CN103441093A - Slide glass structure for temporary bonding and manufacturing method of slide glass structure - Google Patents
Slide glass structure for temporary bonding and manufacturing method of slide glass structure Download PDFInfo
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- CN103441093A CN103441093A CN201310401208XA CN201310401208A CN103441093A CN 103441093 A CN103441093 A CN 103441093A CN 201310401208X A CN201310401208X A CN 201310401208XA CN 201310401208 A CN201310401208 A CN 201310401208A CN 103441093 A CN103441093 A CN 103441093A
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Abstract
The invention provides a slide glass structure for temporary bonding. The slide glass structure comprises a slide glass wafer. The upper surface of the slide glass wafer is provided with a groove. The bottom part of the groove is provided with a substrate slide glass. The shape of the substrate slide glass matches the shape of the groove, and the thickness of the substrate slide glass is less than the depth of the groove. The upper surface of the substrate slide glass is coated with a layer of buffer glue which is solidified. The upper surface of the solidified buffer glue and the upper surface of the slide glass wafer around the periphery of the groove are coated with temporary bonding glue. Viscosity of buffer glue is repulsive to viscosity of temporary bonding glue. The wafer of a device is bonded with the upper surface of the slide glass wafer around the periphery of the groove via temporary bonding glue. The invention also provides a manufacturing method of the slide glass structure. A low-cost temporary bonding technology can be realized by the slide glass structure for temporary bonding, and broken risk of the wafer of the device can be significantly reduced.
Description
Technical field
The present invention relates to the microelectronic packaging technology field,, especially a kind of slide glass structure for interim bonding and preparation method thereof.
Background technology
Thickness along with encapsulating structure further reduces at present, and especially, to 2.5DIC, the 3DIC technology of stacked structure, the advantage of thin wafer technology is more and more obvious.Thin wafer and thin chip is processed into the bottleneck for the volume production ultrathin products thus.And drawn on this basis interim bonding and torn bonding technology open.
Interim bonding with tear bonding open and there is following advantage: at first, the slide glass wafer provides supportive protection mechanically for thin device wafers, so just can carry out back process by the equipment of normal component wafer fabrication.For the ultra thin device wafer, can realize the PROCESS FOR TREATMENT of wafer scale.Therefore, by interim bonding and tear bonding techniques open, utilize every equipment of normal component wafer factory can both process thin device wafers, and without conversion unit again, and do not need special fixture or wafer cassette.
Meanwhile tear bonding open and also show certain destabilizing factor, because after back process, thin device wafers has lacked certain support bearing in tearing bonding process open, and do not have enough safeguard measures.When device wafers thickness arrival 50um is following, the yield of tearing bonding technology open can not be guaranteed now, and this also allows manufacturer can not realize as early as possible the volume production of ultra-thin wafers.
Mention in U.S. Pat 8267143B2, after by laser treatment, dielectric viscosity being reduced, then utilize mechanical force upwards by adminicle and wafer separate.Need extra laser processing apparatus, cost is high.
When tearing bonding open, after reducing dielectric viscosity, some methods are to utilize the rotation that adminicle is relative with device wafers and the pulling force made progress, by adminicle and wafer separate.But the method reliability is poor, sometimes can make device wafers break.
On the whole interim bonding of the prior art with tear open bonding technology exist have a big risk, the high in cost of production shortcoming.
Summary of the invention
The object of the present invention is to provide a kind of slide glass structure for interim bonding and corresponding manufacture method thereof, can realize interim bonding technology cheaply, and can significantly reduce the risk of device wafers fragment.The technical solution used in the present invention is:
A kind of slide glass structure for interim bonding, comprise a slide glass wafer, at the upper surface of described slide glass wafer, have groove, at described bottom portion of groove, be provided with a substrate slide glass, the shape of described substrate slide glass and the shape of groove are complementary, and the thickness of substrate slide glass is less than the degree of depth of groove; Be coated with one deck buffering adhesive at substrate slide glass upper surface, described buffering adhesive is through overcuring;
The upper surface of the upper surface of the buffering adhesive after solidifying and the slide glass wafer of groove surrounding is coated with the ephemeral key rubber alloy, and described buffering adhesive and ephemeral key rubber alloy viscosity are repelled each other;
Device wafers is by the upper surface bonding of the slide glass wafer of ephemeral key rubber alloy and groove surrounding.
Further, the diameter of described groove is 196mm, and the degree of depth is 300um; The diameter of described substrate slide glass is 196mm, and thickness is 280um.
Further, the upper surface of the buffering adhesive after overcuring is concordant with the slide glass wafer upper surface of groove surrounding.
A kind of manufacture method of the slide glass structure for interim bonding comprises the following steps:
S1. provide the slide glass wafer, in the upper surface recessing of slide glass wafer; Specifically can on the slide glass wafer, by dry etching or wet etching, form groove;
S2. make the substrate slide glass that the shape of a slice and groove is complementary, and apply buffering adhesive and solidify on the one side of substrate slide glass, the buffering adhesive after solidifying adds that the thickness of substrate slide glass equals the degree of depth of above-mentioned groove;
S3. the related buffering adhesive be solidificated on the substrate slide glass of substrate slide glass is inserted in above-mentioned groove together, make the substrate slide glass under;
S4. the upper surface of the slide glass wafer of the buffering adhesive after solidifying and groove surrounding applies the ephemeral key rubber alloy, and described ephemeral key rubber alloy and buffering adhesive viscosity are repelled each other;
S5. the upper surface bonding by the slide glass wafer of ephemeral key rubber alloy and groove surrounding by device wafers, form the ephemeral key zoarium.
Advantage of the present invention: the invention solves the relevant issues such as the loaded down with trivial details and cost costliness of existing slide glass wafer manufacturing technique.Only by groove design, get final product the function of feasible region bonding.Can farthest realize the cost degradation of interim bonding technology by this technique.And formed ephemeral key zoarium easily separated in the later stage, reduced the risk of device wafers fragment.
The accompanying drawing explanation
Fig. 1 is slide glass wafer schematic diagram.
Fig. 2 is recessing schematic diagram on the slide glass wafer.
Fig. 3 is the schematic diagram after the substrate slide glass that is solidified with buffering adhesive is inserted groove.
Fig. 4 applies ephemeral key rubber alloy schematic diagram on the slide glass wafer.
Fig. 5 is the fit schematic diagram of the ephemeral key after bonding.
Fig. 6 is the slide glass wafer upper surface of removal groove surrounding and the ephemeral key rubber alloy schematic diagram between device wafers.
Fig. 7 is schematic diagram after device wafers and slide glass wafer separate.
Embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
As shown in Fig. 1～Fig. 5:
A kind of slide glass structure for interim bonding, comprise a slide glass wafer 1, upper surface at described slide glass wafer 1 has groove 2, be provided with a substrate slide glass 3 in described groove 2 bottoms, the shape of the shape of described substrate slide glass 3 and groove 2 is complementary, and the thickness of substrate slide glass 3 is less than the degree of depth of groove 2; Be coated with one deck buffering adhesive 4 at substrate slide glass 3 upper surfaces, described buffering adhesive 4 is through overcuring; The upper surface of the buffering adhesive 4 after overcuring preferably keeps concordant with slide glass wafer 1 upper surface of groove 2 surroundings.
The upper surface of the buffering adhesive 4 after solidifying and the slide glass wafer 1 of groove 2 surroundings is coated with ephemeral key rubber alloy 5, and described buffering adhesive 4 repels each other with ephemeral key rubber alloy 5 viscosity.Device wafers 6 is the upper surface bonding with the slide glass wafer 1 of groove 2 surroundings by ephemeral key rubber alloy 5.
A kind of manufacture method of the slide glass structure for interim bonding comprises the following steps:
S1. provide slide glass wafer 1, in the upper surface recessing 2 of slide glass wafer 1; Specifically can on slide glass wafer 1, by dry etching or wet etching, form groove 2; The diameter of the groove 2 formed is 196mm, and the degree of depth is 300um;
S2. make the substrate slide glass 3 that the shape of a slice and groove 2 is complementary, the diameter of substrate slide glass 3 is 196mm, and thickness is 280um; And apply buffering adhesive 4 and solidify on the one side of substrate slide glass 3, the buffering adhesive 4 after solidifying adds that the thickness of substrate slide glass 3 equals the degree of depth of above-mentioned groove 2 (300um);
S3. the related buffering adhesive 4 be solidificated on substrate slide glass 3 of substrate slide glass 3 is inserted in above-mentioned groove 2 together, make substrate slide glass 3 under;
S4. the upper surface of the slide glass wafer 1 of the buffering adhesive 4 after solidifying and groove 2 surroundings applies ephemeral key rubber alloy 5, and described ephemeral key rubber alloy 5 repels each other with buffering adhesive 4 viscosity;
S5. the upper surface bonding by the slide glass wafer 1 of ephemeral key rubber alloy 5 and groove 2 surroundings by device wafers 6, form the ephemeral key zoarium.
In the method, because buffering adhesive 4 and ephemeral key rubber alloy 5 viscosity are repelled each other, so the buffering adhesive 4 of groove 2 tops mainly played the buffering supporting role, with together with the ephemeral key rubber alloy 5 of top, supports device wafers 6.Device wafers 6 is mainly the circle ephemeral key rubber alloy 5 and the interim bonding of slide glass wafer 1 by slide glass wafer 1 upper surface of groove 2 surroundings, the adhesion of on the one hand interim bonding is suitable, stability requirement in the time of can meeting device wafers 6 following process, on the other hand after process finishing, can conveniently device wafers 6 be separated with slide glass wafer 1, and when separating, be not easy to cause device wafers 6 that fragment occurs.
After interim bonding, just can carry out back side processing technology to device wafers 6, such as attenuate, connect up again, make salient point etc.Subsequently by the fit separation of ephemeral key.
As shown in Figure 6, at first the upper surface of the slide glass wafer 1 of groove 2 surroundings and the ephemeral key rubber alloy between device wafers 6 are removed, the method for removal is such as taking Metal Cutting method or wet method dissolution method.Metal Cutting utilizes Metal Cutting line or blade to be cut exactly; Wet method is dissolved and is utilized chemical agent to soak and dissolve the ephemeral key rubber alloy at above-mentioned position.
As shown in Figure 7, then discrete device wafer 6 and slide glass wafer 1.In this process, the buffering adhesive 4 after sometimes solidifying and substrate slide glass 3 can be attached on the ephemeral key rubber alloy 5 below device wafers 6.But because buffering adhesive 4 and ephemeral key rubber alloy 5 are that viscosity is repelled each other, just be easy to can by their peel manuallies from.
Finally the ephemeral key rubber alloy 5 use chemical agents on device wafers 6 are washed.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned example embodiment, and in the situation that do not deviate from spirit of the present invention or essential characteristic, can realize the present invention with other concrete form.Therefore, no matter from which point, all should regard embodiment as exemplary, and be nonrestrictive, scope of the present invention is limited by claims rather than above-mentioned explanation, therefore is intended to include in the present invention dropping on the implication that is equal to important document of claim and all changes in scope.Any Reference numeral in claim should be considered as limit related claim.
Claims (5)
1. the slide glass structure for interim bonding, comprise a slide glass wafer (1), upper surface at described slide glass wafer (1) has groove (2), it is characterized in that: in described groove (2) bottom, be provided with a substrate slide glass (3), the shape of the shape of described substrate slide glass (3) and groove (2) is complementary, and the thickness of substrate slide glass (3) is less than the degree of depth of groove (2); Be coated with one deck buffering adhesive (4) at substrate slide glass (3) upper surface, described buffering adhesive (4) is through overcuring;
The upper surface of the upper surface of the buffering adhesive (4) after solidifying and the slide glass wafer (1) of groove (2) surrounding is coated with ephemeral key rubber alloy (5), and described buffering adhesive (4) repels each other with ephemeral key rubber alloy (5) viscosity;
Device wafers (6) is the upper surface bonding with the slide glass wafer (1) of groove (2) surrounding by ephemeral key rubber alloy (5).
2. the slide glass structure for interim bonding as claimed in claim 1, it is characterized in that: the diameter of described groove (2) is 196mm, the degree of depth is 300um; The diameter of described substrate slide glass (3) is 196mm, and thickness is 280um.
3. the slide glass structure for interim bonding as claimed in claim 1, it is characterized in that: the upper surface of the buffering adhesive after overcuring (4) is concordant with slide glass wafer (1) upper surface of groove (2) surrounding.
4. the manufacture method for the slide glass structure of interim bonding, is characterized in that, comprises the following steps:
S1. provide slide glass wafer (1), in the upper surface recessing (2) of slide glass wafer (1);
S2. make the substrate slide glass (3) that the shape of a slice and groove (2) is complementary, and apply buffering adhesive (4) and solidify on the one side of substrate slide glass (3), the buffering adhesive (4) after solidifying adds that the thickness of substrate slide glass (3) equals the degree of depth of above-mentioned groove (2);
S3. the related buffering adhesive (4) be solidificated on substrate slide glass (3) of substrate slide glass (3) is inserted in above-mentioned groove (2) together, make substrate slide glass (3) under;
S4. the upper surface of the slide glass wafer (1) of the buffering adhesive (4) after solidifying and groove (2) surrounding applies ephemeral key rubber alloy (5), and described ephemeral key rubber alloy (5) repels each other with buffering adhesive (4) viscosity;
S5. the upper surface bonding by the slide glass wafer (1) of ephemeral key rubber alloy (5) and groove (2) surrounding by device wafers (6), form the ephemeral key zoarium.
5. the manufacture method of the slide glass structure for interim bonding as claimed in claim 4, is characterized in that: in described step S1, upper by dry etching or wet etching formation groove (2) at slide glass wafer (1).
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485294A (en) * | 2014-12-12 | 2015-04-01 | 浙江中纳晶微电子科技有限公司 | Temporary bonding and separation method for wafers |
| CN106165074A (en) * | 2014-03-19 | 2016-11-23 | 三星电子株式会社 | The method manufacturing semiconductor device |
| CN108821233A (en) * | 2018-05-31 | 2018-11-16 | 华进半导体封装先导技术研发中心有限公司 | Interim bonding structure and preparation method thereof tears bonding method open |
| CN112201574A (en) * | 2020-09-29 | 2021-01-08 | 武汉新芯集成电路制造有限公司 | Multi-layer wafer bonding method |
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| JPH1191117A (en) * | 1997-09-19 | 1999-04-06 | Toshiba Tec Corp | Manufacture of ink jet printer head |
| JP2000309093A (en) * | 1999-04-27 | 2000-11-07 | Canon Inc | Liquid jetting recording head and production therefor |
| CN101479835A (en) * | 2006-06-27 | 2009-07-08 | 3M创新有限公司 | Process for manufacturing split chip |
| CN103035482A (en) * | 2012-08-15 | 2013-04-10 | 上海华虹Nec电子有限公司 | Temporary bonding method of silicon wafer |
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2013
- 2013-09-05 CN CN201310401208.XA patent/CN103441093B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH1191117A (en) * | 1997-09-19 | 1999-04-06 | Toshiba Tec Corp | Manufacture of ink jet printer head |
| JP2000309093A (en) * | 1999-04-27 | 2000-11-07 | Canon Inc | Liquid jetting recording head and production therefor |
| CN101479835A (en) * | 2006-06-27 | 2009-07-08 | 3M创新有限公司 | Process for manufacturing split chip |
| CN103035482A (en) * | 2012-08-15 | 2013-04-10 | 上海华虹Nec电子有限公司 | Temporary bonding method of silicon wafer |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106165074A (en) * | 2014-03-19 | 2016-11-23 | 三星电子株式会社 | The method manufacturing semiconductor device |
| US10157766B2 (en) | 2014-03-19 | 2018-12-18 | Samsung Electronics Co., Ltd. | Method of fabricating a semiconductor device |
| CN106165074B (en) * | 2014-03-19 | 2020-05-12 | 三星电子株式会社 | Method for manufacturing semiconductor device |
| CN104485294A (en) * | 2014-12-12 | 2015-04-01 | 浙江中纳晶微电子科技有限公司 | Temporary bonding and separation method for wafers |
| CN108821233A (en) * | 2018-05-31 | 2018-11-16 | 华进半导体封装先导技术研发中心有限公司 | Interim bonding structure and preparation method thereof tears bonding method open |
| CN112201574A (en) * | 2020-09-29 | 2021-01-08 | 武汉新芯集成电路制造有限公司 | Multi-layer wafer bonding method |
| CN112201574B (en) * | 2020-09-29 | 2023-11-24 | 武汉新芯集成电路制造有限公司 | Multi-layer wafer bonding method |
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