JPH10409A - Viscous fluid discharge nozzle, viscous fluid applicator, and viscous fluid application method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a viscous fluid application method in which always stable application is done and high speed application is possible, a viscous fluid discharge nozzle, and a viscous fluid applicator. SOLUTION: Always stable application can be done by a method in which a cylindrical member 15 which is arranged to surround a discharge opening 2 for viscous fluid 3 so that the discharge opening 2 is positioned inside at a discharge position 32 and rod-shaped member 14 which discharges the viscous fluid which entered the inside space of the cylindrical member are provided to enable high speed operation, the discharge opening is surrounded by the cylindrical member to prevent the leakage of the viscous fluid existing in the inside space of the cylindrical member besides the discharge opening, and the viscous fluid is discharged by transferring the rod-shaped member to a viscous fluid discharge position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for temporarily fixing an electronic component to a circuit board (hereinafter referred to as "substrate") when mounting the electronic component on the substrate. The present invention relates to a viscous fluid discharge nozzle for applying a fluid to a substrate, a viscous fluid application device, and a viscous fluid application method.

[0002]

2. Description of the Related Art Conventionally, in order to solder an electronic component to a substrate, the electronic component is mounted on an adhesive applied to a mounting position of the electronic component on the substrate, temporarily fixed, and then the solder is melted. The lead terminals of the electronic components are soldered to the substrate by dipping in a solder bath. An adhesive applying apparatus using a conventional adhesive applying method will be described with reference to FIGS. 5 and 6, reference numeral 1 denotes a syringe having a discharge port 2 formed at the tip, and reference numeral 3 denotes an adhesive filled in the syringe 1, which is extruded from the discharge port 2 by compressed air supplied into the syringe 1. Reference numeral 4 denotes a board, and 5 denotes an XY robot having positioning means for moving in the X and Y directions on an XY plane parallel to the component mounting surface of the board 4, provided on the X direction moving means 7 and the X direction moving means 7. And a head 6 to which the syringe 1 is mounted is movably attached to the X-direction moving means 7. The head 6 moves in the Z direction perpendicular to the substrate 4 so that the adhesive 3 extruded from the discharge port 2 comes into contact with the substrate 4. The compressed air is supplied to the syringe 1 by electrically controlling the operation of an on-off valve (not shown).

[0003] The operation of the conventional adhesive coating apparatus configured as described above will be described. The substrate 4 transferred from the previous process is fixed at a predetermined position of the XY robot 5, and the head 6 is moved by the X-direction moving means 7 and the Y-direction moving means 8a and 8b, so that the discharge port 2 is moved. Is moved to above the electronic component mounting position. Next, the open / close valve is opened, compressed air is sent into the syringe 1, and the adhesive 3 in the syringe 1 is pushed out from the discharge port 2. Then, the head 6 is lowered, and the extruded adhesive 3 is applied to the electronic component mounting position on the substrate. At this time, the amount of the adhesive 3 applied to the substrate 4 is adjusted according to conditions such as the pressure of the compressed air, the opening time of the on-off valve, and the temperature of the tip of the nozzle 2. Thereafter, the discharge port 2 is moved to the next electronic component mounting position, and the operations of pushing out the adhesive 3 and applying by lowering the syringe 1 are repeatedly performed to apply the adhesive 3 to all the electronic component mounting positions. Complete. Then, the board 4 is transferred to the next electronic component mounting step, and the electronic component is mounted on the adhesive 3. Then, the board 4 on which the electronic component is mounted is further transferred to an adhesive curing step and a soldering step, and the electronic component is mounted on the board 4.

In addition, instead of the above-mentioned syringe 1, there is an adhesive coating device having a coating nozzle 20 shown in FIG.
The coating nozzle 20 having a funnel at one end and having a discharge port 2 at the tip thereof has a cylindrical shutter 11 for keeping the amount of the adhesive 3 to be applied constant, and a shutter 11 fitted in the shutter 11. In the axial direction of the shutter 1
Plunger 1 for extruding adhesive 3 in 1 from discharge port 2
2 and plunger 1 along the axis of plunger 12
And a needle valve 13 that penetrates through the discharge port 2 and closes one end 2 a of the discharge port 2.
The needle valve 13 is arranged coaxially with the shutter 11. Application nozzle 2 configured in this manner
The application operation at 0 will be described with reference to FIGS. First, at the time when the positioning for applying the adhesive 3 is performed, the application nozzle 20 is in a state shown in FIG. That is, the needle valve 13 closes one end 2 a of the discharge port 2, and the shutter 11 and the plunger 12 are in the ready state positions 22 and 2 in the container 10, respectively.
4. When an application start signal is input to the adhesive application device, as shown in FIG.
The shutter 11 is lowered by a driving means (not shown) to a coating state position 26 where one end 11a of the container 1 contacts the bottom surface 10a of the container 10, and a certain amount of the adhesive 3 is secured in the shutter 11. Next, as shown in FIG. 8C, the needle valve 13 moves up to the application state position 26.
Next, as shown in FIG. 8D, the plunger 12 descends to the application state position 26, and the adhesive 3 surrounded by the shutter 11 is discharged from the other end 2b of the discharge port 2 to the outside by this operation. Extruded. Next, as shown in FIG. 8E, the container 10 itself descends and stops until the other end 2b of the discharge port 2 almost contacts the substrate 4. At this time, the adhesive 3 extruded from the other end 2b is transferred to the substrate 4. Adhesive 3
Is transferred to the substrate 4, as shown in FIG.
The container 10 rises, and then descends until the needle valve 13 closes the one end 2a of the discharge port 2 again, and the shutter 11 rises to the ready state position 24, as shown in FIG. Next, as shown in FIG. 8 (h), the plunger 12 is raised to the ready state position 24, thereby sucking the adhesive 3 into the shutter 11, and returning to the original state shown in FIG. 8 (a).

[0005]

In the conventional adhesive coating apparatus described above, the water head pressure changes according to the change in the remaining amount of the adhesive 3 in the syringe 1 shown in FIG. There is a problem that the amount changes. In recent years, systems that visually recognize the applied adhesive and automatically change the application setting conditions based on the recognition result to keep the applied amount constant have been implemented. There is a problem in that the production operation time of the apparatus is reduced, and an extra visual recognition system needs to be mounted as a coating apparatus. Further, the above-described coating nozzle 20 shown in FIG.
, The shutter 1 in the coating nozzle 20 at the time of coating.
1, the plunger 12 and the needle valve 13 have a triple structure in which they move independently on the same axis, and the structure is complicated, so that it cannot cope with, for example, high-speed application of 10 points or more per second. There was a problem. Further, the application nozzle 2
In the case where a plurality of discharge ports 2 are provided, a shutter 11, a plunger 12, a needle valve 1
3 must be provided corresponding to the number of the discharge ports 2, and the structure becomes more complicated. Therefore, there is a problem that cleaning and maintenance of the application nozzle become difficult. The present invention has been made in order to solve such problems, and compared with a coating method in which compressed air is sent into a syringe and a viscous fluid is extruded from a nozzle, the temperature of the nozzle portion and the remaining amount of the viscous fluid are not affected. An object of the present invention is to provide a viscous fluid application method, a viscous fluid discharge nozzle, and a viscous fluid application device that can always perform application with a stable application amount and can perform a high-speed application operation.

[0006]

According to a first aspect of the present invention, there is provided a viscous fluid discharge nozzle comprising a container having a discharge port on a bottom surface for storing a viscous fluid, and a container disposed between a ready state position and a discharge state position. A single cylindrical member that reciprocates in the container along the axial direction of the cylinder, and moves the viscous fluid to the cylinder by moving one end of the cylindrical member toward the discharge state position where the one end abuts against the bottom surface. A cylindrical member which is arranged to flow into the internal space of the cylindrical member and separate the viscous fluid flowing into the internal space at the discharge state position and the viscous fluid existing around the cylindrical member in the container. A viscous fluid storage position where the member is slidably tightly fitted to the internal space of the cylindrical member and stores the viscous fluid in the internal space; and a position where the viscous fluid stored in the internal space is discharged. Viscous fluid A rod-shaped member that reciprocates along an axial direction of the cylindrical member between the discharge position and the cylindrical member, by moving to the viscous fluid discharge position when the cylindrical member is disposed at the discharge state position. A single rod-shaped member that discharges the viscous fluid contained in the internal space from the discharge port,
It is characterized by having.

According to a second aspect of the present invention, there is provided a viscous fluid application device configured to move both or one of a viscous fluid discharge nozzle and a circuit board according to the first aspect of the present invention. The viscous fluid in the viscous fluid discharge nozzle is applied to the electronic component mounting position by matching the arrangement position of the viscous fluid discharge nozzle.

According to a third aspect of the present invention, there is provided a viscous fluid applying method using the viscous fluid discharging nozzle according to the first aspect, wherein the viscous fluid discharging nozzle is provided at a position above an electronic component mounting position on a circuit board. And disposing the rod-shaped member at the viscous fluid accommodating position, moving the cylindrical member to the discharge state position, and the viscous fluid flowing into the internal space and the cylindrical shape in the container. A cylindrical member first moving step of separating the viscous fluid present on the peripheral side of the member, and moving the rod-shaped member to the viscous fluid discharge position in a state where the cylindrical member is disposed at the discharge state position A coating step of discharging the viscous fluid in the internal space of the cylindrical member from the discharge port to apply the electronic component to the electronic component mounting position, and after the coating step, move the cylindrical member to the ready state position And the cylindrical member second moving step of moving,
After the second cylindrical member moving step, the rod member is moved to the viscous fluid storage position, and thereafter the rod member moving step is shifted to the first cylindrical member moving step. .

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A viscous fluid discharge nozzle, a viscous fluid application device having the viscous fluid discharge nozzle, and a viscous fluid application method according to an embodiment of the present invention will be described below with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals. The viscous fluid application method is performed by a viscous fluid application device. First, the viscous fluid discharge nozzle 30 will be described with reference to FIG. The viscous fluid discharge nozzle 30 of the present embodiment is similar to the application nozzle 20 described above, and is for applying the adhesive 3 for temporarily fixing the electronic component to the electronic component mounting position of the circuit board to the electronic component mounting position. Nozzle. In this embodiment, the adhesive 3 is applied. However, the fluid to which the viscous fluid ejection nozzle 30 can be applied is not limited to the adhesive 3, and a generally viscous fluid such as cream solder can be handled. it can. The viscous fluid refers to a fluid that does not flow out of the discharge port spontaneously when stored in the viscous fluid discharge nozzle 30 and has such a viscosity that discharge becomes difficult. The viscous fluid discharge nozzle 30 includes the container 10, the rod 14, and the cylindrical member 15. One end of the container 10 containing the adhesive 3 has a funnel shape, and a discharge port 2 is formed at the center of the funnel-shaped portion 16, that is, at a portion where the axis of the container 10 passes. The viscous fluid discharge nozzle 30 of the present embodiment
In the funnel-shaped portion 16, a discharge pipe 36 projects below the container 10 along the axis of the container 10, and the discharge port 2 is formed through the inside of the discharge pipe 36. Further, the shape of the container 10 is not limited to the shape shown in the figure. For example, the one end may be a flat bottom surface instead of a funnel shape.

In the present embodiment, the cylindrical member 15 has a cylindrical shape having an internal space 39, and its outer diameter is slightly larger than the diameter of the discharge port 2. The inside of the container 10 is installed along the axis of the container 10 so as to be able to reciprocate between the discharge state position 32 and the ready state position 34 by the cylindrical member moving device 37 provided separately from the nozzle 30. Is done. The tubular member 15 is not limited to a cylindrical shape, and may be, for example, a square pipe. As shown in the figure, when the tubular member 15 is lowered and one end 15a of the tubular member 15 is disposed at the discharge state position 32 in contact with the inner surface 10a of the funnel-shaped portion 16, the internal space of the tubular member 15 is 39 is extended in the axial direction of the cylindrical member 15, the cylindrical member 1 is extended so that the discharge port 2 exists on the extension.
5 is arranged. In this state, the one end 1
A contact portion 33 between the inner surface 10 a and the inner surface 10 a surrounds the discharge port 2. When the one end 15a and the inner surface 10a come into contact with each other in this manner, the contact portion 33 causes the adhesive 3 on the discharge port side to contact.
a and the container-side adhesive 3b are prevented from flowing into each other. The adhesive 3a refers to an adhesive flowing into the internal space 39 of the tubular member 15, as described later.
The container-side adhesive 3b refers to the adhesive in the container 10 existing around the cylindrical member 15 excluding the adhesive 3 in the discharge pipe 36.

The rod-shaped member 14 is a rod-shaped member having a cross-sectional shape corresponding to the cross-sectional shape of the internal space 39 of the cylindrical member 15. In the present embodiment, the cylindrical member 15 has a cylindrical shape.
Corresponding to the above, the member has a cylindrical cross-sectional shape. Such a rod-shaped member 14 is fitted in close contact with the internal space 39 so as to be slidable in the internal space 39 of the cylindrical member 15. The viscous fluid discharge position 40 and the viscous fluid storage position 42 are reciprocated by a separately provided rod-shaped member moving device 38. Therefore, the rod-shaped member 14 acts to push out the adhesive 3 a flowing into the internal space 39 of the cylindrical member 15 to the outside of the cylindrical member 15. In this embodiment, the cylindrical member 1
A lid member 35 having a through hole passing through 5 and having an outer diameter in contact with the inner peripheral surface 10 b of the container 10 is placed on the liquid surface of the adhesive 3 stored in the container 10. Such a cover member 3
5 presses the adhesive 3 in the container 10 by its own weight and also has a function of scraping the adhesive 3 adhered to the inner peripheral surface 10b of the container 10.

The viscous fluid discharge nozzle 30 configured as described above is mounted on a head 6 provided on an XY robot 5 constituting a viscous fluid application device as shown in FIG. still,
Since the XY robot 5 equipped with the viscous fluid discharge nozzle 30 does not need to supply compressed air to the viscous fluid discharge nozzle 30, the XY robot 5 is not equipped with a device related to the supply of compressed air. A rod-like member moving device 38 and a cylindrical member moving device 37 are provided.

The operation of the viscous fluid discharge nozzle 30 and the viscous fluid application device configured as described above will be described below with reference to FIGS. 2 and 3 (a) to (g). In step (shown by "S" in the figure) 1 shown in FIG.
The viscous fluid coating device is used for the substrate 4 transferred from the previous process.
Is fixed to a predetermined position of the XY robot 5, the head 6 is moved by the X direction moving means 7 and the Y direction moving means 8a, 8b, and the ejection port 2 is moved to a position above the electronic component mounting position 4a on the substrate 4. Move. 3A to 3G show a state in which the viscous fluid discharge nozzle 30 is disposed at a position corresponding to the electronic component mounting position 4a. The operation of the viscous fluid discharge nozzle 30 in a state where the viscous fluid discharge nozzle 30 is arranged at a position corresponding to the electronic component mounting position 4a will be described below.

In step 2 of FIG. 2, (a) of FIG.
As shown in (5), the cylindrical member 15 is lowered by the cylindrical member moving device 37 to the discharge state position 32 where one end 15a of the cylindrical member 15 contacts the inner surface 10a of the funnel-shaped portion 16. On the other hand, since the rod-shaped member 14 remains at the viscous fluid accommodating position 42, when the cylindrical member 15 is lowered to the discharge state position 32, the internal space 39 of the cylindrical member 15 is lowered.
The adhesive 3 flows into. Then, the contact portion 33 surrounds the discharge port 2. Accordingly, the adhesive 3a is confined in the internal space 39 of the tubular member 15. In step 3 of FIG. 2, as shown in FIG. 3B, the rod-shaped member moving device 38 causes the rod-shaped member 14 to discharge the viscous fluid while the cylindrical member 15 is disposed at the discharge state position 32. It descends to the position 40. In the present embodiment, the discharge state position 32 where the tubular member 15 is disposed and the viscous fluid discharge position 40 where the rod-shaped member 14 is disposed are the same position.
At this time, since the cylindrical member 15 is disposed at the discharge state position 32, the adhesive 3a on the discharge port side is formed by the contact portion 33 between the one end 15a of the cylindrical member 15 and the inner surface 10a as described above. And the container-side adhesive 3b are prevented from flowing into each other. Therefore, when the rod-shaped member 14 is lowered to the viscous fluid discharge position 40, the adhesive 3a
The liquid is discharged from the distal end 36a of the discharge pipe 36 and is maintained in a state of being spherically attached to the distal end 36a. In step 4 of FIG. 2, as shown in FIG. 3C, the head 6 is moved in the Z direction until the tip end 36a substantially contacts the electronic component mounting position 4a, whereby the viscous fluid discharge nozzle 30 itself is moved. Is lowered and the adhesive 3 adhering spherically to the tip 36a
Is spotted on the electronic component mounting position 4a to perform a coating operation. After the application, the viscous fluid discharge nozzle 30 moves up as shown in FIG.

In step 5 of FIG. 2, as shown in FIG. 3E, the cylindrical member 15 is moved by the cylindrical member moving device 37 while the rod member 14 is disposed at the viscous fluid discharge position 40. It is raised to the ready state position 34. In step 6 of FIG. 2, as shown in FIG. 3 (f), the rod 14 is also raised to the viscous fluid storage position 42 by the rod moving device 38. In the present embodiment, the ready state position 34 where the tubular member 15 is disposed and the viscous fluid storage position 42 where the rod 14 is disposed are the same position. Then, in step 7, it is determined whether or not to apply the adhesive 3 to another electronic component mounting position 4a.
If the application operation is to be continued, the process returns to step 1 again.
On the other hand, if the application operation is not continued, the operation ends.

As is apparent from the above description, in the viscous fluid discharge nozzle 30 of the present embodiment, the cylindrical member 15
Since the contact portion 33 at one end 15a of the sealant surrounds the discharge port 2 and separates the adhesive 3a housed in the internal space 39 and the container-side adhesive 3b, the adhesive 3 discharged from the discharge port 2 Is the discharge amount of the adhesive 3a stored in the internal space 39 of the cylindrical member 15, that is, the amount of the cylindrical member 15
The amount of application of the adhesive 3 to the electronic component mounting position 4a can be determined by the amount of lowering of the rod-shaped member 14 in the inside. Therefore, if the viscous fluid accommodating position 42 is always a constant position and the amount of downward movement of the rod-shaped member 14 is always constant, a fixed amount of the adhesive 3 can be always applied to each electronic component mounting position 4a.

In the above embodiment, when the diameter of the discharge port 2 is set to 2 mm or more, as shown in FIGS.
When ascending from 0 to the viscous fluid storage position 42, air enters from the outside of the viscous fluid discharge nozzle 30 to the inside of the viscous fluid discharge nozzle 30 through the discharge port 2 and causes a variation in application amount. Become. Therefore, in the above-described embodiment, it is preferable that the diameter of the discharge port 2 be less than 2 mm and the viscosity of the adhesive 3 be 100000 centipoise or more.

In the above-described embodiment, the adhesive 3 spherically attached to the tip 36a is applied to the electronic component mounting position 4a.
In step 4, the viscous fluid discharge nozzle 30 itself was lowered in order to perform spot application, but the application operation is not limited to this. That is, the rod member 14 is moved to the viscous fluid storage position 4 so that a pressure of 5 to 10 times the atmospheric pressure acts on the adhesive 3 a stored in the internal space 39 of the cylindrical member 15.
By appropriately setting the speed of moving from the nozzle 2 to the viscous fluid discharge position 40 and the diameter of the discharge port 2, the adhesive 3 is transferred from the discharge port 2 to the electronic component mounting position 4 a as the rod 14 descends in Step 3. It can also be injected. In this case, the operation in step 4 becomes unnecessary.

In the above-described embodiment, the substrate 4 is fixed and the viscous fluid discharge nozzle 30 is moved to the electronic component mounting position 4a. However, the present invention is not limited to this. May be moved, or both may be moved together. In the above-described embodiment, when the adhesive 3 is applied to the electronic component mounting position 4a by lowering the viscous fluid discharge nozzle 30 itself, the viscous fluid discharge nozzle 30 is moved above the electronic component mounting position 4a. rear,
The adhesive 3 is discharged, but the invention is not limited thereto. After the adhesive 3 is discharged, the viscous fluid discharge nozzle 30 may be moved to the electronic component mounting position 4a, or the viscous fluid may be discharged while the adhesive 3 is discharged. The discharge nozzle 30 may be moved to the electronic component mounting position 4a.

Further, a plurality of discharge ports 2 can be provided like a viscous fluid discharge nozzle 50 shown in FIG. The diameter of each discharge port 2 is preferably less than 2 mm. Further, the number of the discharge ports 2 and the arrangement pitch of the discharge ports 2 can be freely determined according to the purpose of use. By providing a plurality of discharge ports 2 in this manner, the operation of one rod-shaped member 14 enables high-speed, quantitative and
A large amount of the adhesive 3 can be applied to the electronic component mounting position 4a. In the conventional coating nozzle 20 described with reference to FIG. 7, when a plurality of discharge ports 2 are provided, it is necessary to provide a shutter 11, a plunger 12, and a needle valve 13 for each discharge port 2. However, in the viscous fluid discharge nozzle 50 of the present embodiment, even when a plurality of discharge ports 2 are provided, only one rod-shaped member 14 and one cylindrical member 15 may be provided. Therefore, the rod-shaped member 1 corresponds to the number of the discharge ports 2.
The structure of the viscous fluid discharge nozzle of the present embodiment does not need to be changed, and the structure of the cylindrical member 15 has a versatile structure. Therefore, for example, the discharge pipe 36 formed with the discharge port 2
The same container 1
0, the number of the discharge ports 2 can be changed by the rod-shaped member 14 and the cylindrical member 15. Even when a plurality of outlets 2 are provided, all the outlets 2 are arranged inside the contact portion 33 at one end 15a of the tubular member 15.

[0021]

As described above in detail, according to the viscous fluid discharge nozzle of the first aspect of the present invention, the viscous fluid application device of the second aspect, and the viscous fluid application method of the third aspect, at the discharge state position, A tubular member arranged to separate the viscous fluid flowing into the internal space and the viscous fluid in the container,
A rod-shaped member that discharges the viscous fluid that has flowed into the internal space of the cylindrical member, and prevents the viscous fluid present in the internal space of the cylindrical member from leaking to a portion other than the discharge port. Moved to position. Therefore, the amount of viscous fluid discharged from the viscous fluid discharge nozzle is smaller than the temperature of the viscous fluid discharge nozzle and the viscosity of the viscous fluid compared to the conventional coating nozzle or coating method in which compressed air is fed into the syringe to push out the adhesive from the coating nozzle. The amount can be always stable without being affected by the remaining amount. Therefore, naturally, an auxiliary device such as a visual recognition system is not required. Further, the mechanism for discharging the viscous fluid is not composed of the three members of the shutter, the plunger and the needle valve as in the conventional application nozzle, but is composed of the cylindrical member and the rod-shaped member as described above. Since it is composed of members, each member can surely follow even in high-speed operation, so that high-speed operation is possible and high-speed coating operation is possible.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a structure of a viscous fluid discharge nozzle according to an embodiment of the present invention.

FIG. 2 is a flowchart illustrating an operation of a viscous fluid application method according to an embodiment of the present invention.

3 (a) to 3 (g) are diagrams showing the operation of the viscous fluid discharge nozzle shown in FIG. 1 in the viscous fluid application method shown in FIG.

FIG. 4 is a sectional view of a viscous fluid discharge nozzle according to another embodiment of the viscous fluid discharge nozzle shown in FIG.

FIG. 5 is a perspective view showing a configuration of a viscous fluid application device.

FIG. 6 is a sectional view showing a conventional application nozzle.

FIG. 7 is a sectional view of an application nozzle in another example of a conventional application nozzle.

8 (a) to 8 (h) are views showing the operation of the application nozzle shown in FIG. 7 in a conventional adhesive application method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Container, 14 ... Bar-shaped member, 15 ... Cylindrical member, 15a
One end, 16 Funnel-shaped part, 30 Viscous fluid discharge nozzle, 32 Discharge state position, 33 Contact part, 34 Ready state position, 37 Cylindrical member moving device, 38 Rod-shaped member moving device, 39 ... internal space, 40 ... viscous fluid discharge position, 4
2: Viscous fluid storage position, 50: Viscous fluid discharge nozzle.

Claims (6)

[Claims] 1. A container (10) having a discharge port (2a) on the bottom surface (10a) and containing a viscous fluid, and a shaft between the preparation state position (34) and the discharge state position (32). A single cylindrical member that reciprocates in the container along the direction, and one end (15a) of the cylindrical member moves toward the discharge state position, which is a position where it contacts the bottom surface. The viscous fluid (3a) which has flowed into the internal space (39) of the tubular member and has flowed into the internal space at the discharge state position and the viscous fluid (3b) present around the cylindrical member in the container. And a viscous fluid storage position which is slidably tightly fitted to the internal space of the cylindrical member and stores the viscous fluid in the internal space. (42) and viscosity stored in the above internal space A rod-shaped member that reciprocates along the axial direction of the cylindrical member between a viscous fluid discharge position (40) that is a position for discharging a body, and the cylindrical member is disposed at the discharge state position. A single rod-shaped member (14) for discharging the viscous fluid contained in the internal space from the discharge port by moving to the viscous fluid discharge position. nozzle. 2. The viscous fluid discharge nozzle according to claim 1, wherein a plurality of said discharge ports are arranged in a cross section of said internal space in a direction orthogonal to an axial direction of said cylindrical member at said one end. 3. The viscous fluid discharge nozzle (3) according to claim 1,
0, 50) and / or the circuit board so as to be movable, and the electronic component mounting position on the circuit board and the arrangement position of the viscous fluid discharge nozzle are matched so that the viscosity in the viscous fluid discharge nozzle is A viscous fluid application device for applying a fluid to the electronic component mounting position. 4. A viscous fluid application method using a viscous fluid discharge nozzle according to claim 1, wherein the viscous fluid discharge nozzle (30, 50) is disposed at a position above an electronic component mounting position on a circuit board. S1)
And moving the rod-shaped member (14) into the viscous fluid storage position (42).
The cylindrical member (15) is moved to the discharge state position (32) in the state where the viscous fluid (3a) flowing into the internal space (39) and the peripheral side of the cylindrical member in the container. A cylindrical member first moving step (S2) for separating the viscous fluid (3b) existing in the cylindrical member; and the rod-shaped member (14) in the state where the cylindrical member is disposed at the discharge state position. Discharge position (40)
(S3, S4) in which the viscous fluid in the internal space of the cylindrical member is discharged from the discharge port and applied to the electronic component mounting position. After the cylindrical member second moving step (S5) for moving the cylindrical member to the ready state position, and after the cylindrical member second moving step, the rod member is moved to the viscous fluid storage position, and then the cylindrical member first A stick-like member moving step (S6) for shifting to a moving step. 5. The method of applying the viscous fluid to the circuit board in the applying step, comprising: moving the circuit board and the viscous fluid discharge nozzle relatively; 5. The viscous fluid applying method according to claim 4, wherein the viscous fluid is applied to the electronic component mounting position by matching the viscous fluid discharge nozzle arrangement position. 6. The method of applying the viscous fluid to the circuit board in the applying step, wherein the viscous fluid stored in the internal space of the cylindrical member is moved by moving the rod-shaped member to the viscous fluid discharge position. 5. The method for applying a viscous fluid according to claim 4, wherein the method is performed by injecting the viscous fluid from the discharge port to the electronic component mounting position.