JPS63287047A - Method for fixing outer-lead of hybrid integrated circuit - Google Patents
Method for fixing outer-lead of hybrid integrated circuitInfo
- Publication number
- JPS63287047A JPS63287047A JP12231687A JP12231687A JPS63287047A JP S63287047 A JPS63287047 A JP S63287047A JP 12231687 A JP12231687 A JP 12231687A JP 12231687 A JP12231687 A JP 12231687A JP S63287047 A JPS63287047 A JP S63287047A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- fixing
- pad
- solder
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 5
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 15
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 230000008961 swelling Effects 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 （イ）産業上の利用分野 本発明は混成集積回路の外部リード固着方法に関する。[Detailed description of the invention] (b) Industrial application fields The present invention relates to a method for fixing external leads of a hybrid integrated circuit.
（ロ）従来の技術
従来の混成集積回路は第２図に示す如く、混成集積回路
基板（１１）上に所望形状の導電路（１２）が形成きれ
、導電路（１２）上にトランジスタ、チップ抵抗、チッ
プコンデンサー等の回路素子（１３）を設けて所望の回
路機能を形成し、混成集積回路基板（１１）の−側辺周
端部に形成された固着パッド（１４）上に外部リード（
１５）が固着され、混成集積回路基板（１１）に封止容
器（１６）を固着して一体化されるものである。(B) Conventional technology As shown in FIG. 2, in a conventional hybrid integrated circuit, a conductive path (12) of a desired shape is formed on a hybrid integrated circuit board (11), and a transistor and a chip are formed on the conductive path (12). Circuit elements (13) such as resistors and chip capacitors are provided to form desired circuit functions, and external leads (
15) is fixed, and a sealed container (16) is fixed and integrated with the hybrid integrated circuit board (11).
上述した同様の技術は実公昭５４−１６２８５号公報に
記載されている。A technique similar to that described above is described in Japanese Utility Model Publication No. 16285/1985.
外部リード（１５）を混成集積回路基板（１１）の周端
辺に設けられた固着パッド（１４）に固着する場合、第
３図Ａの如く、固着パッドのピッチに対したピッチで複
数本のリード（１５）が連結体（１６）（１６’）によ
って支持きれたリードフレームの片側（点線側）の連結
体（１６’）を切断した後、第３図Ｂに示す如く、固着
パッド（１４）上に塗布された半田（１６）上にリード
（１５）の先端部を配置した後、加熱きれた半田コテ（
１７）を固着パッド（１４）上に降下させて固着パッド
上の半田（１７）を溶融させて外部リード（１５）を固
着パッド（１４）上に固着するものである。When fixing the external leads (15) to the fixing pads (14) provided on the peripheral edge of the hybrid integrated circuit board (11), as shown in FIG. After cutting the connecting body (16') on one side (dotted line side) of the lead frame where the lead (15) is fully supported by the connecting bodies (16) (16'), as shown in FIG. ) After placing the tip of the lead (15) on the solder (16) applied on the solder (
17) is lowered onto the fixing pad (14), the solder (17) on the fixing pad is melted, and the external lead (15) is fixed onto the fixing pad (14).
（ハ〉発明が解決しようとする問題点
しかしながら、従来の如き、固着方法ではフレームの連
結体（１６’）切断時において、切断の際の残留ひずみ
により、第４図の如くリード（１５）のピッチにプレが
多発に発生し、固着パッド（１４）上に塗布された半田
（１６）上にリード（１５）の端部を配置してもリード
（１５）がプしているため固着パッド（１４）とズした
位置で固着される。また半田（１６）が盛り上っている
ため固着パッド（１４）からリード（１５）がズレ落ち
てしまい固着パッド（１４）からズした位置で固着され
不良品となる問題点を有していた。(c) Problems to be Solved by the Invention However, in the conventional fixing method, when the frame connecting body (16') is cut, the lead (15) is damaged due to residual strain during cutting, as shown in Fig. 4. Plunging occurs frequently on the pitch, and even if the end of the lead (15) is placed on the solder (16) applied on the fixing pad (14), the lead (15) is bent, so the fixing pad ( 14) The lead (15) is stuck in the wrong position.Also, because the solder (16) is raised, the lead (15) slips off the fixing pad (14) and falls off, causing it to stick in the wrong position. It had the problem of being a defective product.
（ニ）問題点を解決するための手段
本発明は上述した問題点に鑑みて為きれたものであり、
混成集積回路基板の周端辺に形成された固着パッド上に
外部リードを固着する際、外部リードを矯正するリード
矯正部材の溝内に外部リードを配置して位置決めした後
、固着パッド上に外部リードを固着して解決する。(d) Means for solving the problems The present invention has been made in view of the problems mentioned above.
When fixing external leads onto the fixing pads formed on the peripheral edge of the hybrid integrated circuit board, the external leads are placed and positioned within the grooves of the lead straightening member that straightens the external leads, and then the external leads are fixed onto the fixing pads. Fix the lead and solve the problem.
（＊）作用
上述した如く、本発明に依れば、固着パッドに外部リー
ドを固着する際、リード矯正部材の溝内に外部リードを
配置し固着することにより、外部リードが溝によって矯
正され位置ズレの発生を容易に防止することができる０
、
（へ）実施例
以下に第１図Ａ乃至第１図りに示した実施例に基づいて
本発明の詳細な説明する。(*) Function As described above, according to the present invention, when fixing the external lead to the fixing pad, the external lead is placed and fixed in the groove of the lead correction member, so that the external lead is corrected by the groove and positioned. 0 that can easily prevent misalignment.
(f) Example The present invention will be described in detail below based on the example shown in FIG. 1A to FIG.
先ず第１図Ａに示す如く、混成集積回路基板（１）はセ
ラミックスあるいは金属が用いられ、ここでは機械的及
び放熱性の優れた金属のアルミニウム基板が用いられる
。そのアルミニウム基板の表面には周知の如く、陽極酸
化により、酸化アルミニウム膜が形成され、絶縁樹脂層
（２）を介して形成された所望形状の導電路（２）が延
在される基板（１）の少なくとも一側辺周端辺には外部
リード（７）を固着するための固着パッド（４）を所定
間隔で複数個形成し、スクリーン印刷等により固着パッ
ド（４）上に半田（５）を印刷する。このとき印刷され
た半田（５）は盛り上って形成される。固着パッド（４
）上に半田（５）を印刷した後、導電路（３）上の所定
位置にト之ンジスタ等の回路素子（６）を固着する。First, as shown in FIG. 1A, the hybrid integrated circuit board (1) is made of ceramics or metal, and in this case, an aluminum substrate, which is a metal with excellent mechanical and heat dissipation properties, is used. As is well known, an aluminum oxide film is formed on the surface of the aluminum substrate by anodic oxidation, and a conductive path (2) of a desired shape is extended through an insulating resin layer (2). ), a plurality of fixing pads (4) for fixing the external leads (7) are formed at predetermined intervals on at least one side of the periphery, and solder (5) is placed on the fixing pads (4) by screen printing or the like. print. At this time, the printed solder (5) is formed to bulge. Adherence pad (4
) After printing solder (5) on the conductive path (3), a circuit element (6) such as a transistor is fixed at a predetermined position on the conductive path (3).
次に第１図Ｂに示す如く、従来の如き連結体によって支
持された複数本の外部リード（７）をリード矯正部材（
８）の複数の溝（９）内に配置して外部リード（７）の
先端部を固着パッド（４）に当接させる。このとき外部
リード（７）の先端部には半田接着を強固にするために
フラックスがあらかじめ付着している。リード矯正部材
（８）は第１図Ｃに示す如く、外部リード（７）ピッチ
に対した溝（９）が複数個設けられ、溝（９）の上面、
即ち、外部リード（７）を挿入する部分は外部リード（
７）の挿入を容易にするためにテーパ面に形成され、ま
た溝（９）幅は外部リード（７）の幅よりも多少幅広に
形成される。Next, as shown in FIG. 1B, a plurality of external leads (7) supported by a conventional connecting body are connected to a lead correction member (
8), and the tips of the external leads (7) are brought into contact with the fixing pads (4). At this time, flux is applied in advance to the tip of the external lead (7) in order to strengthen the solder bond. As shown in FIG. 1C, the lead correction member (8) is provided with a plurality of grooves (9) corresponding to the pitch of the external lead (7), and the upper surface of the groove (9),
That is, the part where the external lead (7) is inserted is the external lead (
The groove (9) is formed to have a tapered surface to facilitate insertion of the external lead (7), and the width of the groove (9) is formed to be somewhat wider than the width of the external lead (7).
このリード矯正部材（８）の溝（９）内に外部リード（
７）を挿入配置し、リード先端部を固着パッド（４）に
当接させた後、３５０°〜３７０°Ｃに加熱された半田
フチ（１０〉を降下させて固着パッド（４）上の半田（
５）を溶融させ外部リード（７）を固着パッド（４）上
に固着する。The external lead (
7) is inserted and the lead tip is brought into contact with the fixing pad (4), and then the solder edge (10) heated to 350° to 370°C is lowered to solder on the fixing pad (4). (
5) is melted and the external lead (7) is fixed onto the fixing pad (4).
この様に本発明に依れば、外部リード（７）を固着する
際にリード矯正部材（８）に設けた溝（９）内に外部リ
ード（７）を配置して位置規制し固着することにより、
第４図の如く連結体（１６）によって支持された外部リ
ード（７）のピッチが乱れていてもリード矯正部材（８
）によって矯正きれ正確に固着パッド（４）上に外部リ
ード（７）を固着することができる。As described above, according to the present invention, when fixing the external lead (7), the external lead (7) is placed in the groove (9) provided in the lead correction member (8) to regulate the position and fix the external lead (7). According to
Even if the pitch of the external leads (7) supported by the connecting body (16) is irregular as shown in FIG.
) allows the external lead (7) to be firmly fixed onto the fixing pad (4) with complete correction.
（ト）発明の効果
以上に詳述した如く、本発明に依れば、外部リード固着
時にリード矯正部材を用いて外部リードを固着すること
により、外部リードのピッチが乱れたとしてもリード矯
正部材で矯正することができ、従来の如き、固着パッド
からズした位置で固着されず正確且つ容易に固着パッド
上に外部リードを固着することができ不良を著しく低下
することができるものである。(G) Effects of the Invention As detailed above, according to the present invention, by fixing the external lead using the lead correction member when fixing the external lead, even if the pitch of the external lead is disturbed, the lead correction member The external lead can be fixed accurately and easily on the fixing pad without being fixed at a position deviated from the fixing pad as in the conventional case, and the number of defects can be significantly reduced.
第１図Ａ乃至第１図りは本発明の実施例を示す断面図及
び正面図、第２図は従来例を示す断面図、第３図Ａ及び
第３図Ｂは従来の外部リードの固着を示す断面図、第４
図は連結体によって支持された外部リードを示す平面図
である。1A to 1D are a sectional view and a front view showing an embodiment of the present invention, FIG. 2 is a sectional view showing a conventional example, and FIGS. 3A and 3B are a sectional view and a front view showing an embodiment of the present invention. Sectional view shown, No. 4
The figure is a plan view showing an external lead supported by a connector.
Claims (1)
れ、前記導電路が延在される前記混成集積回路基板の少
なくとも一側辺周端部に外部リードを固着するための複
数の固着パッドが設けられた混成集積回路において、前
記固着パッドに対応した複数の溝を有するリード矯正部
材を備え、前記リード矯正部材に設けられた前記溝内に
前記外部リードを配置し位置決めした後、前記固着パッ
ド上に前記外部リードを固着することを特徴とする混成
集積回路の外部リード固着方法。(1) A conductive path having a desired shape is formed on a hybrid integrated circuit board, and a plurality of fixing devices are provided to fix external leads to the peripheral edge of at least one side of the hybrid integrated circuit board, where the conductive path extends. The hybrid integrated circuit provided with a pad includes a lead correction member having a plurality of grooves corresponding to the fixing pad, and after arranging and positioning the external lead in the groove provided in the lead correction member, A method for fixing external leads for a hybrid integrated circuit, comprising fixing the external leads on fixing pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12231687A JPS63287047A (en) | 1987-05-19 | 1987-05-19 | Method for fixing outer-lead of hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12231687A JPS63287047A (en) | 1987-05-19 | 1987-05-19 | Method for fixing outer-lead of hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63287047A true JPS63287047A (en) | 1988-11-24 |
Family
ID=14832936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12231687A Pending JPS63287047A (en) | 1987-05-19 | 1987-05-19 | Method for fixing outer-lead of hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63287047A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3349550A1 (en) * | 2017-01-13 | 2018-07-18 | Tyco Electronics (Shanghai) Co. Ltd. | Fixing apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS566462A (en) * | 1979-06-27 | 1981-01-23 | Mitsubishi Electric Corp | Positioning method |
-
1987
- 1987-05-19 JP JP12231687A patent/JPS63287047A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS566462A (en) * | 1979-06-27 | 1981-01-23 | Mitsubishi Electric Corp | Positioning method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3349550A1 (en) * | 2017-01-13 | 2018-07-18 | Tyco Electronics (Shanghai) Co. Ltd. | Fixing apparatus |
| CN108307586A (en) * | 2017-01-13 | 2018-07-20 | 泰科电子(上海)有限公司 | Fixed equipment |
| CN108307586B (en) * | 2017-01-13 | 2020-08-28 | 泰科电子(上海)有限公司 | Fixing device |
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