JPS63250505A - Wiring pattern inspection device - Google Patents

Abstract

PURPOSE:To detect a defect of a wiring pattern speedily and automatically by storing data on the wiring pattern on the surface of a normal article in a storage means as reference data, and comparing this wiring pattern with the wiring pattern on a wafer surface to be inspected by a CPU. CONSTITUTION:The wafer 7 to be inspected is placed on a stage 8 and the wiring pattern on the surface of the wafer 7 is read by an optical reading means 9. Data on the image obtained by the means 9 is converted by an electric signal converting means 10 into an electric signal, which is sent to the CPU 3. This electric signal is compared with the data on the wiring pattern on the surface of the reference normal article which is stored previously in the storage means 6 automatically to make a decision 6 on whether or not the article is normal. Consequently, whether or not the wiring pattern of a chip has a different part is inspected, so a development process is shortened and the quality is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wiring pattern inspection device that automatically detects wiring pattern defects during LSI test VC.

[Conventional technology]

Figure 2 shows an example of an inspection device used in LSI testing. In the figure, (1) is the device under test, and (2) is the external circuit that is necessary to measure the device under test. Performance board made on printed circuit board, +31fl
A barf resistance board (2) is attached to the above-mentioned device under test (1).
A central processing unit that determines whether the device under test is operating accurately based on the signals output from the device under test fi+ by inputting commands through the central processing unit! (hereinafter referred to as CPU), f4
t is a keyboard for controlling this CPU +31 from the outside, (61 is a CRT that functions to output the judgment of the CPU (31), and (61 Its storage means for storing the test program).

A test program created according to the type of device to be measured (1) is input into the (PtJ (3)) from the storage means (6), and inspected for errors in operation using an inspection device as shown in Figure 2. ◇ For example, a signal to execute a certain command is input from the CPU +31 through the device under test (1) and the performance port (2), and the CPtJ (31) sends a signal to the device under test that this command has been executed. Judging from the signal output from f11, it is determined whether the product is good or not.

[Problem that the invention seeks to solve]

For example, when inspecting a microcomputer in a memory, it is necessary to check whether completely unrelated memory contents have changed when a certain instruction is executed in X rows due to pattern defects caused by wafer processing. In this case, a test program is created to perform the above-mentioned confirmation. Creating such a test program requires a lot of time and effort.

Another problem is that the longer the test program, the longer the LSI development period.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an inspection device that can quickly and automatically detect defects in wiring patterns.

[Means for Solving the Problems] The inspection apparatus according to the present invention stores data of a wiring pattern on the surface of a non-defective wafer as a reference in advance in the storage means, and compares this wiring pattern with the surface of the wafer to be inspected. The chip is compared with the wiring pattern by the CPU to check whether there are any different locations in the wiring pattern of the chip.

[Effect]

The device according to the present invention, which is composed of a CPU and a storage means, automatically compares the data of the wiring pattern on the surface of the wafer to be inspected with the data of the wiring pattern on the surface of the wafer to be inspected, which is a standard stored in advance. By doing so, tests can be performed without creating a test program.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (7) is a wafer to be inspected, on which a desired wiring pattern (not shown) has been formed in advance. (This wafer (7) is placed on the wafer 81.)

stage, optical reading means for optically reading the wiring pattern on the surface of the 191U wafer (), 1101
fi electrical conversion means for converting the image obtained from the optical reading means (9) into an electrical signal; It is a CPU that compares the wiring pattern data outputted from the signal conversion means (101) and the distribution pattern data stored in the storage means (61) to determine good products.

A wafer (7) to be inspected is placed on a stage (8), and the wiring pattern on the surface of the wafer (7) is read by an optical reading means (9). This optical reading means (9
) is converted into an electric signal by the electric signal converting means (lO) and sent to the CPU (31).

The electrical signal and data of the wiring pattern on the surface of a good wafer, which serves as a reference and is stored in advance in the storage device (6), are sent to the CPU.
F61 automatically compares and determines whether it is good or bad.

In addition, in the previous medical example, the inspection of the wiring pattern on the wafer (7) was explained, but it can also be applied to the inspection of chips.

〔Effect of the invention〕

As described above, according to the present invention, data of the wiring pattern on the surface of a non-defective wafer serving as a reference is stored in advance in the storage means, and this wiring pattern and the wiring pattern on the surface of the wafer to be inspected are stored in the CPU. By comparing and inspecting whether there are any differences in the wiring pattern of the chip, development time can be shortened and quality can be improved.

[Brief explanation of the drawing]

FIG. 1 is a structural diagram of an inspection device according to an embodiment of the present invention;
FIG. 2 is a structural diagram of a conventional inspection device. fllU device under test, (2) is Bar 7 Omance board,
(3) is a central OIL, JiE processing device, (4) is a keyboard, (6) is a CRT, 161 is a storage means, (7) is a wafer, (8) is a stage, (9) is an optical reading means, (Lot is an electrical code conversion means. In each figure, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] A storage means for storing a reference wiring pattern, an optical reading means for reading the wiring pattern of a semiconductor device, a signal conversion means for converting the wiring pattern read from the optical reading means into an electrical signal, and the signal conversion means The signal of the wiring pattern is inputted from, and this signal and
A wiring pattern inspection device comprising a calculation means for comparing the wiring pattern stored in the storage means and determining the presence or absence of a difference.