JP3900277B2 - Method for manufacturing liquid jet head - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a liquid ejecting head that ejects liquid droplets, and in particular, pressurizes ink supplied to a pressure generation chamber that communicates with a nozzle opening that ejects ink droplets with a piezoelectric element, so that ink is ejected from the nozzle openings. The present invention relates to a method of manufacturing an ink jet recording head that ejects droplets.
[0002]
[Prior art]
A part of the pressure generation chamber communicating with the nozzle opening for discharging ink droplets is constituted by a vibration plate, and the vibration plate is deformed by a piezoelectric element to pressurize the ink in the pressure generation chamber to discharge ink droplets from the nozzle opening. Two types of ink jet recording heads have been put into practical use: those using a longitudinal vibration mode piezoelectric actuator that extends and contracts in the axial direction of the piezoelectric element, and those using a flexural vibration mode piezoelectric actuator. As an example of using an actuator in a flexural vibration mode, for example, a uniform piezoelectric material layer is formed over the entire surface of the diaphragm by a film forming technique, and this piezoelectric material layer is formed into a pressure generating chamber by a lithography method. A device in which a piezoelectric element is formed so as to be cut into a corresponding shape and independent for each pressure generating chamber is known.
[0003]
Further, in such an ink jet recording head, a reservoir serving as an ink chamber common to each pressure generating chamber is provided, and ink is supplied from this reservoir to each pressure generating chamber. As such a reservoir, there is a reservoir formed by communicating a communicating portion provided in a flow path forming substrate and a reservoir portion of the reservoir forming substrate through a through hole formed in an elastic film (for example, Patent Document 1).
[0004]
[Patent Document 1]
JP 2002-160366 A ([0056], FIG. 2)
[Patent Document 2]
Japanese Patent Laid-Open No. 5-112013 (page 5, FIG. 2)
[0005]
[Problems to be solved by the invention]
However, such a through hole that communicates the communication portion and the reservoir portion is formed by mechanically removing the diaphragm with a predetermined pin or the like, for example, so that broken pieces of the diaphragm are scattered. As a result, the adhering to the peripheral edge portion of the through hole remains, and this debris is mixed in the ink, thereby causing a problem of ejection failure such as nozzle clogging. Such a problem exists not only in an ink jet recording head that ejects ink, but also in a method of manufacturing another liquid ejecting head that ejects liquid other than ink.
[0006]
Here, when forming the discharge port by cutting a part of the flow path communicating with the liquid chamber together with the component member in which the liquid chamber or the like is formed, the foreign matter generated at the time of cutting enters the liquid chamber from the discharge port. In order to prevent this, there is a method of filling the fluid chamber in a pressurized state and cutting it (for example, see Patent Document 2). Such a method is useful when the end of the flow path is formed by cutting, but cannot be applied when forming a through hole in the middle of the flow path. Further, when this method is applied to a head using a piezoelectric element, there is a possibility that the diaphragm facing the liquid chamber (pressure generating chamber) may be destroyed by the pressure of the liquid.
[0007]
In view of such circumstances, it is an object of the present invention to provide a method of manufacturing a liquid jet head that can prevent nozzle clogging due to foreign matters such as diaphragm fragments.
[0008]
[Means for Solving the Problems]
According to a first aspect of the present invention for solving the above-described problem, a flow path forming substrate in which a pressure generating chamber communicating with a nozzle opening is formed, and a lower surface provided on one surface side of the flow path forming substrate via a diaphragm. In a method of manufacturing a liquid jet head comprising an electrode, a piezoelectric layer comprising a piezoelectric layer, and an upper electrode, the step of forming the diaphragm and the piezoelectric element on one side of the flow path forming substrate, and the flow path Etching from the other surface side of the formation substrate to the vibration plate to form a communication portion communicating with the pressure generation chamber at one end in the longitudinal direction of the pressure generation chamber, and the flow path formation substrate and the vibration Forming a penetrating portion that opens to the communicating portion in a region facing the communicating portion of the diaphragm in a state where the plate is immersed in a predetermined liquid; and cleaning the inside of the flow path including the penetrating portion; Characterized by having In the manufacturing method of the liquid ejecting head.
[0009]
In the first aspect, by forming the penetrating part in the liquid, foreign matters such as broken pieces of the diaphragm are not scattered. Further, the presence of the liquid can prevent foreign matter from adhering to the flow path due to static electricity or the like, and the foreign matter is reliably removed by the cleaning process.
[0010]
According to a second aspect of the present invention, in the first aspect, the liquid is a polyhydric alcohol.
[0011]
In the second aspect, the penetrating portion can be formed without adversely affecting the surroundings with the liquid.
[0012]
According to a third aspect of the present invention, in the second aspect, the polyhydric alcohol is any one of ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol, or glycerin. A method for manufacturing an ejection head is provided.
[0013]
In the third aspect, the penetrating portion can be formed without adversely affecting the surroundings with the liquid.
[0014]
According to a fourth aspect of the present invention, in any one of the first to third aspects, the liquid has a viscosity of 10 to 1000 (mPa · s).
[0015]
In the fourth aspect, by using a liquid having a predetermined viscosity, adhesion of foreign matters can be reliably prevented and the liquid can be removed relatively easily.
[0016]
According to a fifth aspect of the present invention, in any one of the first to fourth aspects, in the step of forming the penetrating portion, the flow path forming substrate and the diaphragm are immersed in a flowing liquid. The liquid jet head manufacturing method is characterized.
[0017]
In the fifth aspect, it is possible to more reliably prevent foreign matters from adhering to the inner surface of the flow path.
[0018]
According to a sixth aspect of the present invention, there is provided a flow path forming substrate in which a pressure generation chamber communicating with a nozzle opening is formed, a lower electrode provided on one surface side of the flow path forming substrate via a diaphragm, and a piezoelectric layer And a piezoelectric element including an upper electrode, and a step of forming the diaphragm and the piezoelectric element on one surface side of the flow path forming substrate, and the other surface of the flow path forming substrate. Etching from the side until reaching the diaphragm, forming a communication portion that communicates with the pressure generation chamber and one end in the longitudinal direction of the pressure generation chamber, and on the vibration plate in a region facing the communication portion A step of pouring liquid wax to solidify the liquid wax, a step of forming a through-hole opening in the communication portion in the vibration plate in a region facing the communication portion, and liquefying and removing the solidified wax. In the method of manufacturing a liquid jet head, characterized by a step of washing the flow path including Rutotomoni the penetrating portion.
[0019]
In such a sixth aspect, by providing a wax layer on the diaphragm, foreign substances such as broken pieces of the diaphragm adhere to the wax when the penetrating portion is formed, and scattering of the foreign substances is prevented.
[0020]
According to a seventh aspect of the present invention, in the sixth aspect, the through portion is formed when the diaphragm in a region facing the communication portion is cut and separated by a contraction force when the wax is solidified. In the method of manufacturing a liquid jet head, the process is omitted.
[0021]
In the seventh aspect, since the diaphragm is cut by the contraction force when the liquid wax is solidified, there is no need to further remove the diaphragm. Therefore, the manufacturing process can be remarkably simplified.
[0022]
According to an eighth aspect of the present invention, in the sixth or seventh aspect, the liquid jet head manufacturing method is characterized in that the wax is removed with warm water, a petroleum solvent, an alcohol, or an alkaline solution.
[0023]
In the eighth aspect, the wax can be removed easily and reliably.
[0024]
According to a ninth aspect of the present invention, in the liquid jet head manufacturing method according to any one of the sixth to eighth aspects, the melting point of the wax is 140 ° C. or lower.
[0025]
In the ninth aspect, the penetrating portion can be satisfactorily formed without adversely affecting the surroundings due to the heat of the wax.
[0026]
According to a tenth aspect of the present invention, in any one of the first to ninth aspects, in the step of forming the penetration portion, the diaphragm is removed by machining, laser processing, or liquid pressure. The method is for manufacturing a liquid jet head.
[0027]
In the tenth aspect, the through-hole can be formed by reliably and satisfactorily removing the diaphragm.
[0028]
According to an eleventh aspect of the present invention, in any one of the first to tenth aspects, the reservoir portion communicated with the communication portion via the penetration portion before the step of forming the pressure generation chamber and the communication portion. A method of manufacturing a liquid jet head, further comprising the step of joining a reservoir forming substrate having a surface to the surface of the flow path forming substrate on the piezoelectric element side.
[0029]
In the eleventh aspect, the rigidity of the flow path forming substrate is ensured by the reservoir forming substrate when the pressure generating chamber or the like is formed or when the through portion is formed.
[0030]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail based on embodiments.
(Embodiment 1)
FIG. 1 is an exploded perspective view showing an ink jet recording head according to Embodiment 1 of the present invention, and FIG. 2 is a plan view and a cross-sectional view of FIG. As shown in the figure, the flow path forming substrate 10 is made of a silicon single crystal substrate having a plane orientation (110) in the present embodiment, and has a thickness of 1 to 2 μm made of silicon dioxide previously formed by thermal oxidation on both surfaces. An elastic film 50 and a protective film 55 used as a mask when forming a pressure generation chamber to be described later are provided. The flow path forming substrate 10 is provided with pressure generating chambers 12 partitioned by a plurality of partition walls 11 in parallel in the width direction by performing anisotropic etching from the other direction side. A communication portion 13 constituting a part of a reservoir serving as a common ink chamber of the generation chamber 12 is formed, and the communication portion 13 is communicated with one longitudinal end portion of each pressure generation chamber 12 via an ink supply path 14. ing.
[0031]
Here, the anisotropic etching is performed by utilizing the difference in etching rate of the silicon single crystal substrate. For example, in this embodiment, when a silicon single crystal substrate is immersed in an alkaline solution such as KOH, the first (111) plane perpendicular to the (110) plane is gradually eroded, and the first (111) plane. And a second (111) plane that forms an angle of about 70 degrees with the (110) plane and an angle of about 35 degrees appears, and the (111) plane is compared with the etching rate of the (110) plane. This is performed using the property that the etching rate is about 1/180. By this anisotropic etching, precision processing can be performed based on the parallelogram depth processing formed by two first (111) surfaces and two oblique second (111) surfaces. The pressure generating chambers 12 can be arranged with high density.
[0032]
In the present embodiment, the long side of each pressure generating chamber 12 is formed by the first (111) plane and the short side is formed by the second (111) plane. Further, the pressure generation chamber 12 and the communication portion 13 are formed by etching until substantially reaching the elastic film 50 through the flow path forming substrate 10. Here, the amount of the elastic film 50 that is affected by the alkaline solution for etching the silicon single crystal substrate is extremely small. In addition, each ink supply path 14 communicating with one end of each pressure generation chamber 12 is formed shallower than the pressure generation chamber 12, and the flow path resistance of the ink flowing into the pressure generation chamber 12 is kept constant. That is, the ink supply path 14 is formed by etching the silicon single crystal substrate halfway in the thickness direction (half etching). Half etching is performed by adjusting the etching time.
[0033]
Note that the thickness of the flow path forming substrate 10 is selected in accordance with the density at which the pressure generating chambers 12 are disposed. For example, when the pressure generating chambers 12 are arranged at about 180 (180 dpi) per inch, the thickness of the flow path forming substrate 10 is preferably about 180 to 280 μm, more preferably about 220 μm. For example, when the pressure generating chambers 12 are arranged at a relatively high density of about 360 dpi, the thickness of the flow path forming substrate 10 is preferably 100 μm or less. This is because the arrangement density can be increased while maintaining the rigidity of the partition between adjacent pressure generating chambers.
[0034]
On the opening surface side of the flow path forming substrate 10, a nozzle plate 20 having a nozzle opening 21 communicating with the side opposite to the ink supply path 14 of each pressure generating chamber 12 is provided with an adhesive, a heat welding film, or the like. It is fixed through. The nozzle plate 20 has a thickness of, for example, 0.1 to 1 mm and a linear expansion coefficient of 300 ° C. or less, for example, 2.5 to 4.5 [× 10 ^-6 / ° C] glass ceramics or non-rust steel. The nozzle plate 20 entirely covers one surface of the flow path forming substrate 10 on one surface, and also serves as a reinforcing plate that protects the silicon single crystal substrate from impact and external force. Further, the nozzle plate 20 may be formed of a material having substantially the same thermal expansion coefficient as that of the flow path forming substrate 10. In this case, since the deformation by heat of the flow path forming substrate 10 and the nozzle plate 20 becomes substantially the same, it is possible to easily join using a thermosetting adhesive or the like. Here, the size of the nozzle opening 21 and the size of the pressure generating chamber 12 are optimized according to the amount of ink droplets to be ejected, the ejection speed, the ejection frequency, and the like. For example, when recording 360 ink droplets per inch, the nozzle opening 21 needs to be accurately formed with a diameter of several tens of μm.
[0035]
On the other hand, on the elastic film 50 provided on the flow path forming substrate 10, a lower electrode film 60 having a thickness of, for example, about 0.2 μm, and a piezoelectric layer having a thickness of, for example, about 0.5-3 μm. 70 and an upper electrode film 80 having a thickness of, for example, about 0.1 μm are laminated by a process described later to constitute the piezoelectric element 300. Here, the piezoelectric element 300 refers to a portion including the lower electrode film 60, the piezoelectric layer 70, and the upper electrode film 80. In general, one electrode of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure generating chamber 12. In addition, here, a portion that is configured by any one of the patterned electrodes and the piezoelectric layer 70 and in which piezoelectric distortion is generated by applying a voltage to both electrodes is referred to as a piezoelectric active portion 320. In this embodiment, the lower electrode film 60 is a common electrode of the piezoelectric element 300, and the upper electrode film 80 is an individual electrode of the piezoelectric element 300. However, there is no problem even if this is reversed for the convenience of the drive circuit and wiring. In either case, a piezoelectric active part is formed for each pressure generating chamber. Further, here, the piezoelectric element 300 and the vibration plate that is displaced by driving the piezoelectric element 300 are collectively referred to as a piezoelectric actuator. Note that each upper electrode film 80 that is an individual electrode of the piezoelectric element 300 is connected to a lead electrode 90 that is drawn to the vicinity of the end of the flow path forming substrate 10 and is connected to an external wiring (not shown).
[0036]
A reservoir forming substrate 30 having a reservoir portion 31 constituting at least a part of the reservoir 100 is joined to the flow path forming substrate 10 on which such a piezoelectric element 300 is formed. In this embodiment, the reservoir portion 31 is formed across the reservoir forming substrate 30 in the thickness direction and across the width direction of the pressure generating chamber 12. The reservoir portion 31 is communicated with the communicating portion 13 of the flow path forming substrate 10 through a through portion 110 provided so as to penetrate the diaphragm (the elastic film 50 and the lower electrode film 60). A reservoir 100 serving as a common ink chamber is configured. In addition, although mentioned later in detail, in this invention, discharge defects, such as nozzle clogging, are prevented by forming the penetration part 110 in the state which immersed the flow-path formation board | substrate 10 and the diaphragm in the liquid.
[0037]
Further, a piezoelectric element holding portion 33 capable of sealing the space is provided in a region facing the piezoelectric element 300 of the reservoir forming substrate 30 in a state where a space that does not hinder the movement of the piezoelectric element 300 is secured. . At least the piezoelectric active part 320 of the piezoelectric element 300 is sealed in the piezoelectric element holding part 33 to prevent the piezoelectric element 300 from being destroyed due to an external environment such as moisture in the atmosphere. As such a reservoir forming substrate 30, it is preferable to use a material substantially the same as the coefficient of thermal expansion of the flow path forming substrate 10, for example, glass, ceramic material, etc. For example, in this embodiment, the thickness is about 400 μm. It was formed using a silicon single crystal substrate which is the same material as the flow path forming substrate 10.
[0038]
A compliance substrate 40 composed of a sealing film 41 and a fixing plate 42 is bonded to the reservoir forming substrate 30. Here, the sealing film 41 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide (PPS) film having a thickness of 6 μm), and the sealing film 41 seals one surface of the reservoir portion 31. It has been stopped. The fixing plate 42 is made of a hard material such as metal (for example, stainless steel (SUS) having a thickness of 30 μm). Since the region of the fixing plate 42 facing the reservoir 100 is an opening 43 that is completely removed in the thickness direction, only one surface of the reservoir 100 is made of a flexible sealing film 41. The flexible portion 32 is sealed and can be deformed by a change in internal pressure. An ink inlet 35 for supplying ink to the reservoir 100 is formed on the compliance substrate 40 on the outer side of the central portion of the reservoir 100 in the longitudinal direction. Further, the reservoir forming substrate 30 is provided with an ink introduction path 36 that allows the ink introduction port 35 and the side wall of the reservoir 100 to communicate with each other.
[0039]
The ink jet recording head configured in this manner takes in ink from an ink introduction port 35 connected to an external ink supply unit (not shown), fills the interior from the reservoir 100 to the nozzle opening 21, and then fills the inside with an external (not shown). In accordance with a recording signal from the drive circuit, a voltage is applied between the upper electrode film 80 and the lower electrode film 60 to cause the elastic film 50, the lower electrode film 60, and the piezoelectric layer 70 to bend and deform, thereby causing the pressure generating chamber 12 to bend. The internal pressure increases and ink droplets are ejected from the nozzle openings 21.
[0040]
Hereinafter, a method for manufacturing such an ink jet recording head will be described with reference to FIGS. 3 and 4 are cross-sectional views of the pressure generating chamber 12 in the longitudinal direction. First, as shown in FIG. 3A, a silicon single crystal substrate wafer to be the flow path forming substrate 10 is thermally oxidized in a diffusion furnace at about 1100 ° C., thereby forming an elastic film 50 made of silicon dioxide and a pressure generating chamber. A protective film 55 is formed as a mask when forming 12. Next, as shown in FIG. 3B, for example, a lower electrode film 60 made of platinum or the like is formed on the entire surface of the elastic film 50 and then patterned into a predetermined shape. Next, as shown in FIG. 3C, a piezoelectric layer 70 made of, for example, lead zirconate titanate (PZT), and many metals such as aluminum, gold, nickel, platinum, or the like, or conductive The upper electrode film 80 made of an oxide or the like is sequentially laminated, and these are simultaneously patterned to form the piezoelectric element 300. Next, as shown in FIG. 3D, a lead electrode 90 made of, for example, gold (Au) or the like is formed over the entire surface of the flow path forming substrate 10 and patterned for each piezoelectric element 300.
[0041]
The above is the film forming process. Next, as shown in FIG. 4A, the reservoir forming substrate 30 on which the reservoir portion 31, the piezoelectric element holding portion 33, etc. are formed is joined to the surface of the flow path forming substrate 10 on the piezoelectric element 300 side by an adhesive or the like. To do. On the reservoir forming substrate 30, although not shown, a wiring pattern made of, for example, gold (Au) for mounting a driving IC for driving the piezoelectric element 300 is provided in advance. Next, as shown in FIG. 4B, the protective film 55 formed on the surface of the flow path forming substrate 10 opposite to the reservoir forming substrate 30 is patterned into a predetermined shape, and this protective film 55 is used as a mask. By performing the anisotropic etching using the alkaline solution described above, the pressure generating chamber 12, the communication portion 13, the ink supply path 14, and the like are formed on the flow path forming substrate 10. Note that the anisotropic etching is performed in a state where the surface of the reservoir forming substrate 30 is sealed.
[0042]
Next, as shown in FIG. 4C, the joined body of the flow path forming substrate 10 and the reservoir forming substrate 30 is immersed in a predetermined liquid 200, and the ink flow paths such as the communication portion 13 and the reservoir portion 31 are It is assumed that the portion to be filled with the liquid 200. Then, the penetrating portion 110 is formed by cutting and removing the diaphragm (the elastic film 50 and the lower electrode film 60) in the region facing the communication portion 13. For example, in the present embodiment, the laser beam 120 is condensed and applied to the diaphragm in the region corresponding to the opening edge of the communication portion 13 from the reservoir portion 31 side of the reservoir forming substrate 30, and the opening edge portion of the communication portion 13. The laser beam 120 is scanned along the line. Thereby, the elastic film 50 and the lower electrode film 60 are locally heat-processed and cut along the opening edge of the communication portion 13. Then, the elastic film 50 and the lower electrode film 60 in a region facing the communication part 13 are integrally cut and removed to form the through part 110 (FIG. 4D).
[0043]
At this time, foreign substances such as fragments of the elastic film 50 and the lower electrode film 60 are formed. However, in the present invention, since the penetrating portion 110 is formed in the liquid 200, the foreign substances are scattered around and are caused by static electricity or the like. It is possible to prevent the ink from adhering to the ink flow path. Further, when forming the penetrating portion 110, if the joined body of the flow path forming substrate 10 and the reservoir forming substrate 30 is immersed in the flowing liquid 200, it is possible to prevent foreign matter from adhering to the ink flow path. It can be surely prevented. The foreign matter generated when the through-hole 110 is formed in the vibration plate is removed together with the liquid 200 when the joined body of the flow path forming substrate 10 and the reservoir forming substrate 30 is taken out from the liquid 200.
[0044]
Thereafter, the liquid 200 is completely removed by washing the ink flow path including the penetrating portion 110 with, for example, pure water, that is, washing the joined body of the flow path forming substrate 10 and the reservoir forming substrate 30. To do. At this time, even if foreign matter remains in the ink flow path, the amount is very small and can be easily removed by the cleaning process. As a result, foreign matter in the ink flow path is completely removed, foreign matter is not mixed into the filled ink, and occurrence of ejection defects such as nozzle clogging can be prevented.
[0045]
Here, the liquid 200 used when forming the penetrating portion 110 is not particularly limited as long as it does not affect the surrounding members, for example, the wiring pattern provided on the reservoir forming substrate 30. It is preferable to use polyhydric alcohols. Specific examples include ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol, and glycerin. By using such polyhydric alcohols, surrounding members such as wiring patterns are not adversely affected. In addition, since the polyhydric alcohols are water-soluble, they can be removed relatively easily in the washing process. The viscosity of the liquid 200 is preferably about 10 to 1000 (mPa · s). If the viscosity of the liquid 200 is such a degree, it is easy to handle and can be removed relatively easily in the cleaning process, thereby improving the production efficiency.
[0046]
Note that it is preferable to use a laser beam oscillated by a Q-switched YAG laser oscillator to form the through portion 110. For example, in this embodiment, a laser beam having a fundamental wavelength (1064 nm) oscillated with an output of about 10 mW (repetition frequency 1 kHz) by a Q-switched YAG laser oscillator is irradiated to the diaphragm from the lower electrode film 60 side. Part 110 was formed. By forming the penetrating part 110 by laser processing in this manner, it is possible to prevent cracks and the like from occurring in the elastic film 50 and the lower electrode film 60 around the penetrating part 110, and to suppress the generation of foreign matter. In this embodiment, the Q-switched YAG laser oscillator is used to form the through-hole portion 110. However, the present invention is not limited to this. For example, laser light having a pulse width smaller than that of the Q-switched YAG laser oscillator can be oscillated. A femtosecond laser oscillator can also be used.
[0047]
Further, in the present embodiment, the diaphragm is cut by laser processing to form the penetrating portion 110. However, the present invention is not limited to this. For example, the diaphragm may be formed by mechanical machining such as bringing a pin into physical contact. A through-hole 110 may be formed by generating a crack. Further, as shown in FIG. 5, a predetermined liquid, for example, the above-described liquid 200 may be allowed to flow into the reservoir unit 31 and pressure may be applied to the diaphragm by the liquid 200 to remove the diaphragm. . When the film thickness of the diaphragm is relatively thin as in the present embodiment, the penetrating part 110 can be formed relatively easily by the pressure of the liquid 200. Note that the liquid for applying pressure to the diaphragm and the liquid for immersing the diaphragm or the like are not necessarily the same liquid. Thereafter, the nozzle plate 20 having the nozzle openings 21 formed on the surface of the flow path forming substrate 10 opposite to the reservoir forming substrate 30 is bonded, and the compliance substrate 40 is bonded to the reservoir forming substrate 30 to each chip. By dividing into sizes, the ink jet recording head of this embodiment as shown in FIG. 1 is obtained.
[0048]
(Embodiment 2)
FIG. 6 is a cross-sectional view illustrating the method for manufacturing the ink jet recording head according to the second embodiment. The present embodiment is another example of a method for forming the penetrating portion 110. Specifically, as in the first embodiment, after the flow path forming substrate 10 and the reservoir forming substrate 30 are joined and the pressure generating chambers 12 and the like are formed by etching, as shown in FIG. The melted wax 210 is poured onto the diaphragm in the region facing the surface, that is, into the reservoir portion 31, and the poured wax 210 is cooled and solidified. At this time, the wax 210 is solidified while shrinking inward as indicated by an arrow in FIG. Then, as shown in FIG. 6C, the diaphragm is cut and separated by laser processing of the diaphragm through the wax 210, thereby forming the through portion 110. Thereafter, the wax 210 in the ink flow path is melted and removed, and the inside of the ink flow path is washed as in the first embodiment.
[0049]
Here, the type of the wax 210 is not particularly limited, but is preferably one that can be removed relatively easily, for example, one that can be removed by warm water, petroleum-based solvent, alcohols, or an alkaline solution in the washing step. . The melting point of the wax 210 is preferably 140 ° C. or lower. Thereby, it is possible to prevent the piezoelectric element 300 and the like from being destroyed by heat generated when the wax 210 is melted.
[0050]
In such a manufacturing method of the present embodiment, since the wax 210 is provided on the diaphragm when the through-hole 110 is formed, foreign matters such as diaphragm fragments generated when the diaphragm is cut and separated. However, it does not adhere to the wax 210 and scatter around. Therefore, similarly to the first embodiment, it is possible to prevent the occurrence of ejection defects such as nozzle clogging due to foreign matter. In the present embodiment, the penetrating portion 110 is formed in the atmosphere, but of course, if the penetrating portion 110 is formed in the liquid as in the first embodiment, foreign matter will enter the ink flow path. It can prevent more reliably that it adheres.
[0051]
In this embodiment, after the wax 210 is solidified, the through portion 110 is formed in the diaphragm by laser processing. However, the present invention is not limited to this, and of course, the through portion 110 is formed by machining or the like. Also good. Further, the through portion 110 may be formed by causing a crack in the diaphragm by a contraction force when the wax 210 is solidified. In this case, the penetrating portion 110 can be formed without cutting the diaphragm by laser processing or the like. This eliminates the need for a device for cutting the diaphragm, such as a laser oscillator, and can therefore significantly reduce the manufacturing cost.
[0052]
(Other embodiments)
Although one embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment. For example, in the above-described first and second embodiments, the example in which the penetrating portion 110 that is an opening having substantially the same size as the opening portion of the communicating portion 13 has been described. As shown in FIG. 7, it may be composed of a plurality of through holes 110 a formed in the diaphragm in the opening region of the communication portion 13. As in the first embodiment, the plurality of through-holes 110a are scanned with the laser beam 120 to cut the elastic film 50 and the lower electrode film 60, so that the elastic film 50 in the region that becomes each through-hole 110a. In addition, the lower electrode film 60 can be formed by removing it integrally. When the size of the through-holes 110a is relatively small, the elastic film 50 and the lower electrode film 60 in the region to be each through-hole 110a are irradiated with laser light, and the elastic film 50 and the lower electrode film 60 are heated. It may be removed by processing.
[0053]
In each of the above-described embodiments, the diaphragm is cut and removed from the reservoir section 31 side. However, the present invention is not limited to this, and the diaphragm may be cut and removed from the communication section 13 side. Further, in each of the above-described embodiments, the through-hole 110 is formed after the reservoir forming substrate 30 is joined to the flow path forming substrate 10, but of course, before the flow path forming substrate 10 and the reservoir forming substrate 30 are joined. The through portion 110 may be formed in the first and second portions. Further, in each of the above-described embodiments, the communication portion 13 is continuously formed in a region corresponding to the plurality of pressure generation chambers 12 so as to communicate with the plurality of pressure generation chambers 12 through the respective ink supply paths 14. However, the present invention is not limited to this. For example, the communication portion 13 may be formed independently for each pressure generating chamber 12. In this case, it is preferable that the penetrating portion 110 is also provided independently for each communicating portion 13.
[0054]
In each of the above-described embodiments, a thin film type ink jet recording head that can be manufactured by applying a film forming and lithography process is taken as an example. However, the present invention is not limited to this example. Ink jets of various structures, such as those that form pressure generation chambers, those that form a piezoelectric layer by attaching a green sheet or screen printing, or those that form a piezoelectric layer by crystal growth such as a hydrothermal method The present invention can be employed in a type recording head.
[0055]
In addition, the ink jet recording head of each of these embodiments constitutes a part of a recording head unit including an ink flow path communicating with an ink cartridge or the like, and is mounted on the ink jet recording apparatus. FIG. 8 is a schematic view showing an example of the ink jet recording apparatus. As shown in FIG. 8, in the recording head units 1A and 1B having the ink jet recording head, cartridges 2A and 2B constituting ink supply means are detachably provided, and a carriage 3 on which the recording head units 1A and 1B are mounted. Is provided on a carriage shaft 5 attached to the apparatus body 4 so as to be movable in the axial direction. The recording head units 1A and 1B, for example, are configured to eject a black ink composition and a color ink composition, respectively. The driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears and timing belt 7 (not shown), so that the carriage 3 on which the recording head units 1A and 1B are mounted is moved along the carriage shaft 5. The On the other hand, the apparatus body 4 is provided with a platen 8 along the carriage 3. The platen 8 can be rotated by a driving force of a paper feed motor (not shown) so that a recording sheet S, which is a recording medium such as paper fed by a paper feed roller, is conveyed on the platen 8. It has become.
[0056]
In the above description, an ink jet recording head that ejects ink is exemplified as the liquid ejecting head. However, the present invention broadly covers liquid ejecting heads and liquid ejecting apparatuses in general. Examples of the liquid ejecting head include a recording head used in an image recording apparatus such as a printer, a color material ejecting head used for manufacturing a color filter such as a liquid crystal display, an organic EL display, and an electrode formation such as an FED (surface emitting display). Electrode material ejecting heads used in manufacturing, bioorganic matter ejecting heads used in biochip production, and the like.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view illustrating a recording head according to a first embodiment.
2A and 2B are a plan view and a cross-sectional view illustrating the recording head according to the first embodiment.
FIG. 3 is a cross-sectional view showing a manufacturing process of the recording head according to the first embodiment.
4 is a cross-sectional view illustrating a manufacturing process of a recording head according to Embodiment 1. FIG.
FIG. 5 is a cross-sectional view showing another manufacturing process of the recording head according to the first embodiment.
6 is a cross-sectional view showing a manufacturing process of a recording head according to Embodiment 2. FIG.
FIG. 7 is a cross-sectional view illustrating an example of a recording head according to another embodiment.
FIG. 8 is a schematic view of a recording apparatus according to an embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Flow path formation board | substrate, 11 Partition, 12 Pressure generating chamber, 13 Communication part, 14 Ink supply path, 20 Nozzle plate, 21 Nozzle opening, 30 Reservoir formation board, 31 Reservoir part, 40 Compliance board, 50 Elastic film, 60 Below Electrode film, 70 piezoelectric layer, 80 upper electrode film, 100 reservoir, 110 penetrating portion, 200 liquid, 300 piezoelectric element

Claims (11)

A flow path forming substrate in which a pressure generation chamber communicating with the nozzle opening is formed, and a piezoelectric element including a lower electrode, a piezoelectric layer, and an upper electrode provided on one side of the flow path forming substrate via a vibration plate In the method of manufacturing a liquid jet head comprising:
The step of forming the vibration plate and the piezoelectric element on one surface side of the flow path forming substrate, and the pressure together with the pressure generating chamber by etching from the other surface side of the flow path forming substrate until reaching the vibration plate. A step of forming a communication portion communicating with one end portion in the longitudinal direction of the generation chamber, and a region facing the communication portion of the vibration plate in a state where the flow path forming substrate and the vibration plate are immersed in a predetermined liquid. A method of manufacturing a liquid jet head, comprising: a step of forming a penetrating portion that opens to the communication portion; and a step of cleaning the inside of the flow path including the penetrating portion. The method of manufacturing a liquid jet head according to claim 1, wherein the liquid is a polyhydric alcohol. The method of manufacturing a liquid jet head according to claim 2, wherein the polyhydric alcohol is any one of ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol, or glycerin. The method of manufacturing a liquid jet head according to claim 1, wherein the liquid has a viscosity of 10 to 1000 (mPa · s). 5. The method of manufacturing a liquid jet head according to claim 1, wherein in the step of forming the through portion, the flow path forming substrate and the vibration plate are immersed in a flowing liquid. A flow path forming substrate in which a pressure generation chamber communicating with the nozzle opening is formed, and a piezoelectric element including a lower electrode, a piezoelectric layer, and an upper electrode provided on one side of the flow path forming substrate via a vibration plate In the method of manufacturing a liquid jet head comprising:
The step of forming the vibration plate and the piezoelectric element on one surface side of the flow path forming substrate, and the pressure together with the pressure generating chamber by etching from the other surface side of the flow path forming substrate until reaching the vibration plate. A step of forming a communication portion communicating with one longitudinal end of the generation chamber, a step of pouring liquid wax on the diaphragm in a region facing the communication portion, and solidifying the liquid wax; and Forming a through-hole that opens to the communication portion in the diaphragm in the facing region, and liquefying and removing the solidified wax and washing the flow path including the through-portion. A manufacturing method of a liquid jet head characterized by the above. 7. The liquid according to claim 6, wherein the step of forming the penetrating portion is omitted when the diaphragm in the region facing the communicating portion is cut and separated by a contraction force when the wax is solidified. Manufacturing method of ejection head. 8. The method of manufacturing a liquid ejecting head according to claim 6, wherein the wax is removed with warm water, petroleum-based solvent, alcohols, or alkaline solutions. The method of manufacturing a liquid jet head according to claim 6, wherein the wax has a melting point of 140 ° C. or less. The method of manufacturing a liquid jet head according to claim 1, wherein in the step of forming the through portion, the diaphragm is removed by machining, laser processing, or liquid pressure. 11. The reservoir forming substrate according to claim 1, wherein a reservoir forming substrate having a reservoir portion communicating with the communicating portion via the penetrating portion is formed before the step of forming the pressure generating chamber and the communicating portion. A method of manufacturing a liquid jet head, further comprising a step of bonding to a surface of the substrate on the piezoelectric element side.

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