JPS63292615A - Manufacture of solid electrolytic capacitor - Google Patents
Manufacture of solid electrolytic capacitorInfo
- Publication number
- JPS63292615A JPS63292615A JP12901087A JP12901087A JPS63292615A JP S63292615 A JPS63292615 A JP S63292615A JP 12901087 A JP12901087 A JP 12901087A JP 12901087 A JP12901087 A JP 12901087A JP S63292615 A JPS63292615 A JP S63292615A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- capacitor element
- lead
- die
- cutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 58
- 239000007787 solid Substances 0.000 title claims description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000001179 sorption measurement Methods 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 abstract description 12
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000000630 rising effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
固体電解コンデンサの製造方法であり、リード線の一端
を接続してなるコンデンサ素子を、陽極リード片および
陰極リード片の形成されたリードフレームに搭載するに
際し、リード線は潰し加工したのち所定長さに切断する
ようにしたことにより、
該切断用カッタが長寿命化し、該搭載の位置精度を向上
せしめたものである。[Detailed Description of the Invention] [Summary] A method for manufacturing a solid electrolytic capacitor, in which a capacitor element formed by connecting one end of a lead wire is mounted on a lead frame on which an anode lead piece and a cathode lead piece are formed. By crushing the lead wire and cutting it to a predetermined length, the life of the cutting cutter is extended and the positioning accuracy of the mounting is improved.
（産業上の利用分野〕
本発明は固体電解コンデンサの製造方法、特に多数の陽
極リード片および陰極リード片を形成してなるリードフ
レームにコンデンサ素子を搭載するに際し、コンデンサ
素子に一端を接続したリード線の他端を切断するカッタ
の寿命を改善し、該搭載の位置精度を正確にする改良に
関する。(Industrial Application Field) The present invention relates to a method for manufacturing a solid electrolytic capacitor, and in particular, to a method for manufacturing a solid electrolytic capacitor, in particular, when a capacitor element is mounted on a lead frame formed of a large number of anode lead pieces and cathode lead pieces, a lead having one end connected to the capacitor element is used. The present invention relates to an improvement that improves the life of a cutter that cuts the other end of a wire and improves the positional accuracy of the cutter.
第２図は固体電解コンデンサの外装を破断した側面図で
ある。FIG. 2 is a side view with the exterior of the solid electrolytic capacitor cut away.
第２図において、固体電解コンデンサ（チップタンタル
コンデンサ）■は、左側端面にリード線２の一端を接続
した陽極体の表面に誘電体層、酸化物半導体層、半田陰
極層が形成されたコンデンサ素子３と、リード線２に溶
接した陽極リート−′片４と、コンデンサ素子３の半田
層に半田付しノした陰極リード片５と、コンデンサ素子
３．リード線２と陽極リード片４との接続部、半田層と
陰極リード片５との接続部を被覆する外装６からなり、
リード片４と５は外装６より突出する部分を外装６に沿
って曲げ加工してなる。In Figure 2, a solid electrolytic capacitor (chip tantalum capacitor) ■ is a capacitor element in which a dielectric layer, an oxide semiconductor layer, and a solder cathode layer are formed on the surface of an anode body with one end of lead wire 2 connected to the left end surface. 3, an anode lead piece 4 welded to the lead wire 2, a cathode lead piece 5 soldered to the solder layer of the capacitor element 3, and a capacitor element 3. It consists of an exterior sheath 6 that covers the connecting portion between the lead wire 2 and the anode lead piece 4, and the connecting portion between the solder layer and the cathode lead piece 5,
The lead pieces 4 and 5 are formed by bending the portions protruding from the sheath 6 along the sheath 6.
第３図と第４Ｍは固体電解コンデンサ１を量産する主要
工程の説明図である。3 and 4M are explanatory diagrams of the main steps for mass producing the solid electrolytic capacitor 1.
コンデンサ素子３のハツチ処理を説明するための第３図
において、複数個のコンデンサ素子３ば、所定長さより
適当に長いＩＪ−ド線２を使用し、金属ハーフに支持せ
しめたＶｉＪ極体の表面に誘電体層。In FIG. 3 for explaining the hatching process of capacitor elements 3, a plurality of capacitor elements 3 are connected to the surface of a ViJ pole body supported by a metal half using IJ wires 2 that are appropriately longer than a predetermined length. dielectric layer.
酸化物半導体層、半田陰極層を積層形成してなる。It is formed by stacking an oxide semiconductor layer and a solder cathode layer.
しかるのち、コンデンサ素子３は図中に一点鎖線で示す
如く、リード線２の中間部を切断しコンデンサ組立装置
に供給される。その際、金属ハーフから突出するり一層
線２の長さＬにばらつきがあるため、ツー１−′線２は
所定長さよりやや長い寸法ｌに切断したのち、所定長さ
に切り揃えると共に、リード線２とリード片４との溶接
を確実にするため、リート線２の表面に被着した化成被
膜を破壊する平押しく圧潰）加工が必要である。Thereafter, the capacitor element 3 is supplied to a capacitor assembly apparatus by cutting the intermediate portion of the lead wire 2 as shown by the dashed line in the figure. At that time, since there are variations in the length L of the single layer wire 2 protruding from the metal half, the tool 1-' wire 2 is cut to a dimension l slightly longer than the specified length, and then trimmed to the specified length, and the lead In order to ensure welding between the wire 2 and the lead piece 4, it is necessary to flatten the lead wire 2 to destroy the chemical conversion film deposited on the surface of the lead wire 2.
第４図はリード線２を圧潰し所定長さに切断したコンデ
ンサ素子３をリードフレームに搭載した平面図（イ）と
、その側面図（ロ）である。FIG. 4 is a plan view (A) in which the capacitor element 3 obtained by crushing the lead wire 2 and cutting it to a predetermined length is mounted on a lead frame, and a side view (B) thereof.
第４図において、例えば厚さ０．１ｍｍの磨き鉄板に半
田めっきしてなるリードフレーム７は、中間部を２段曲
げした多数個の陽極リード片４と、各陽極リード片４に
対向する陰極リード片５および送り孔８を形成してなり
、所定長さ６／切断されたリード線２はリード片４に溶
接し、コンデンサ素子３の半田層はリード片５に半田付
けされる。In FIG. 4, a lead frame 7 made of a polished iron plate with a thickness of 0.1 mm and solder-plated, for example, has a large number of anode lead pieces 4 whose middle portions are bent in two stages, and a cathode facing each anode lead piece 4. The lead wire 2, which is formed by forming a lead piece 5 and a feed hole 8 and is cut to a predetermined length 6, is welded to the lead piece 4, and the solder layer of the capacitor element 3 is soldered to the lead piece 5.
このように、コンデンサ素子３を搭載したり−ドフレー
ム７は、外装６を形成したのち、リード片４および５の
根元部分で切断し、外装６より突出するり一層片４．５
を外装６に沿って曲げ加工し、固体電解コンデンサ１が
完成する。In this way, the frame 7 on which the capacitor element 3 is mounted is formed with the outer sheath 6 and then cut at the root portions of the lead pieces 4 and 5 to form one layer piece 4.5 that protrudes from the sheath 6.
is bent along the exterior 6 to complete the solid electrolytic capacitor 1.
しかし、６０度ずつ回転するロータを使用し、コンデン
サ素子３を定位置にクランプする工程と、リード線２の
圧潰工程と、リード線２を所定長さに切断する工程とは
、２ステーシヨンで行う必要から、圧潰工程と切断工程
とを同時に実施していた。However, using a rotor that rotates by 60 degrees, the process of clamping the capacitor element 3 in a fixed position, the process of crushing the lead wire 2, and the process of cutting the lead wire 2 to a predetermined length are performed at two stations. Due to necessity, the crushing process and cutting process were performed simultaneously.
第５図は従来技術の問題点を説明するための図であり、
従来、コンデンサ素子３に一端が接続されたリード線２
は、コンデンサ素子３を位置決めした状態でクランプし
たのち、上下動するダイ１１とストリッパ１２で押圧し
圧潰すると同時に、ストリッパ１２の左側面に沿って上
下動するカッタ１３にて所定長さに切断し、リード線２
の余長部分１４を除去している。FIG. 5 is a diagram for explaining the problems of the prior art.
Conventionally, a lead wire 2 with one end connected to a capacitor element 3
After the capacitor element 3 is positioned and clamped, it is pressed and crushed by a vertically moving die 11 and a stripper 12, and simultaneously cut into a predetermined length by a cutter 13 that moves vertically along the left side of the stripper 12. , lead wire 2
The extra length portion 14 is removed.
従って、圧潰によるカッタ１３の側面を押す側圧Ｐが生
じ、そのことでコンデンサ素子３の位置がずらされると
共に、カッタ１３は通常のものより寿命が短い、または
、機械的強度を強くしなければならないという問題点が
あった。Therefore, a lateral pressure P pushing the side surface of the cutter 13 due to the crushing is generated, which shifts the position of the capacitor element 3, and the life of the cutter 13 is shorter than that of a normal cutter, or the mechanical strength must be increased. There was a problem.
上記問題点の除去を目的とした本発明方法は、第１図の
実施例によれば、リードｖＡ２の一端を接続した陽極体
の表面に誘電体層、酸化物半導体層。According to the embodiment of FIG. 1, the method of the present invention aimed at eliminating the above-mentioned problems includes a dielectric layer and an oxide semiconductor layer on the surface of the anode body to which one end of the lead vA2 is connected.
半田陰極層が形成されてなるコンデンサ素子３をホルダ
２１の真空吸着面２３に吸着させる第１の工程と、
リード線２を押し潰す第２の工程と、
コンデンサ素子３を真空吸着面２３に沿って摺動せしめ
所定位置に位置決めしたのちクランプ２７で挟む第３の
工程と、
リード線２を他端部から切断し余長部１４を除去する第
４の工程と、
陽極リード片４および陰極リード片５を形成してなるリ
ードフレーム７にコンデンサ素子３を搭載する第５の工
程とを、少なくとも記載順に含むことを特徴とする固体
電解コンデンサの製造方法である。A first step of sucking the capacitor element 3 on which the solder cathode layer is formed onto the vacuum suction surface 23 of the holder 21; a second step of crushing the lead wire 2; and a second step of sucking the capacitor element 3 along the vacuum suction surface 23. a third step in which the lead wire 2 is slid and positioned at a predetermined position and then clamped between the clamps 27; a fourth step in which the lead wire 2 is cut from the other end and the extra length 14 is removed; and the anode lead piece 4 and the cathode lead This method of manufacturing a solid electrolytic capacitor is characterized in that it includes at least a fifth step of mounting a capacitor element 3 on a lead frame 7 formed by forming a piece 5 in the order described.
上記手段によれば、コンデンサ素子を定位置にクランプ
（位置決め）する工程を１ステーシヨン、リード線の圧
潰工程と、リード線を所定長さに切断する工程とを２ス
テーシヨンで行うに際し、第１のステーションでリード
線を圧潰したのちコンデンサ素子を定位置にクランプし
、第２のステーションでリード線を切断するようにでき
る。According to the above means, when the step of clamping (positioning) the capacitor element in a fixed position is performed in one station, and the step of crushing the lead wire and the step of cutting the lead wire to a predetermined length are performed in two stations, the first station The capacitor element can be clamped in place after crushing the leads at a station, and the leads can be cut at a second station.
従って、該切断用カッタには従来の如き側圧が発生せず
、かつ、該定位置にクランプした精度は維持されるよう
になる。Therefore, the cutting cutter is not subjected to lateral pressure as in the conventional case, and the precision with which the cutter is clamped at the fixed position is maintained.
以下に、図面を用いて本発明の詳細な説明す・ る。 The present invention will be explained in detail below using the drawings.
第１図（イ）〜（へ）は本発明の一実施例による固体電
解コンデンサの主要工程の説明図である。FIGS. 1A to 1F are explanatory views of the main steps of a solid electrolytic capacitor according to an embodiment of the present invention.
第１図（イ）において、所定長さよりやや長いリード線
２が左側端面に接続されたコンデンサ素子３は、吸気孔
２２が開口するホルダ２１の吸着面２３に吸着される。In FIG. 1(A), a capacitor element 3 having a lead wire 2 slightly longer than a predetermined length connected to its left end face is attracted to an attraction surface 23 of a holder 21 in which an air intake hole 22 is opened.
ただし、ホルダ２１は適宜の角度ずつ一定方向に回転す
るロータ（図示せず）に装着されており、該ロータはコ
ンデンサ素子３を搬送する役割りを果たす。However, the holder 21 is attached to a rotor (not shown) that rotates in a fixed direction at an appropriate angle, and the rotor serves to transport the capacitor element 3.
次いで、前記ロータが所定角度だけ回転すると第１図（
ＴＩ）に示す如く、上下動および該上下動の中間位置で
前後動するダイ２４と上下動する平押しポンチ２５で、
リード線２の中間部を圧潰しリード線２の表面に形成さ
れた化成被膜を破壊する。そして該圧潰後に、ポンチ２
５は十分の高さに上昇するが、ダイ２４は少しだけ降下
したのち前進（右方に移動）するようになる。Next, when the rotor rotates by a predetermined angle, FIG.
As shown in TI), a die 24 that moves up and down and a die 24 that moves back and forth at an intermediate position between the up and down movements and a flat punch 25 that moves up and down,
The intermediate portion of the lead wire 2 is crushed to destroy the chemical conversion film formed on the surface of the lead wire 2. After the crushing, punch 2
5 rises to a sufficient height, but the die 24 descends a little and then moves forward (moves to the right).
第１図（ハ）において、ストッパ２６が上昇すると共に
ダイ２４が前進し、ダイ２４の該前進によって吸着面２
３に沿って摺動（右方に移動）されたコンデンサ素子３
は、ストッパ２６の先端部に当接し位置決めされるよう
になる。In FIG. 1(c), the die 24 moves forward as the stopper 26 rises, and the adsorption surface 2
Capacitor element 3 slid (moved to the right) along 3
comes into contact with the tip of the stopper 26 and is positioned.
すると、第１図（ニ）に示すように、前記ロータに装着
した一対のクランプ２７がコンデンサ素子３の側面を挟
むと、ストッパ２６は降下し、ダイ２４は後退してから
降下するが、第１図（１１）〜（＝）を使用した前記動
作は前記ロータの同一ステーションで実施可能であり、
実施している。Then, as shown in FIG. 1(d), when the pair of clamps 27 attached to the rotor sandwich the sides of the capacitor element 3, the stopper 26 descends, and the die 24 retreats and then descends. The operations using FIG. 1 (11) to (=) can be performed at the same station of the rotor,
It is being implemented.
前記ロータがさらに所定角度だけ回転すると、第１図（
＊）に示すように、ダイ２８が上昇しリード線２を下か
ら支えるようになるとカッタ２９が降下し、リード線２
の余長部分１４を切り落とすことになる。When the rotor further rotates by a predetermined angle, as shown in FIG.
As shown in *), when the die 28 rises to support the lead wire 2 from below, the cutter 29 descends and supports the lead wire 2.
The extra length 14 will be cut off.
次いで、前記ロータがさらに所定角度だけ回転した位置
で、ホルダ２１による吸着を解除しクランプ２７に挟持
されたコンデンサ素子３は、第１図（へ）に示す如くリ
ードフレーム７に搭載されると、図示しない電極を使用
しリード線２とリード片４とが溶接され、リードフレー
ム７にコンデンサ素子３を搭載する工程が完了し、コン
デンサ素子３の半田層とリード片５との半田付けは、そ
の後に行われるようになる。Next, at a position where the rotor has further rotated by a predetermined angle, the adsorption by the holder 21 is released, and the capacitor element 3 held by the clamp 27 is mounted on the lead frame 7 as shown in FIG. The lead wire 2 and the lead piece 4 are welded using electrodes (not shown), and the process of mounting the capacitor element 3 on the lead frame 7 is completed, and the solder layer of the capacitor element 3 and the lead piece 5 are then soldered. It will be held in
以上説明したように本発明によれば、リード線の圧潰工
程、コンデンサ素子の位置決め工程、リード線を所定長
さにする切断工程を記載順に、かつ、該圧潰工程と位置
決め工程とを同一ステーションで行うことにより、従来
の切断工程でカッタの側面を押圧する力が発生しないた
め、カッタが長寿命になると共に、コンデンサ素子の位
置精度を向上し得た効果がある。As explained above, according to the present invention, the crushing process of the lead wire, the process of positioning the capacitor element, and the process of cutting the lead wire to a predetermined length are performed in the stated order, and the crushing process and the positioning process are performed at the same station. By doing so, the force that presses the side surface of the cutter is not generated in the conventional cutting process, which has the effect of extending the life of the cutter and improving the positional accuracy of the capacitor element.
第１図は本発明の一実施例による固体電解コンデンサの
主要工程の説明図、
第２図は固体電解コンデンサの外装を破断した側面図、
第３図はコンデンサ素子のバッチ処理説明図、第４図は
リードフレームにコンデンサ素子を搭載した図、
第５図は従来技術の問題点の説明図、
である。
図中において、
１は固体電解コンデンサ、
２はリード線、 ３はコンデンサ素子、４は陽極リード
片、５は陰極リード片、６は外装、 ７はリード
フレーム、１４はリード線余長部、
２１はホルダ、 ２２は吸気孔、
２３は真空吸着面、２４ 、２８はダイ、２５はポンチ
、 ２６はストッパ、
２７はクランプ、 ２９はカッタ、
３０はストリッパ、３１はばね、
を示す。
に明図Fig. 1 is an explanatory diagram of the main steps of a solid electrolytic capacitor according to an embodiment of the present invention; Fig. 2 is a side view with the exterior of the solid electrolytic capacitor broken; Fig. 3 is an explanatory diagram of batch processing of capacitor elements; The figure shows a capacitor element mounted on a lead frame, and Figure 5 is an explanatory diagram of problems with the conventional technology. In the figure, 1 is a solid electrolytic capacitor, 2 is a lead wire, 3 is a capacitor element, 4 is an anode lead piece, 5 is a cathode lead piece, 6 is an exterior, 7 is a lead frame, 14 is a lead wire extra length, 21 22 is a suction hole, 23 is a vacuum suction surface, 24 and 28 are dies, 25 is a punch, 26 is a stopper, 27 is a clamp, 29 is a cutter, 30 is a stripper, and 31 is a spring. ni Ming map
Claims (1)
層、酸化物半導体層、半田陰極層が形成されてなるコン
デンサ素子（３）をホルダ（２１）の真空吸着面（２３
）に吸着させる第１の工程と、該リード線（２）を押し
潰す第２の工程と、該コンデンサ素子（３）を該真空吸
着面（２３）に沿って摺動せしめ所定位置に位置決めし
たのちクランプ（２７）で挟む第３の工程と、 該リード線（２）を他端部から切断し余長部（１４）を
除去する第４の工程と、 陽極リード片（４）および陰極リード片（５）を形成し
てなるリードフレーム（７）に該コンデンサ素子（３）
を搭載する第５の工程とを、少なくとも記載順に含むこ
とを特徴とする固体電解コンデンサの製造方法。[Claims] A capacitor element (3) having a dielectric layer, an oxide semiconductor layer, and a solder cathode layer formed on the surface of an anode body connected to one end of a lead wire (2) is placed in a vacuum of a holder (21). Adsorption surface (23
), a second step of crushing the lead wire (2), and sliding the capacitor element (3) along the vacuum suction surface (23) to position it at a predetermined position. A third step in which the lead wire (2) is then held between the clamps (27), a fourth step in which the lead wire (2) is cut from the other end and the excess length (14) is removed, and the anode lead piece (4) and the cathode lead The capacitor element (3) is attached to the lead frame (7) formed by forming the piece (5).
A method for manufacturing a solid electrolytic capacitor, the method comprising: a fifth step of mounting a solid electrolytic capacitor, at least in the order described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12901087A JPS63292615A (en) | 1987-05-26 | 1987-05-26 | Manufacture of solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12901087A JPS63292615A (en) | 1987-05-26 | 1987-05-26 | Manufacture of solid electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63292615A true JPS63292615A (en) | 1988-11-29 |
Family
ID=14998934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12901087A Pending JPS63292615A (en) | 1987-05-26 | 1987-05-26 | Manufacture of solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63292615A (en) |
-
1987
- 1987-05-26 JP JP12901087A patent/JPS63292615A/en active Pending
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