JPS63292639A - Apparatus for measuring and inspecting semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To perform marking based on only one measurement without manipulating the control programs of hardware and a measuring device, in a full- automatic wafer prober, which inspects a semiconductor integrated circuit device in a wafer state, by storing the measured data, which are obtained for every chip, together with the position data of said chip, and generating signals, which are required for marking, with a marking control mechanism. CONSTITUTION:The interface part of a measuring apparatus is made to act as an interface for the measured result of each chip between a measuring device 10 and a full automatic wafer prober 100. The measured result from the interface 101 and the position data of said chip are stored in a storage mechanism 102. An operator inputs marking conditions with a marking condition input mechanism 104 based on the stored measured result. A marking signal control mechanism 105 reads the measured result and the position data for every chip from the storage mechanism 102. A marking signal 301 is inputted into a marking mechanism 106, and a marking position signal 302 is inputted into a wafer position control mechanism 107. Marking is performed on each chip on a wafer 20 with the marking mechanism.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a measurement and inspection device for semiconductor integrated circuit devices.
In particular, it relates to a marking method for a fully automatic wafer prober.

[Conventional technology]

Conventionally, this type of marking device has a wafer transport mechanism 10.
9, the wafer 20 is carried in, and the alignment mechanism 108
The wafer 20 is positioned based on the wafer position control mechanism 107 according to the command, the positioned wafer 20 is measured by the measuring device 10, and the defect signal 305 is inputted to the marking mechanism 106 via the measuring device interface 101. The marking mechanism 106 imprints a defective mark on a part of the chips on the wafer 20. 110 is a central control mechanism that controls the drive of each of the above-mentioned devices.

[Problem that the invention seeks to solve]

In the conventional marking apparatus shown in FIG. 2 described above, marking of each chip on the wafer 20 was performed simultaneously with measurement and marking based on conditions preset by the wafer under test, so there was no possibility of abnormalities in the manufacturing process or circuitry. In the event that an abnormality occurs in the wafer due to a design error, an abnormality in the measurement system, a contact failure between the probe and the pad on the chip, an operational error in the measurement equipment, etc., all chips must be marked. The disadvantage was that re-measurement and failure analysis were not possible.

Therefore, as shown in FIG. 3, a storage mechanism 102 is installed,
A method has been devised in which the measurement results are once stored in the storage mechanism 102 and then marked all at once. 105 is a marking signal control mechanism.

This method requires measurement only once, such as when measuring a prototype for the first time, or when trying to count non-defective chips by capability level and decide which level up to which level is considered good based on the number of chips. For example, if the marking conditions could not be determined, measurements had to be carried out two or more times. In these cases, the number of times the probe is applied to the pads of each chip increases, resulting in damage to the pads of the chips, which has the disadvantage of lowering the yield during assembly.

SUMMARY OF THE INVENTION An object of the present invention is to provide a measurement/inspection device that eliminates the above-mentioned problems.

=3- [Differences between the invention and the prior art] In contrast to the conventional marking method described above, the present invention makes it possible to modify the hardware and the control program of the measuring device by performing only one measurement under arbitrary conditions. It has an original content of marking chips on a wafer without any marking.

[Means for solving problems]

The present invention provides a Fluoro 1-wafer prober for testing semiconductor integrated circuit devices in a wafer state, including a memory mechanism for storing measurement data obtained for each chip together with positional information of the chip, and an S constant stored in the memory mechanism. A recording/displaying mechanism for monitoring results, and a marking signal for generating signals necessary for marking by the marking mechanism based on the data stored in the storage mechanism or the data sent from the measuring device every time one chip is measured. This is a measurement/inspection device for semiconductor integrated circuit devices characterized by having a control mechanism and a marking condition input mechanism for setting marking conditions in the marking signal control mechanism.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 shows the configuration of a fully automatic wafer blobber having a marking device according to the present invention. Reference numeral 101 denotes a measuring device interface, which provides 4111 constant results 3 for each chip between the measuring device 10 and the fluoro-wafer prober 100.
This is a mechanism for interfacing 00. ]02 is a storage mechanism, and measurement result 3 from the interface 101
This is a mechanism that stores 00 and the position information of the chip together. A display mechanism 103 displays data stored in the storage mechanism 102 to the operator 200, and based on the displayed measurement results, the operator 200 inputs marking conditions 405 through the marking condition input mechanism 104.

105 is a marking signal control mechanism, and a storage mechanism 10
2, the measurement results and position information 303 for each chip are read out, and the marking signal 301 is input to the marking mechanism 106, and the marking position signal 302 is input to the wafer position control mechanism 107, respectively. A marking mechanism 106 is a mechanism for marking each chip on the wafer 20.

A wafer position control mechanism 107 is a mechanism for accurately moving the wafer 20 during measurement and marking.

Reference numeral 108 denotes an alignment mechanism, which aligns the position of the wafer with the reference position before measurement or ÷-king.

Reference numeral 109 denotes a wafer transport mechanism, which stores wafers that have been measured and marked, and sets unmeasured or unmarked wafers in the wafer position control mechanism 107.

110 is a central control mechanism that centrally controls these mechanisms.

1 stores the measurement results of each chip in the storage mechanism 102.
This is the signal flow of the method that stores the number of minutes, and the above operation is performed.

2 is a signal flow for a method in which marking is performed for each chip measured; the marking conditions are set before measurement using the marking condition input mechanism 104, and the marking signal is sent to the marking mechanism 1 using the marking signal control mechanism 105.
Occurs towards 06.

That is, the present invention provides the recording and display mechanism 103. A marking condition input mechanism 104 is provided, and in order to determine items to be marked according to the measurement results stored in the storage mechanism 102, the display mechanism 103 monitors the items, and the input mechanism 104 selects measurement items to be marked as necessary. input. In addition, when marking with multiple items, the AN of each item
The marking signal control mechanism 105 uses logic such as D and OR to control the marking signal.

Furthermore, if the marking conditions are determined in advance and the marking signals output by the control program of the measuring device are different from those conditions, the measurement results are directly sent to the marking signal control mechanism 105 without being stored in the storage mechanism 102. A marking signal is generated according to the conditions input from the marking condition input mechanism 104.

An example of the use of the marking method according to the present invention is when all chips on one wafer are measured once in the measurement of a prototype, and marking items are determined based on the results.
This is effective when determining the level of non-defective products based on the level of the wafer after measuring all chips on one wafer in mass production.

〔Effect of the invention〕

As explained above, the present invention stores all the measurement results of each chip sent from the measurement device to the fully automatic wafer prober for one process, or fixes the marking signal using hardware. By generating a marking signal based on the measurement result without having to manually mark the chips on the wafer, it is possible to mark the chips on the wafer under any conditions with just one measurement without having to modify the hardware or the control program of the measurement device. The effect is that it can be done.

[Brief explanation of the drawing]

Fig. 1 is a configuration diagram showing one embodiment of the present invention, Fig. 2, Fig. 3
The figure is a configuration diagram showing a conventional example. 102... Storage mechanism 103... Record display mechanism 104... Marking condition input mechanism 105.
...Marking signal control mechanism 106...Marking mechanism

Claims (1)

[Claims] (1) A fully automatic wafer prober that inspects semiconductor integrated circuit devices in the wafer state includes a storage mechanism that stores measurement data obtained for each chip together with the position information of that chip, and a storage mechanism that stores measurement results stored in the storage mechanism. A recording display mechanism for monitoring, and a marking signal control mechanism for generating signals necessary for marking by the marking mechanism based on the data stored in the storage mechanism or data sent from the measuring device every time one chip is measured. and a marking condition input mechanism for setting marking conditions in the marking signal control mechanism.