JPS63289784A - 回路配線部材の製造方法 - Google Patents

回路配線部材の製造方法

Info

Publication number
JPS63289784A
JPS63289784A JP62122464A JP12246487A JPS63289784A JP S63289784 A JPS63289784 A JP S63289784A JP 62122464 A JP62122464 A JP 62122464A JP 12246487 A JP12246487 A JP 12246487A JP S63289784 A JPS63289784 A JP S63289784A
Authority
JP
Japan
Prior art keywords
circuit
substrate
circuit wiring
wiring member
positions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62122464A
Other languages
English (en)
Japanese (ja)
Other versions
JPH05833B2 (https=
Inventor
Naoshi Kato
加藤　直士
Nobuhito Nakazato
中里　伸仁
Juichi Nishiyama
西山　寿一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RIYOUSEI DENSO KK
Mitsubishi Cable Industries Ltd
Original Assignee
RIYOUSEI DENSO KK
Ryosei Electro Circuit Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RIYOUSEI DENSO KK, Ryosei Electro Circuit Systems Ltd filed Critical RIYOUSEI DENSO KK
Priority to JP62122464A priority Critical patent/JPS63289784A/ja
Publication of JPS63289784A publication Critical patent/JPS63289784A/ja
Publication of JPH05833B2 publication Critical patent/JPH05833B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
JP62122464A 1987-05-21 1987-05-21 回路配線部材の製造方法 Granted JPS63289784A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62122464A JPS63289784A (ja) 1987-05-21 1987-05-21 回路配線部材の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62122464A JPS63289784A (ja) 1987-05-21 1987-05-21 回路配線部材の製造方法

Publications (2)

Publication Number Publication Date
JPS63289784A true JPS63289784A (ja) 1988-11-28
JPH05833B2 JPH05833B2 (https=) 1993-01-06

Family

ID=14836503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62122464A Granted JPS63289784A (ja) 1987-05-21 1987-05-21 回路配線部材の製造方法

Country Status (1)

Country Link
JP (1) JPS63289784A (https=)

Also Published As

Publication number Publication date
JPH05833B2 (https=) 1993-01-06

Similar Documents

Publication Publication Date Title
JP6340029B2 (ja) ヒューズユニット、及びヒューズユニットの製造方法
JP3814451B2 (ja) ヒューズの製造方法
EP0963021B1 (en) Bus bar wiring board and method of producing the same
JPS63289784A (ja) 回路配線部材の製造方法
JPH0348638B2 (https=)
JPH06283338A (ja) インダクタンス部品およびその製造方法
JPH05198225A (ja) 回路配線部材の製造方法
JPS63146372A (ja) 接続端子の製造方法
DE102021126117A1 (de) Herstellungsverfahren eines Gehäuses für eine Halbleitervorrichtung
JPS63175359A (ja) 配線用ジヨイントボツクス
JPH0363191B2 (https=)
EP1016173A1 (en) Process for producing a flat connector comb which can be moulded into an enclosure
JPS5910898Y2 (ja) 組立式ブスバ−回路
JPS5937581B2 (ja) デンシブヒンヨウリ−ドフレ−ムノウチヌキホウ
JPH0348639B2 (https=)
JPH0796339A (ja) タップ加工方法
JPH05109446A (ja) 端子とその製造方法
JPH11345669A (ja) 電気的接続導体部を有する成形体
JPH043427Y2 (https=)
JPS6216009A (ja) 電気接続箱とワイヤ−ハ−ネスの組付方法
JP2003037918A (ja) ヒューズ部を設けたバスバー、該バスバーの形成方法および該バスバーを備えた自動車用リレーボックス
JPS63220595A (ja) 電気回路板の製造方法
JPH025287B2 (https=)
JPH04114718U (ja) 電気接続箱
JPH08132451A (ja) 電子部品の樹脂ばりカット方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees