JPH1022182A - Method and device for supplying capacitor element to lead frame for manufacturing solid electrolytic capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the occurrence of a dielectric breakdown in the chip piece of a capacitor element mounted on a crossbar when the capacitor element is welded to the anode lead terminal of a lead frame, after cutting off the capacitor element from the crossbar at the time of manufacturing a solid electrolytic capacitor. SOLUTION: After a groove 26 is cut into the anode wire 5 of a capacitor element 3 while the joint section of the wire 5 to a chip piece 4 of the element 4 is clamped, the wire 5 is cut off from a crossbar and bent while the joint section is clamped and the bent section is supplied and welded to a lead frame in a clamped state. Then, the wire 5 is torn from the groove 26 while the joint section of the wire 5 to the chip piece 4 is clamped.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a method for manufacturing a solid electrolytic capacitor such as a tantalum solid electrolytic capacitor using a lead frame. The present invention relates to a supply method and an apparatus therefor.

[0002]

2. Description of the Related Art In general, a solid electrolytic capacitor of this type is disclosed in, for example, Japanese Patent Application Laid-Open No. 6-20891, and has a metal plate anode lead terminal 1 as shown in FIGS. A cathode lead terminal 2 also made of a metal plate is disposed to face each other, and a capacitor element 3 is placed between the lead terminals 1 and 2 from one end of the porous chip piece 4 of the capacitor element 3. An anode wire 5 protruding by a predetermined length L is provided so as to be fixed to the tip of the anode lead terminal 1 by welding, and between the cathode lead terminal 2 and the cathode film 6 on the surface of the chip piece 4. To
A connection is made via the safety fuse wire 7 for one or both of the temperature and the overcurrent, or the tip of the cathode lead terminal 2 is directly connected to the cathode film 6, and the whole of these is connected. The package is formed in a mold section 8 made of a thermosetting synthetic resin.

When manufacturing a solid electrolytic capacitor having this structure, for example, as described in JP-A-6-244233, an anode lead terminal 1 and a cathode lead are inwardly directed inward from a pair of left and right side frames. A lead frame formed by shaping the terminals 2 at a constant pitch in the longitudinal direction is used. During the transfer of the lead frame in the longitudinal direction, a capacitor element is first placed between the two lead terminals 1 and 2. 3 is supplied such that the anode wire 5 of the capacitor element 3 contacts the upper surface of the anode lead terminal 1, and then the anode wire 5 is fixed to the anode lead terminal 1 by welding. The cathode film 6 and the cathode lead terminal 2 are connected via a safety fuse 7 to form a molded part 8 for packaging these parts. After the process to say separated from the lead frame is employed.

Meanwhile, the capacitor element 3 is described in, for example, Japanese Patent Application Laid-Open No. 6-333788,
As shown in FIG. 14, a plurality of chip pieces 4 obtained by solidifying and sintering metal particles such as tantalum into a porous material are connected to a horizontal metal bar 9.
On the other hand, the anode wires 5 protruding from the respective chip pieces 4 are fixed by welding to be mounted at a constant pitch along the longitudinal direction of the horizontal bar 9, and in this state, each chip piece 4 is attached. After a dielectric film is formed by immersing in an anodizing solution and performing anodizing treatment, the cathode film 6 including a solid electrolytic film is formed on the surface of each chip piece 4.

When a plurality of capacitor elements 3 simultaneously manufactured using the horizontal bar 9 are supplied one by one between the two lead terminals 1 and 2 in the lead frame and welded, Conventionally, the following method has been adopted. That is, as shown in FIG. 15, the transport path for intermittently transporting the lead frame A in the longitudinal direction as shown by the arrow, and the plurality of capacitor elements 3
A plurality of vacuum suction-type collet arms 10a are radially provided at a portion between the horizontal bar 9 provided with When one condenser element 3 on the horizontal bar 9 is vacuum-adsorbed by one collet arm 10a of the transport means 10, the anode wire of the vacuum-adsorbed capacitor element 3 is provided. As shown in FIG. 16, the capacitor element 3 is cut by a cutter mechanism 11 at a predetermined length L from the chip piece 4 so that the capacitor element 3 is vacuum-adsorbed to the collet arm 10a. To separate from the horizontal bar 9.

Next, the capacitor element 3 separated from the horizontal bar 9 is transported to the position of the lead frame A by rotating the transport means 10 while being vacuum-sucked by the collet arm 10a. As shown, the anode wire 5 of the capacitor element 3 is supplied to the portion between the two lead terminals 1 and 2 so as to be in contact with the upper surface of the anode lead terminal 1, and the capacitor element 3 is further connected to the collet arm 10a. In this state, the anode wire 5 and the anode lead terminal 1 of the capacitor element 3 are spot-welded by being sandwiched between the pair of conducting electrodes 12 and 13 in a state of being vacuum-sucked.

[0007]

As described above, according to the conventional method, the anode wire 5 protruding from the chip piece 4 of the capacitor element 3 while the chip piece 4 of the capacitor element 3 is being vacuum-adsorbed by the collet arm 10a. Of the anode wire 5 and the welding of the anode wire 5 to the anode lead terminal 1, the anode wire 5 and the chip piece 4 are cut.
In addition, since the impact generated at the time of cutting and welding is applied, the chip piece 4 made of a porous sintered body and having a brittle property is applied.
In addition, dielectric breakdown frequently occurs.

In addition, when the anode wire 5 is welded to the anode lead terminal 1, the capacitor element 3 is held only by vacuum suction on the collet arm 10a. At the time of welding to the terminal 1, the capacitor element 3 is connected to the two lead terminals 1, 1 as shown by a one-dot chain line or a two-dot chain line in FIG.
The capacitor element 3 is exposed to the surface of the mold portion 8 by tilting or shifting with respect to the axis of
Alternatively, since the thickness of the mold portion 6 covering the capacitor element 3 becomes extremely thin, the occurrence of defective products occurs in conjunction with the frequent occurrence of dielectric breakdown in the capacitor element 3 as described above. There was a problem that the rate was quite high.

[0009] Further, in the conventional apparatus, a transfer means 1 provided with a plurality of vacuum suction type collet arms 10a between a transfer path of a horizontal bar 9 and a transfer path of a lead frame A.
In this configuration, the size of the device is increased, and the supply speed of the capacitor element to the lead frame is low. SUMMARY OF THE INVENTION An object of the present invention is to provide a method and an apparatus capable of reliably solving this problem, that is, a high incidence of defective products.

[0010]

In order to achieve this technical object, a method according to the present invention comprises the steps of: "a capacitor element mounted on a horizontal bar is clamped at the base of the anode wire to the chip piece; A step of engraving a cutting notch in a portion of a predetermined length from the chip piece, and a step of cutting and bending the anode wire at a portion close to the horizontal bar in a state where the base of the anode wire with respect to the chip piece is clamped. And with
After supplying the capacitor element to the lead frame in a state where the bent portion of the anode wire in the capacitor element is clamped so that the anode wire in the capacitor element contacts the anode lead terminal in the lead frame, the anode wire is supplied to the anode. The method further includes a step of welding to the lead terminal, and a step of cutting the bent portion from the cutting cut groove in a state where the root of the anode wire to the chip piece is clamped. ".

The apparatus of the present invention comprises a lead frame having a pair of anode lead terminals and a pair of cathode lead terminals at appropriate pitch intervals along the longitudinal direction, and a capacitor element at an appropriate pitch interval along the longitudinal direction. With the horizontal bar provided by
It has a path that is arranged and transferred substantially in parallel, and along this transfer path, a predetermined length from the chip piece of the anode wire is clamped at the root of the anode wire to the chip piece in the capacitor element of the horizontal bar. The anode wire was cut at a portion close to the horizontal bar in a state in which a cut groove forming means for forming a cut groove for cutting was cut in a portion, and a root portion of the anode wire of the capacitor element to the chip piece was clamped. Cutting and bending means adapted to be bent later, and the anode wire of the capacitor element contacts the anode lead terminal of the lead frame with the anode wire of the capacitor element in contact with the lead frame with the bent portion of the anode wire of the capacitor element clamped. After supplying the anode wire, A supply welding means for welding to the pole lead terminal, and a bent portion of the anode wire is cut from the location of the cutting groove in a state where the base of the anode wire to the chip piece in the capacitor element is clamped. The above-mentioned shredding means is provided. ".

[0012]

As described above, according to the present invention, after cutting a notching groove at a predetermined length from a chip piece of an anode wire in a capacitor element mounted on a horizontal bar, the capacitor is formed. The element is separated from the horizontal bar by bending and cutting a portion of the anode wire near the horizontal bar, and then, the capacitor element is supplied to a lead frame with the bent portion of the anode wire clamped. After welding, the bent portion is cut from the location of the cutting notch, and the welding of the anode wire of the capacitor element to the anode lead terminal of the lead frame is performed by the anode wire of the capacitor element. This is performed with the bent part in the clamped state. In doing so, it is possible to reliably prevent the capacitor element from being inclined to the axes of the two lead terminals in the lead frame, or to be laterally displaced from the axis, as in the related art, In addition, it is possible to reliably reduce the effect of the impact during welding.

[0013] In addition, the cutting of the cutting groove in the anode wire, the cutting and bending of the anode wire, and the shredding of the bent portion in the anode wire are performed as follows.
In each case, since the base portion of the anode wire with respect to the chip piece is clamped, it is possible to reliably prevent an impact from acting on the chip piece.

That is, according to the present invention, after the capacitor element mounted on the horizontal bar is separated from the horizontal bar, it is supplied to a predetermined position in the lead frame in a correct posture. In this way, the solid electrolytic capacitor can be reliably performed without causing a dielectric breakdown, so that there is an effect that the occurrence rate of defective products in the production of the solid electrolytic capacitor can be greatly reduced.

In particular, prior to the cutting and bending of the anode wire, an auxiliary cutting notch is formed in a portion of the anode wire near the horizontal bar while a portion of the anode wire on one side of the chip is clamped. By doing so, the cutting and bending of the anode wire can be easily performed with a small force, and the impact on the chip piece at the time of cutting and bending can be reduced,
There is an advantage that the rate of occurrence of dielectric breakdown in the chip piece can be further reduced, and the rate of occurrence of defective products in the production of the solid electrolytic capacitor can be further reduced.

Further, according to the apparatus of the present invention, the above-described operation can be continuously performed while the horizontal bar and the lead frame are transported in the longitudinal direction, so that the apparatus can be downsized and the lead can be reduced. The supply speed of the capacitor element to the frame can be increased as compared with the conventional case.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to FIGS. As shown in FIG. 1, a lead frame A formed by inwardly forming an anode lead terminal 1 and a cathode lead terminal 2 at a constant pitch in the longitudinal direction from a pair of left and right side frames is transferred in the longitudinal direction. On the other hand, a transport path 20 for the horizontal bar 9 provided with a plurality of capacitor elements 3 is provided in parallel with the transport path for the lead frame A.
Insert the horizontal bar 9 in the longitudinal direction with the lead frame A
Transfer in parallel.

A cutting groove engraving means 21 is provided on the first stage along the transport path of the lead frame A and the transport path 20 of the horizontal bar 9 along the transport direction from the first stage. The auxiliary notching groove engraving means 22 is transported to the front second stage, and the cutting / bending means 23 and the supply welding means 24 are transported from the third stage to the third stage forward along the transport direction from the second stage. In the fourth stage forward along the direction,
5 are arranged respectively.

As shown in FIG. 2, the cut groove forming means 21 in the first stage includes a pair of upper and lower clamp pieces 21a and 21b and a pair of upper and lower punch pieces 21c and 21d.
A portion of the anode wire 5 in the capacitor element 3 of the horizontal bar 9 having a predetermined length from the chip piece 4
In the state where the base of the anode wire 5 with respect to the chip piece 4 is clamped by the pair of clamp pieces 21a and 21b, the anode wire 5 is sandwiched by the pair of punch pieces 21c and 21d, so that a cutting cut groove is formed in this portion. 26 is engraved.

As shown in FIG. 3, a pair of upper and lower clamp pieces 22a and 22b and a pair of upper and lower punch pieces 22c and 2
2d, a portion of the anode wire 5 in the capacitor element 3 of the horizontal bar 9 close to the horizontal bar 9 is used, and a portion of the anode wire 5 on the chip piece 4 side is connected to the pair of clamp pieces 22a and 22b. In the clamped state, the pair of punch pieces 22c and 22d are sandwiched between the pair of punch pieces 22c and 22d to form an auxiliary cutting notch 27 in this portion.

As shown in FIGS. 5 and 6, the cutting and bending means 23 in the third stage fits the top of the anode wire 5 of the capacitor element 3 of the horizontal bar 9 to the chip piece 4, as shown in FIGS. Full V-shaped groove 23
and a vertically movable receiving member 23a provided with a ', and a vertically movable bending member which pushes up a portion of the anode wire 5 between the cutting groove 26 and the auxiliary cutting groove 27 upward. Body 23b and a portion of the cutting wire 26 of the anode wire 5
a, a pair of vertically movable pressing members 23c and 23d for pressing the portion of the anode wire 5 on the side of the horizontal bar 9 to the transport path 20 on the upper surface of the bent member 23.
b, an inclined groove 23b 'into which the anode wire 5 is fitted.
It has.

When the receiving body 23a moves upward so that the anode wire 5 fits into the V-shaped groove 23a on the upper surface thereof, the pressing bodies 23c and 23d move downward as shown in FIG. The cutting groove 26 of the anode wire 5 is cut by the one holding body 23c.
Is pressed against the upper surface of the receiving body 23a to clamp this part, and at the same time, presses the part of the anode wire 5 on the side of the horizontal bar 9 against the transport path 20 with the other pressing body 23d. I do.

Next, in this state, the bent body 23
As shown in FIG. 8, as a result, the portion between the cutting groove 26 for cutting and the cutting groove 27 for auxiliary cutting of the anode wire 5 is moved upward as shown in FIG.
In the state where the base portion of the chip piece 4 is clamped by the receiving body 23a and the pressing body 23c, it is bent upward while cutting it at the location of the auxiliary cutting cut groove 27. This bent portion is indicated by reference numeral 5 '.

In this case, the pressing members 23c and 23d are provided integrally with one member. Further, as described above, after the anode wire 5 is cut into pieces at the locations of the auxiliary cutting cut grooves 27,
Instead of bending upward, the anode wire 5
May be configured so that a portion close to the horizontal bar 9 is cut by shearing with the bent body 23b and the other pressing body 23d, and then bent upward.

Further, as described above, the V-shaped groove 23a 'in which the anode wire 5 is fitted is provided on the upper surface of the receiving body 23a, so that the receiving body 23a is moved upward to move the anode wire 5 to the correct position. In addition to being able to be automatically positioned, a groove 23b 'for fitting the anode wire 5 of the bent body 23b is provided, and the anode wire 5 is bent by a plate fitted in the groove 23b',
When the anode wire 5 is bent, the anode wire 5 can be prevented from escaping in the lateral direction.
Along with the provision of the mold groove 23a ', the anode wire 5
Can be accurately bent to the correct shape.

Next, the supply welding means 24 in the third stage comprises an openable / closable clamp mechanism 24a and a pair of upper and lower energizing electrodes 24b and 24c, and the clamp mechanism 24a is bent by the cutting / bending means 23. When the bent portion 5 'of the anode wire 5 is clamped (when this clamp is performed, the pressing members 23c,
23d moves away from the bent body 23b), moves to the position of the lead frame A, and then moves down, so that the capacitor element 3 is moved relative to the lead frame A as shown in FIG. The anode wire 5 in the capacitor element 3 is supplied so as to contact the upper surface of the anode lead terminal 1. Then, the electrodes 24b and 24c are spot-welded by sandwiching the anode wire 5 of the capacitor element 3 and the anode lead terminal 1 of the lead frame A.

Then, the shredding means 25 in the fourth stage, as shown in FIG.
And a pair of upper and lower clamp pieces 25b and 25c. The root of the anode wire 5 of the capacitor element 3 with respect to the chip piece 4 is fixed to the tip piece 4 by the pair of clamp pieces 25b and 25c. In the clamped state, the bent portion 5 ′ is pulled or twisted by the pliers 25 a to cut the bent portion 5 ′ from the cut groove 26.

In this configuration, when the capacitor element 3 mounted on the horizontal bar 9 is transferred to the cut groove forming means 21 in the first stage, the chip piece 4 of the anode wire 5 of the capacitor element 3 A cutting notch 26 is formed by a pair of punch pieces 21c and 21d in a portion of the predetermined length L in a state where the base of the anode wire 5 with respect to the chip piece 4 is clamped by the two chip pieces 21a and 21b. Engraved. Then, when the capacitor element 3 is transferred to the auxiliary notch groove engraving means 22 in the second stage, the portion of the anode wire 5 of the capacitor element 3 close to the horizontal bar 9 is The part on the chip piece 4 side is fixed to both clamp pieces 22
a, a pair of punch pieces 2 clamped at 22b.
At 2c and 22d, an auxiliary cutting notch 27 is formed.

When the capacitor element 3 is transferred to the cutting / bending means 23 and the supply welding means 24 in the third stage, the cutting groove 26 of the anode wire 5 of the capacitor element 3 The portion between the cut groove 27 is bent upward while being cut off from the horizontal bar 9 in a state where the base of the anode wire 5 with respect to the chip piece 4 is clamped by the receiving body 23a and one of the pressing bodies 23c. Then, with the bent portion 5 ′ clamped by the clamp mechanism 24 a, the capacitor element 3 contacts the lead frame A, and the anode wire 5 of the capacitor element 3 contacts the upper surface of the anode lead terminal 1. And then spot-welded by sandwiching the pair of conducting electrodes 24b and 24c.

In this way, when the capacitor element 3 supplied and fixed to the lead frame A is transferred to the shredding means 25 in the fourth stage, the bent portion 5 'of the anode wire 5 becomes Of the chip piece 4 are clamped by both clamp pieces 25b, 25c.
In the state clamped by the above, the supply of the capacitor element 3 to the lead frame A is completed by being cut off from the location of the cutting notch 26 with the pliers 25a.

The lead frame A is connected between the cathode film 6 of the capacitor element 3 and the cathode lead terminal 2 via the safety fuse 7 while being further transferred from the fourth stage. Through a step of molding a mold part 8 for packaging the part, the solid electrolytic capacitor is completed.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is an enlarged sectional view taken along line II-II of FIG.

FIG. 3 is an enlarged sectional view taken along line III-III of FIG. 1;

FIG. 4 is an enlarged sectional view taken along line IV-IV of FIG. 1;

FIG. 5 is an enlarged sectional view taken along line VV of FIG. 1;

FIG. 6 is a perspective view showing FIG. 5;

FIG. 7 is a diagram showing a first operation in FIG. 5;

FIG. 8 is a diagram showing a second operation in FIG. 5;

FIG. 9 is a diagram showing a third operation in FIG. 5;

FIG. 10 is a diagram showing a fourth operation in FIG. 5;

FIG. 11 is an enlarged sectional view taken along line XI-XI of FIG. 1;

FIG. 12 is an enlarged vertical sectional front view of the solid electrolytic capacitor.

13 is a sectional view taken along the line XIII-XIII of FIG.

FIG. 14 is a perspective view showing a horizontal bar having a plurality of capacitor elements.

FIG. 15 is a plan view showing a conventional example.

FIG. 16 is an enlarged sectional view taken along the line XVI-XVI of FIG. 15;

FIG. 17 is an enlarged side view taken along the line XVII-XVII of FIG. 15;

FIG. 18 is an enlarged sectional view taken along line XVIII-XVIII in FIG.

[Explanation of symbols]

 Reference Signs List A Lead frame 1 Anode lead terminal 2 Cathode lead terminal 3 Capacitor element 4 Chip piece 5 Anode wire 5 'Anode wire bending portion 9 Horizontal bar 21 Cut groove forming means 22 Auxiliary cut groove forming means 23 Cutting bending means 24 Supply welding Means 25 Shredding means 26 Cutting notch groove 27 Auxiliary cutting notch groove

Claims (4)

[Claims] A step of engraving a cutting notch in a portion of the anode wire having a predetermined length from the chip piece while clamping a root of the anode wire to the chip piece in the capacitor element mounted on the horizontal bar; Cutting the anode wire at a portion near the horizontal bar and bending the anode wire in a state where the base of the anode wire with respect to the chip piece is clamped, and bending the bent portion of the anode wire in the capacitor element. A step of welding the anode wire to the anode lead terminal after supplying the capacitor element to the lead frame so that the anode wire in the capacitor element contacts the anode lead terminal in the lead frame, further comprising: Attach the base of the anode wire to the chip A method of supplying a capacitor element to the lead frame during the manufacture of the solid electrolytic capacitor, characterized in that said bent portion at the lamp state and a step of cutting thousands areas of the grooves cut for the cutting. 2. The method according to claim 1, wherein the anode wire is cut at a portion close to the horizontal bar in a state where the base of the anode wire with respect to the chip piece is clamped, and then the anode wire is bent. A step of engraving an auxiliary cutting notch in a portion of the wire close to the horizontal bar while clamping a portion of the anode wire on one side of the chip. A method of supplying an element to a lead frame. 3. A lead frame provided with a pair of anode lead terminals and cathode lead terminals at appropriate pitch intervals along the longitudinal direction, and a horizontal bar provided with capacitor elements at appropriate pitch intervals along the longitudinal direction. Having a path to be arranged and transferred substantially in parallel, along the transfer path, a predetermined length from the tip piece of the anode wire in a state where the root of the anode wire to the tip piece in the capacitor element of the horizontal bar is clamped. And a cutting groove engraving means for engraving a cutting incision groove in a portion of the capacitor element, and cutting the anode wire at a portion close to the horizontal bar in a state where the root of the anode wire to the chip piece in the capacitor element is clamped Cutting and bending means for bending after bending, and clamping the bent portion of the anode wire in the capacitor element. In such a state, the capacitor element is supplied to the lead frame such that the anode wire of the capacitor element contacts the anode lead terminal of the lead frame, and then the anode wire is welded to the anode lead terminal. Welding means and shredding means for shredding the bent portion of the anode wire from the location of the cutting groove in a state where the root of the anode wire to the chip piece in the capacitor element is clamped are provided. A device that supplies a capacitor element to a lead frame when manufacturing a solid electrolytic capacitor. 4. The method according to claim 3, wherein a portion of the anode wire on one side of the tip is clamped to a portion of the anode wire near the horizontal bar at a position before the cutting and bending means. An apparatus for supplying a capacitor element to a lead frame when manufacturing a solid electrolytic capacitor, comprising an auxiliary notch groove engraving means for forming a notch for cutting.