printer head 1 is manufactured from one substrate 4 (although it is possible to divide the inkjet printer head 1 into a plurality in the longitudinal direction). In the embodiment, a case where a large number of substrates can be obtained from one substrate 4 will be described. First, as shown in FIGS. 13A and 13B, a large number of grooves 9 are formed in parallel on the inside of the substrate 4 so that both end portions do not penetrate the side surface. Such a groove 9
Is filled with a sublimable substance 17 as shown in FIG. Thereafter, as shown in FIG. 15, the bonding surface 18 for bonding the top plate 5 is formed.
And the sublimation material 17 are flattened. And FIG.
As shown in 6, the top plate 5 is bonded with an adhesive. afterwards,
As shown in FIG. 17, the groove 9 is cut at a central portion in a direction orthogonal to the grooves 9 and divided into two parts. This cutting step is desirably performed before removing the sublimable substance 17. This is because it is possible to reinforce the strength of the side wall 12 of the substrate 4 or to prevent a solvent such as water or cutting waste from entering the groove 9 in the cutting step. Next, as shown in FIG. 18, the cut surface, that is, the front portion 7 to which the nozzle plate 8 is bonded is polished. This is because the surface formed only by the cutting process has severe irregularities and prevents the electrode 10 formed in the groove 9 from protruding from the bonding surface of the nozzle plate 8 (because it is soft), or
Preventing cracks and peeling from occurring on the protective film,
Alternatively, it is for preventing the occurrence of minute cracks on the top plate 5 and the side wall 12. In order to remove such defects, flattening by polishing is necessary. This flattening process is also desirably performed in a state where the sublimable substance 17 is filled, as described above. Finally,
As shown in FIG. 19, the nozzle plate 8 is bonded. The nozzle plate 8 may be bonded by bonding the nozzle plate 8 having the ink discharge ports 16 formed thereon as described above or by simply bonding the nozzle plate 8 having no ink discharge ports 16 formed thereon. Depending on whether the laser processing is performed, it is only necessary to select whether the processing is performed with the sublimable substance 17 filled or after the removal. In addition, in the case of multi-cavity, not only the two-cavity shown here, but also a multi-cavity substrate is formed by connecting a plurality of such structures to a piezoelectric member. .

[0026]

According to the first aspect of the present invention, a plurality of grooves are formed on a flat bonding surface on one surface of a substrate, and these grooves are filled with a solid sublimable substance at normal temperature and normal pressure. The sublimable material that has protruded is removed by machining to form a substantially flat surface without dents due to the bonding surface and the sublimable material, and a top plate is bonded to the flat surface with an adhesive, and the substrate is bonded. After the sublimable substance in the groove is removed after bonding the top plate to the top plate, the bonding surface is flat when the top plate is bonded to the substrate, and the top surface in a state where the adhesive does not wrap around. The plates can be easily bonded, and the volumes of the ink chambers can be made uniform. This has the effect of improving the print quality by keeping the volume of ink droplets to be discharged constant.

According to a second aspect of the present invention, there is provided a substrate on which at least one or more piezoelectric members polarized in a plate thickness direction are laminated, and a plurality of grooves and at least a part separating the grooves are formed on the substrate. Side walls made of a member are formed at equal intervals, electrodes for applying a voltage to the piezoelectric members forming the side walls, and wiring patterns connected to these electrodes are formed on the substrate, and a top covering the top of the groove is formed. In a method for manufacturing an ink jet printer head, wherein a plurality of ink chambers are formed by attaching a plate and a nozzle plate covering a front portion of the groove, a solid sublimable substance is formed in each groove of the substrate at normal temperature and normal pressure. Is filled, and the sublimable material protruding from the surface of the substrate is removed by machining to form a substantially flat surface without dents due to the surface of the substrate and the sublimable material. The head body is formed by bonding a top plate with an adhesive to remove the sublimable substance in the groove after bonding the substrate and the top plate, so that the top plate is bonded to the substrate. The bonding surface is flat, so that the top plate can be easily bonded without the adhesive sneaking around, and the ink chamber can be formed without applying localized bias to the substrate by the piezoelectric member. Can be performed, and the volumes of the ink chambers can be made uniform. This has the effect of improving the print quality by keeping the volume of the ejected ink droplets constant.

According to a third aspect of the present invention, in the first or second aspect of the invention, after the substrate and the top plate are bonded, the substrate and the top plate are integrated before removing the sublimable substance. Divided into multiple head bodies, and after the division, the sublimable substance in the groove of the head body was removed.
Productivity can be greatly improved.

According to a fourth aspect of the present invention, there is provided a substrate on which at least one or more piezoelectric members polarized in the thickness direction are laminated, and a plurality of grooves and at least a portion separating the grooves are formed on the substrate. Side walls made of a member are formed at equal intervals, electrodes for applying a voltage to the piezoelectric members forming the side walls, and wiring patterns connected to these electrodes are formed on the substrate, and a top covering the top of the groove is formed. In a method for manufacturing an ink jet printer head, wherein a plurality of ink chambers are formed by attaching a plate and a nozzle plate covering a front portion of the groove, a solid sublimable substance is formed in each groove of the substrate at normal temperature and normal pressure. Is filled, and the sublimable material protruding from the surface of the substrate is removed by machining to form a substantially flat surface without dents due to the surface of the substrate and the sublimable material. A top plate with an adhesive to form a head body, and a flattening process for making the substrate and the top plate on the same end surface of the head body, and sublimation in the groove after the flattening process Since the non-reactive substance is removed, the flattening process is performed in a state reinforced by the sublimable substance, so that there is no possibility that cracks will occur on the side wall of the substrate forming the ink chamber, and the nozzle plate This has the effect that the soft electrode does not protrude from the bonding surface and no crack is generated in the protective film.

According to a fifth aspect of the present invention, there is provided a substrate on which at least one or more piezoelectric members polarized in the thickness direction are laminated, and a plurality of grooves and at least a part separating the grooves are formed on the substrate. Side walls made of a member are formed at equal intervals, electrodes for applying a voltage to the piezoelectric members forming the side walls, and wiring patterns connected to these electrodes are formed on the substrate, and a top covering the top of the groove is formed. In a method for manufacturing an ink jet printer head, wherein a plurality of ink chambers are formed by attaching a plate and a nozzle plate covering a front portion of the groove, a solid sublimable substance is formed in each groove of the substrate at normal temperature and normal pressure. Is filled, and the sublimable material protruding from the surface of the substrate is removed by machining to form a substantially flat surface without dents due to the surface of the substrate and the sublimable material. A head plate is formed by bonding a top plate to the head plate with an adhesive, and a flattening process is performed on the end surface of the head body so that the substrate and the top plate are flush with each other. Since a plurality of ink discharge ports are formed in the bonded nozzle plate in accordance with the positions of the grooves, the sublimable substance in the grooves is removed through these ink discharge ports. In addition, the ink chambers can be formed without locally biasing the substrate by the piezoelectric member, and the volumes of the respective ink chambers can be made uniform. Has an effect that the print quality can be improved by keeping the constant.

[Brief description of the drawings]

FIG. 1 is a perspective view of a first embodiment of the present invention, in which an inkjet printer head is partially cut away.

FIG. 2 is a plan view thereof.

FIG. 3 is a side view thereof.

FIGS. 4A and 4B schematically show a state in which a sublimable substance is filled in a groove of a substrate, wherein FIG. 4A is a side view and FIG. 4B is a front view.

FIGS. 5A and 5B show a state in which the protruding sublimable substance is removed by machining to be flattened, wherein FIG. 5A is a side view and FIG. 5B is a front view.

6A and 6B show a state in which a top plate is adhered, wherein FIG. 6A is a side view and FIG. 6B is a front view.

FIG. 7 is a side view of a state where the nozzle plate is bonded.

FIG. 8 schematically shows the second embodiment of the present invention, and is a side view showing a state in which a sublimable substance is filled in a groove of a substrate.

FIG. 9 is a side view showing a state in which the protruding sublimable substance is removed by machining to be flattened.

FIG. 10 is a side view showing a state where a top plate is bonded.

FIG. 11 is a side view showing a state where a front part to which the nozzle plate is bonded is flattened.

FIG. 12 is a side view showing a state where the nozzle plate is bonded.

13 schematically shows a third embodiment of the present invention, wherein (a) is a side view and (b) is a plan view. FIG.

FIG. 14 is a side view showing a state in which a sublimable substance is filled in a groove of a substrate.

FIG. 15 is a side view showing a state in which the protruding sublimable substance is removed by machining to be flattened.

FIG. 16 is a side view showing a state where a top plate is bonded.

FIG. 17 is a side view showing a state of being cut into two parts from the center.

FIG. 18 is a side view of a state where a top plate is bonded.

FIG. 19 is a side view of a state where the nozzle plate is bonded.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ink-jet printer head 4 Substrate 5 Top plate 6 Head main body 7 Front part 8 Nozzle plate 9 Groove 10 Electrode 11 Wiring pattern 12 Side wall 13 Ink chamber 16 Ink ejection port 17 Sublimable substance 18 Adhesive surface

Claims (5)

[Claims] 1. A plurality of grooves are formed on a flat adhesive surface on one surface of a substrate, and these grooves are filled with a solid sublimable substance at normal temperature and normal pressure, and the sublimable substance protruding from the adhesive surface is filled with the grooves. It was removed by machining to form a substantially flat surface without dents due to the adhesive surface and the sublimable substance, a top plate was bonded to this flat surface with an adhesive, and the substrate and the top plate were bonded. A method for manufacturing an ink jet printer head, wherein the sublimable substance in the groove is removed later. 2. A substrate is formed by laminating at least one or more piezoelectric members polarized in a plate thickness direction. The substrate includes a plurality of grooves and a side wall at least partially separating the grooves from the piezoelectric members. Electrodes formed at equal intervals and for applying a voltage to the piezoelectric member forming the side wall and a wiring pattern connected to these electrodes are formed on the substrate, and a top plate covering an upper portion of the groove and a front surface of the groove are formed. A plurality of ink chambers formed by attaching a nozzle plate that covers a portion thereof, wherein each of the grooves of the substrate is filled with a solid sublimable substance at normal temperature and normal pressure; The sublimable material protruding from the surface is removed by machining to form a substantially flat surface without dents due to the surface of the substrate and the sublimable material, and a top plate is formed on the flat surface with an adhesive. A method of manufacturing an ink jet printer head, wherein a head body is formed by bonding, and the sublimable substance in the groove is removed after bonding the substrate and the top plate. 3. After bonding the substrate and the top plate, the substrate and the top plate are divided into a plurality of integrated head bodies before the sublimable substance is removed, and after the division, the grooves are formed in the grooves of the head body. 3. The method according to claim 1, wherein the sublimable substance is removed. 4. A substrate on which at least one or more piezoelectric members polarized in a plate thickness direction is laminated, and a plurality of grooves and a side wall at least a part of which separates these grooves is formed by the piezoelectric member. Electrodes formed at equal intervals and for applying a voltage to the piezoelectric member forming the side wall and a wiring pattern connected to these electrodes are formed on the substrate, and a top plate covering an upper portion of the groove and a front surface of the groove are formed. A plurality of ink chambers formed by attaching a nozzle plate that covers a portion thereof, wherein each of the grooves of the substrate is filled with a solid sublimable substance at normal temperature and normal pressure; The sublimable material protruding from the surface is removed by machining to form a substantially flat surface without dents due to the surface of the substrate and the sublimable material, and a top plate is formed on the flat surface with an adhesive. A head body is formed by bonding, and a flattening process is performed so that the substrate and the top plate on the end surface of the head body are flush with each other. After the flattening process, the sublimable substance in the groove is removed. A method for manufacturing an ink jet printer head, comprising: 5. A substrate is formed by laminating at least one or more piezoelectric members polarized in a thickness direction, and a plurality of grooves and a side wall at least part of which separates these grooves are formed by the piezoelectric members. Electrodes formed at equal intervals and for applying a voltage to the piezoelectric member forming the side wall and a wiring pattern connected to these electrodes are formed on the substrate, and a top plate covering an upper portion of the groove and a front surface of the groove are formed. A plurality of ink chambers formed by attaching a nozzle plate that covers a portion thereof, wherein each of the grooves of the substrate is filled with a solid sublimable substance at normal temperature and normal pressure; The sublimable material protruding from the surface is removed by machining to form a substantially flat surface without dents due to the surface of the substrate and the sublimable material, and a top plate is formed on the flat surface with an adhesive. The head body was formed by bonding, a flattening process was performed so that the substrate and the top plate on the end surface of the head body were flush with each other, and a nozzle plate was bonded to the flattened end surface and bonded. Forming a plurality of ink ejection ports in the nozzle plate in accordance with the positions of the grooves,
A method for manufacturing an ink jet printer head, wherein sublimable substances in the grooves are removed through these ink discharge ports.