JPS63303681A - Cream solder applicator - Google Patents
Cream solder applicatorInfo
- Publication number
- JPS63303681A JPS63303681A JP14109287A JP14109287A JPS63303681A JP S63303681 A JPS63303681 A JP S63303681A JP 14109287 A JP14109287 A JP 14109287A JP 14109287 A JP14109287 A JP 14109287A JP S63303681 A JPS63303681 A JP S63303681A
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- solder
- application
- cylinder
- piston
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 29
- 239000006071 cream Substances 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、電子部品をプリント回路基板上に表面実装す
る場合に使用されるクリーム半田を一定3!lだけ塗布
する装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention provides a method for applying cream solder that is used when surface mounting electronic components onto a printed circuit board. This invention relates to a device that applies only 1.
(従来技術)
電子部品をプリント回路基板に表面実装する場合(こは
、電子部品のリード配列に合わせて形成されたプリント
回路基板上のパターンにクリーム半田を塗布し、これの
上に電子部品を弐)した状態でクリーム半田を加熱融解
することが行なわれている。(Prior art) When electronic components are surface mounted on a printed circuit board (in this case, cream solder is applied to a pattern on the printed circuit board formed to match the lead arrangement of the electronic components, and the electronic components are mounted on top of this). Cream solder is heated and melted in a heated state.
この場合、フラットパックドエCのようにリード間の間
隔が0.5mm程度と極めで狭いものにあっては、塗布
するクリーム半田の量が多すぎるとリード間をブリッジ
して短絡することになり、また反対に少な過ぎると接続
不良を引き起こすため、塗布量を正確に管理する必要が
ある。In this case, if the gap between the leads is extremely narrow, about 0.5 mm, such as Flat Pack Doe C, if too much cream solder is applied, it will bridge the leads and cause a short circuit. On the other hand, if it is too small, it will cause connection failure, so it is necessary to accurately control the amount of application.
このため、通常第4図に示したように、一定の厚みを有
する板材にリードパターンPに合わせで通孔Ht穿設し
てなるマスク板Mを、プリント回路基板Kに重ね合わせ
(同図工)、これの上からクリーム半田RをスクージS
により塗布することが行なわれでいる(■)、これによ
れば、マスク板Mの通孔Hの面積と厚みでもっで一定量
のクリーム半田R′を塗布することが可能となるが(■
)、塗布時多目のクリーム半田を用意する関係上、余分
となったクリーム半田R” (n)がマスク板Mに付着
して無駄になるばかりでなく、たとえ、この余剰となっ
たクリーム半田を回収するとしでも空気に曝されたり、
マスク板表面の塵埃を吸着しているため劣化を招きやす
いという問題がある。For this reason, as shown in FIG. 4, a mask plate M, which is made of a plate material having a certain thickness and through holes Ht formed in accordance with the lead pattern P, is usually superimposed on the printed circuit board K (by the same figure). , apply cream solder R on top of this
According to this method, it is possible to apply a certain amount of cream solder R' depending on the area and thickness of the through hole H of the mask plate M (■).
), due to the need to prepare a large amount of cream solder during application, the excess cream solder R'' (n) not only adheres to the mask board M and is wasted, but even if this excess cream solder Even if it is collected, it may be exposed to air,
There is a problem in that because it adsorbs dust on the surface of the mask plate, it tends to deteriorate.
このような問題を解消するため、注射器のようなディス
ペンサーを用いてパターン点毎に定量塗布する装置も存
在するが、塗布に手間と時間が掛るという問題がある。In order to solve this problem, there is an apparatus that uses a dispenser such as a syringe to apply a fixed amount to each pattern point, but there is a problem that the application takes time and effort.
(目的)
本発明はこのような問題に鑑みてなされたものであって
、その目的とするところは必要十分な量のクリーム半田
だけを収納容器から吐出させ、これをパターンに合わせ
て一度に塗布することができる装冨ヲ提供することにあ
る。(Purpose) The present invention was made in view of these problems, and its purpose is to discharge only a necessary and sufficient amount of cream solder from a storage container and apply it at once in accordance with a pattern. Our goal is to provide you with the equipment you need.
(発明の概要)
すなわち、本発明が特徴とするところは、外部からの操
作により軸方向に進退させられるピストン部材を嵌入し
たシリンダ部材の他端に、回路パターンに合わせた吐出
口を形成するとともに、吐出口の先端から若干突出する
ように弾性部材を前記吐出口の近傍に取付けた点にある
。(Summary of the Invention) That is, the present invention is characterized by forming a discharge port in accordance with a circuit pattern at the other end of a cylinder member into which a piston member that is moved forward and backward in the axial direction by external operation is fitted. , the elastic member is attached near the discharge port so as to slightly protrude from the tip of the discharge port.
(構成)
そこで、以下に本発明の詳細を図示した実施例に基づい
て説明する。(Structure) Therefore, details of the present invention will be described below based on illustrated embodiments.
第1図は本発明の一実施例を示すものであって、図中符
号1は、クリーム半田の収容容器を形成するシリンダで
、一端にはシリンダ]と気と的に嵌入するピストン2に
固定されたネジ3と螺合するネジ穴4a%中心に形成さ
れた蓋部材4が着脱自在に取付けられ、また他端には回
路基板のリードパターンに合わせた吐出口6.6.6.
6が形成されている。この吐出口6は同図(ロ)に示し
たように塗布すべきパターンに合わせて基板7の外周部
に矩形状の通孔%N設して形成されており、また中央部
には吐出口先端から塗布厚みdを確保するようにゴム板
等のスベリ止め板8を突出させて固定されている。FIG. 1 shows an embodiment of the present invention, and the reference numeral 1 in the figure is a cylinder forming a container for storing cream solder, and one end is fixed to a piston 2 that is fitted into the cylinder. A lid member 4 formed at the center of a screw hole 4a% that is screwed into the screw 3 is detachably attached, and a discharge port 6.6.6. that matches the lead pattern of the circuit board is provided at the other end.
6 is formed. This discharge port 6 is formed by providing a rectangular through hole %N on the outer periphery of the substrate 7 in accordance with the pattern to be coated, as shown in FIG. An anti-slip plate 8 such as a rubber plate is protruded and fixed to ensure the coating thickness d from the tip.
なお、図中符号5はネジに固定されたノブを、また10
は空気抜き口を、ざらに11はピストン2に嵌着した○
リングをそれぞれ示す。In addition, the reference numeral 5 in the figure indicates the knob fixed to the screw, and 10
○ is the air vent, and 11 is fitted to the piston 2.
Each ring is shown.
この実施例において、シリンダ1にクリーム半田Rを充
填してピストン2を挿入し、吐出口6.6.6・・・・
からクリーム半田が排出される程度までノブ5を回動さ
せてピストン2を押し下げておく(第2図工)。In this embodiment, the cylinder 1 is filled with cream solder R, the piston 2 is inserted, and the discharge ports 6,6,6...
Turn the knob 5 to push down the piston 2 until the cream solder is discharged (see the second drawing).
このような準備を終えた段階で、吐出口6.6.6・・
・・がプリント回路基板に上のパターンPに一致するよ
うにシリンダ1を基板Kに押し当てると、スベリ止め板
8を介して回路基板Kに当接するため、滑ることなく回
路基板Kに固定されるとともに、回路基板表面と吐出口
先端との間に一定の間隙dが形成される(II)。After completing these preparations, the discharge port 6.6.6...
When the cylinder 1 is pressed against the circuit board K so that it matches the pattern P on the printed circuit board, it will come into contact with the circuit board K through the anti-slip plate 8, so it will be fixed to the circuit board K without slipping. At the same time, a certain gap d is formed between the circuit board surface and the tip of the ejection port (II).
このような状態で、ノブを回転させると、ピストン2は
、シリンダ1内を軸方向に相対的に吐出口6.6.6・
・・・側に移動してシリンダ]内のクリーム半田日を押
し出す(■)、これにより、クリーム半田日は、吐出口
6.6.6′・・・・かうその形状に一敗した形状でも
って、ノブ5の回転量により決る量だけ排出され、間隙
長dに略々一致する厚みをもってプリント回路基板Pの
パターン上に塗布されることになる(■)。When the knob is rotated in this state, the piston 2 moves relative to the discharge ports 6.6.6 and 6.6.6 in the cylinder 1 in the axial direction.
...Move to the side and push out the cream solder inside the cylinder (■). As a result, the cream solder will be in a shape that is completely different from the shape of the discharge port 6, 6, 6'... As a result, the amount determined by the amount of rotation of the knob 5 is discharged, and the amount is applied onto the pattern of the printed circuit board P with a thickness that approximately corresponds to the gap length d (■).
このような状態で、取付けるべき電子部品を、回路基板
のパターンに合わせて配置して加熱すると、III接す
る2つのリードパターンを橋絡するように付着していた
クリーム半田は、溶融による表面張力によってパターン
Pに引寄せられて分離するとともに、電子部品のリード
とパターンを濡らせた後、冷却時に両者を固定する。In this state, when the electronic components to be mounted are arranged in accordance with the pattern of the circuit board and heated, the cream solder that had been attached to bridge the two lead patterns that are in contact with each other will melt due to surface tension. It is attracted to the pattern P and separated, and after wetting the lead of the electronic component and the pattern, both are fixed when cooled.
第3図は、前述の塗布器を@1しておくのに適したスタ
ンドの一実施例を示すものであって、合成樹脂板2oの
表面に複数の凸条21.21.21・・・・を形成する
とともに、前述した塗布器23の底面形状に合わせた凹
部2418:形成して構成されでいる。FIG. 3 shows an embodiment of a stand suitable for holding the above-mentioned applicator at 1, in which a plurality of protrusions 21, 21, 21, . . . are formed on the surface of a synthetic resin plate 2o. In addition to forming a concave portion 2418 that matches the shape of the bottom surface of the applicator 23 described above.
この実施例によれば、不使用時には塗布器23を凹部2
4に!!置してあくことにより空気との接触を可及的に
断ってクリーム半田の劣化を防止することができ、また
使用開始時には塗布器23の底面を凸条2]、21.2
1・・・・に押し当ててコスルことにより残渣を簡単に
取除くことかできる。According to this embodiment, when not in use, the applicator 23 is moved to the recess 2.
To 4! ! By leaving the applicator 23 open, it is possible to prevent the cream solder from deteriorating by cutting off contact with air as much as possible, and at the beginning of use, the bottom of the applicator 23 is lined with convex stripes 2], 21.2.
1. Residues can be easily removed by pressing it against the surface.
なお、この実施例においては、融解時におけるクリーム
半田の表面張力による分離を積極的に利用して、各辺の
吐出口を連続口としているが、回路パターン通りに独立
孔を設けたり、長孔を槽数に分断させても同様の作用を
奏することは明らかである。In this example, separation by the surface tension of cream solder during melting is actively used to make the discharge ports on each side continuous ports, but independent holes or elongated holes may be provided according to the circuit pattern. It is clear that the same effect can be obtained even if the tank is divided into several tanks.
また、この実施例においてはノブの回動操作により軸方
向にピストンを移動させでいるが、トリガ機構やブツシ
ュボタンにより駆動螺子を回動させるようにしでもよく
、また一定回転量を規制するクリック機構を設けること
により一層正確に塗布量を管理することができる。Further, in this embodiment, the piston is moved in the axial direction by rotating the knob, but the drive screw may also be rotated by a trigger mechanism or a button, or by a click that controls the amount of rotation. By providing a mechanism, the amount of application can be controlled more accurately.
さらに、この実施例においてはノブを手動で移動させる
ようにしているが、パルスモータ等の動力源や圧力空気
限に接続しても同様の作用を奏することは明らかである
。また、この実施例においては、螺子部材をピストンと
一体的に構成しているが、両者間を可回動的に固定して
もよく、ざらに、ピストンの外周とシリンダの内周に螺
子を設け、両者間を相対的に回動させるようにしても同
様の作用を奏することは明らかである。Further, in this embodiment, the knob is moved manually, but it is clear that the same effect can be achieved even if it is connected to a power source such as a pulse motor or a pressure air limit. Further, in this embodiment, the screw member is constructed integrally with the piston, but they may be rotatably fixed between them. It is clear that the same effect can be achieved even if the two are provided and rotated relative to each other.
(効果)
以上、説明したようにシリンダの一端に電子部品のリー
ドパターンに合わせて吐出口を形成するとともに、螺条
により進退するピストンを設けたので、クリーム半田を
可及的に気密゛iをもってストックする一方、螺条によ
る強力な圧力を作用させて確実にクリーム半田を供給す
ることができるばかりでなく、ストローク長を精密に調
節できて塗布量を正確に調整することができる。(Effects) As explained above, a discharge port is formed at one end of the cylinder in accordance with the lead pattern of the electronic component, and a piston that advances and retracts with a thread is provided, so the cream solder is kept as airtight as possible. While stocking, it is possible not only to reliably supply cream solder by applying strong pressure from the thread, but also to precisely adjust the stroke length and the amount of application.
また、表面が吐出口から若干突出するようにスベリ止め
板を底部に設けたので、当接時に回路基板の所定位置に
確実に固定することができるばかりでなく、回路基板面
との間に形成される一定隙長でもっで塗布厚さを一定値
に管理することができる。In addition, an anti-slip plate is provided at the bottom so that the surface slightly protrudes from the discharge port, so it not only can be securely fixed in place on the circuit board when it comes into contact, but also prevents slippage between the surface of the circuit board and the surface of the circuit board. With a constant gap length, the coating thickness can be controlled to a constant value.
第1図(イ)(ロ)は、それぞれ本発明の一実施半田塗
布方法を示す説明図である。
1・・・・シリンダ 2・・・・ピストン3・・・
・ネジ 4・・・・蓋部材6.6・・・・吐出
口 7・・・・基板8・・・・スベリ止め板FIGS. 1(A) and 1(B) are explanatory diagrams showing one embodiment of the solder coating method of the present invention, respectively. 1...Cylinder 2...Piston 3...
・Screw 4... Lid member 6. 6... Discharge port 7... Board 8... Anti-slip plate
Claims (1)
部材を嵌入したシリンダ部材の他端に、電子部品のリー
ドパターンに合わせた吐出口を形成するとともに、前記
吐出口の先端から若干突出するように弾性部材を前記吐
出口の近傍に取付けてなるクリーム半田塗布器。A discharge port that matches the lead pattern of the electronic component is formed at the other end of the cylinder member into which a piston member that is moved forward and backward in the axial direction by external operation is formed, and an elastic member is formed so as to slightly protrude from the tip of the discharge port. A cream solder applicator comprising a member attached near the discharge port.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14109287A JPH07115173B2 (en) | 1987-06-04 | 1987-06-04 | Cream solder applicator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14109287A JPH07115173B2 (en) | 1987-06-04 | 1987-06-04 | Cream solder applicator |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63303681A true JPS63303681A (en) | 1988-12-12 |
JPH07115173B2 JPH07115173B2 (en) | 1995-12-13 |
Family
ID=15284010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14109287A Expired - Lifetime JPH07115173B2 (en) | 1987-06-04 | 1987-06-04 | Cream solder applicator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07115173B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150108206A1 (en) * | 2013-10-18 | 2015-04-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Indirect printing bumping method for solder ball deposition |
-
1987
- 1987-06-04 JP JP14109287A patent/JPH07115173B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150108206A1 (en) * | 2013-10-18 | 2015-04-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Indirect printing bumping method for solder ball deposition |
US9216469B2 (en) * | 2013-10-18 | 2015-12-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Indirect printing bumping method for solder ball deposition |
Also Published As
Publication number | Publication date |
---|---|
JPH07115173B2 (en) | 1995-12-13 |
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