JPS6330130Y2 - - Google Patents
Info
- Publication number
- JPS6330130Y2 JPS6330130Y2 JP1979139898U JP13989879U JPS6330130Y2 JP S6330130 Y2 JPS6330130 Y2 JP S6330130Y2 JP 1979139898 U JP1979139898 U JP 1979139898U JP 13989879 U JP13989879 U JP 13989879U JP S6330130 Y2 JPS6330130 Y2 JP S6330130Y2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- lead wire
- conductor part
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 18
- 239000011889 copper foil Substances 0.000 claims description 12
- 239000012212 insulator Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 238000010618 wire wrap Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1979139898U JPS6330130Y2 (lv) | 1979-10-09 | 1979-10-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1979139898U JPS6330130Y2 (lv) | 1979-10-09 | 1979-10-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5657476U JPS5657476U (lv) | 1981-05-18 |
JPS6330130Y2 true JPS6330130Y2 (lv) | 1988-08-12 |
Family
ID=29371248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1979139898U Expired JPS6330130Y2 (lv) | 1979-10-09 | 1979-10-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6330130Y2 (lv) |
-
1979
- 1979-10-09 JP JP1979139898U patent/JPS6330130Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5657476U (lv) | 1981-05-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6330130Y2 (lv) | ||
JPS583008U (ja) | チツプ型コイル | |
JPS6133613Y2 (lv) | ||
JPS6224888Y2 (lv) | ||
JPS607532Y2 (ja) | 同軸−コプレナ線路変換器 | |
JPS6023898Y2 (ja) | 同軸ケ−ブルの接続部の構造 | |
JPS5824979U (ja) | 端子台 | |
JPS593558Y2 (ja) | 高周波機器 | |
JPS5918578Y2 (ja) | フレキシブルプリントケ−ブル | |
JPH0615422Y2 (ja) | 樹脂封止プリント配線基板 | |
JPH0249758Y2 (lv) | ||
JPS6336666Y2 (lv) | ||
JPH0353438Y2 (lv) | ||
JPS6041744Y2 (ja) | リ−ドレス電子部品用回路基板 | |
JPH0119395Y2 (lv) | ||
JPS6331487Y2 (lv) | ||
JPS59159970U (ja) | 金属コア入り回路基板 | |
JPH0537114A (ja) | ハイブリツド回路装置 | |
JPS5925442U (ja) | サ−ミスタ温度センサ | |
JPS6226923U (lv) | ||
JPS58104018U (ja) | デイレ−ライン | |
JPS5916080U (ja) | 電線の端子金具 | |
JPS6081671U (ja) | 電気回路基板 | |
JPS5857111U (ja) | 小型ノイズフイルタ− | |
JPS58148848U (ja) | 電気部品保護装置 |