JPS63283197A - Device for mounting electronic component - Google Patents

Abstract

PURPOSE:To eliminate manual power dependency, to shorten a cycle time and to improve mass productivity by controlling substrate placing means, electronic component containing means, electronic component conveying means, a plurality of electronic component positioning means, a plurality of electronic component feeding/mounting means, etc. CONSTITUTION:A conveyor 10, a substrate positioning unit 12, substrate feeding means 2 including substrate placing means formed of an X-Y table 12, etc., electronic component containing means 3, electronic component transfer means 4, a plurality of electronic component positioning means 5, soldering medium coating means 6, a plurality of electronic component feeding/mounting means 7 are sequentially controlled together with an X-Y controller 130 by control means 120. Thus, an automatic mounting is conducted without manual power to shorten a cycle time, thereby enhancing the mass productivity of the substrates mounted with electronic components.

Description

[Detailed Description of the Invention] [Object of the Invention] (Field of Industrial Application) The present invention relates to a flat package IC (hereinafter referred to as "FPIC").
It relates to an electronic component mounting apparatus that mounts electronic components such as (1) on a board.

(Conventional technology) Conventional chip mounter, FPIC mounter.

Various types of electronic component mounting equipment, such as soldering mounting equipment, have been developed and put into practical use.

Among these, most FPIC mounting equipment mounts one type of FPIC one by one onto a wiring pattern formed on a board, which results in a long cycle time during mounting and multiple FPICs. FPI of the same type or type
Since C could not be implemented all at once, there was a problem in that it lacked mass production compatibility.

Furthermore, when trying to mass-produce using conventional equipment, it was necessary to construct a line with several of the same equipment lined up. As an IN line, it was expensive and space-efficient, making it unsuitable for mass production.

(Problems to be solved by the invention) As mentioned above, the conventional device has a long cycle time.
There were problems in that it was not mass-producible and was not economical.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component mounting apparatus that can shorten cycle time and achieve mass production, and is also excellent in terms of economy.

[Structure of the Invention] (Means for Solving the Problems) The electronic component mounting apparatus of the present invention includes a board mounting means for mounting a board on which a wiring pattern for soldering at a plurality of locations is formed at a predetermined position. , an electronic component storage means for storing electronic components to be mounted on a board placed on the board mounting means, a plurality of electronic component transport means for taking out and transporting electronic components from the electronic component storage means, and A plurality of electronic component positioning means each positioning the electronic components transported by the electronic component transport means in a desired direction, and each electronic component positioned by these electronic component positioning means is transferred to a mounting area of each wiring pattern and mounted. The electronic component transfer/mounting means includes a plurality of electronic component transfer/mounting means, and a control means for controlling the operation of each of the means.

(for production) The operation of the apparatus having the above configuration will be explained below.

The board on which a plurality of wirings are formed is transported and positioned by the board transport means.

On the other hand, the electronic components stored in the electronic component storage means are taken out and transported by the electronic component transport means, and a required number of electronic components from among the group of electronic components are sent to the electronic component positioning means. The electronic component positioning means positions the supplied required number of electronic components in a desired direction.

The plurality of electronic component transfer/mounting means transfers each electronic component positioned by the electronic component positioning means to the mounting area of each wiring pattern of the board, and simultaneously mounts the plurality of electronic components.

(Example) Examples of the present invention will be described in detail below.

The electronic component mounting apparatus 1 shown in FIG. 1 transports a board 110 on which a large number of wiring patterns 111 as shown in FIG. means 2, electronic component storage means 3 for storing a large number of electronic components (FPICs) 100 of the same type or different types as shown in FIG. an electronic component conveying means 4 that takes out a group of electronic components stored in the means 3, extracts a required number of electronic components of the same type or different types from this group of electronic components, and sends them to the electronic component positioning section 5; and wiring of the board 110; a soldering medium application means 6 for applying flux as a soldering medium to the pattern 111;
The electronic component transfer/mounting means 7 transfers and mounts the electronic component 100 of the same type or a different type onto the wiring pattern 111 coated with flux.

As shown in FIGS. 1 and 2, the substrate conveyance means 2 uses the substrates 110 as a set of two, for example, and
a transport section 10 consisting of a substrate loader 8 and a substrate unloader 9 that transport the substrate in the direction; a substrate positioning section 11 that positions a set of two substrates 110 transported by the substrate loader 8 at a predetermined position; and the substrate positioning section 11 It has an X-Y table 12 that moves in the X direction and the Y direction shown in FIG.

The substrate loader 8 includes a conveyor unit 14 including parallel conveyor rails 13a and 13b that support both ends of the substrate 110, and a conveyor unit 15 disposed along the conveyor unit 14. This transport unit 15 includes a moving shaft 16 disposed outside the one transport rail 13a and parallel to the transport rail 13a, and a transport drive unit 17 that drives the moving shaft 16 in the X direction. and at a predetermined interval with respect to the moving shaft body 16, and the respective tip portions are connected to the conveyance rail 13.
Four transfer claw bodies 1 installed facing inward of a
6a, 16b, 16c.

16d, and a pair of bushing claws 18a, which are similarly attached to the moving shaft 16 at a position farther forward than the transfer claw 16a and spaced apart from each other by a predetermined distance.
, 18b and the moving shaft body 16 are designated as Pl in FIG.
When the actuator 18 rotating in the P2 direction, the drive source 19 of the conveyor unit 14, and the first transfer claw body 16a are in the position shown in FIG. A first stopper 20 that is arranged to be movable up and down, and a second stopper that is arranged to be able to move up and down in the Z direction slightly in front of the third transfer claw body 16G when it is in the position shown in FIG. A stopper 21 is provided.

The substrate positioning section 11 and the X-Y table 12 are arranged adjacent to the forward direction of the substrate loader 8 .

The X-Y table 12 includes a fixed table 22 fixedly arranged on the base 1a of this device, and a fixed table 22 fixedly arranged on the base 1a of this device.
2, a Y-table drive section 24 that provides a driving force in the Y-direction to the Y-table 23, and a Y-table drive section 24 that is movable in the X-direction above the Y-table 23. X table placed 2
5, and an X-table drive unit 26 that is connected and supported by the Y-table 23 and applies a driving force in the X direction to the X-table 25.
It is equipped with.

The substrate positioning section 11 is supported by a lift unit 27 on the X table 25 so as to be movable up and down in the Z direction, and includes a pair of positioning rails arranged in parallel with the same spacing as the transport rails 13a and 13b. 28a, 28b, and these positioning rails 28a, 2
A pair of backup tables 29a supported by the X-table 25 so as to be located between the X-tables 29a and 8b.

29b.

The substrate unloader 9 is provided on the base 1a of this apparatus and adjacent to the forward direction of the substrate positioning section 11.

This board unloader 9 has the positioning rail 28a.
, 28b and discharging rails 30a, 30b arranged in parallel with the same spacing as the discharging rails 30a, 30b.
A discharge conveyor unit 31 provided in b, a discharge drive unit 32 that applies a conveyance force in the X direction to the discharge conveyor unit 31, and a discharge drive section 32 that rotates along the discharge rail 30a and in the Pi and P2 directions. A rotating shaft 33 is arranged so as to be movable, a moving body 34 is arranged so as to be movable in the X direction while loosely fitting the rotating shaft 33, and one end is supported by the moving body 34. and both the discharge rails 30a, 3.
A substrate pressing portion 35 provided at the other end at approximately the center position of 0b.
a, the ejection actuator 36 that applies a conveying force in the X direction to the moving position 34 and the presser 35, and the rotating shaft 33. Moving body 34 and presser 3
5 is provided with a rotation actuator 37 that applies rotational force in the Pl and P2 directions.

Each of the transfer claws 16a to 16d of the substrate loader 8 is provided with a pin 38 that can be engaged with a positioning hole 112 previously drilled in the substrate 110, as shown in FIG.

Further, the backup tables 29a and 29b are provided with protruding pins 39 that can be engaged with the positioning holes 112 of the substrate 110, as shown in FIG.

Next, the electronic component storage means 3 will be explained with reference to FIGS. 1 and 6.

This electronic component storage means 3 is arranged behind the base 1a. This electronic component storage means 3 includes a tray transfer section 4
1 and the tray magazine 42 as one set, and three sets of these are arranged in a row.

As shown in FIG. 6(a), the tray transfer section 41 is driven in the Z direction by a drive source storage box 43, a magazine drive unit 44 housed in the drive source storage box 43, and this magazine drive unit 44. A cradle 45 is provided. The magazine drive unit 4/1 is a drive source storage box 4.
3, a pole screw 47 vertically connected to the driving shaft of the motor 46, and a threaded body 48 screwed to the pole screw 47, The pedestal 48 is connected to this screw assembly 48 so as to be horizontally arranged. Furthermore, inside the drive source storage box 43, the pole screw/
A disc 49 that rotates in synchronization with the rotation of the pedestal 45 is provided, and a notch provided in this disc 49 is detected by a photomicrosensor 50, and based on this, the movement pitch of the pedestal 45 in seven directions is controlled. It is supposed to be done.

The tray magazine 42 is placed on the pedestal 45,
It is adapted to be driven in seven directions together with the pedestal 45.

On the inner surfaces of both walls of this tray magazine 42, as shown in FIG.
, (c), (As shown in (l), a large number of corresponding grooves 51 are provided in the Y direction, and a large number of rectangular tray jigs 52 are removably housed in the valley grooves 51.

As shown in FIG. 6(C), the tray jig 52 includes a rectangular jig main body 53, positioning pins 54 drilled in the center of the jig main body 52 at predetermined intervals, and a jig main body 53. A symmetrical concave portion 5 fixed to the center of one end of the tool body 53
A tray 56 is placed on this tray jig 52.

As shown in FIG. 6(C), this tray 56 has a grid-shaped electronic component mounting portion 57 formed therein.

The electronic component mounting portion 57 is formed by a protruding piece 58 provided on the tray 56, as shown in an enlarged view in FIG. 6(d).

A large number of electronic components 100 of the same type or minnow species having a shape as shown in FIG.

The electronic component conveying means 4 is shown in FIGS. 1 and 7.

As shown in FIGS. 8 and 9, there is a tray delivery section 60 for taking out each tray jig 52 from the electronic component storage means 3, and a configuration movable in the X and Y directions above the tray delivery section 60. The apparatus includes an XY robot 61 and a 2gU electronic component supply chuck section 62 attached to the XY robot 61.

The tray delivery section 60 transfers each tray magazine 42
Three sets of tray conveyance rails 63a and 63b arranged in parallel with one end facing the opening side and the other end facing the electronic component positioning means 5 side, and an intermediate position between each of the tray conveyance rails 63a and 63b. and a belt 64 arranged parallel to these, a slider 65 fixed to this belt 64 in a horizontal arrangement, and one end of each is rotatably supported by this slider 65, and the other end of each is rotatably supported. a pair of claws 66 having engaging protrusions 66a and 66b formed at their ends that can engage with the concave portion 55a of the tray jig 52;
It is provided with a claw opening/closing mechanism section 67 that opens and closes the claw 66 in the X direction. This pawl opening/closing mechanism 67 includes a spring 68 stretched between both pawls 66, a motor 69 disposed below the center of both pawls 66 with its rotating shaft facing seven directions, and a motor 69.
A tapered member 7 is attached to the rotating shaft of 9 so as to be movable up and down.
0 and which moves up and down as the motor 69 rotates, a pair of sliding members 71 fixed to the inner surfaces of the claws 66 are brought into contact with the outer periphery of a tapered member 70 that moves up and down as the motor 69 rotates. are opened and closed in the X plane, thereby causing the engaging protrusions 66a, 66b of both claws 66 to engage with or disengage from the recessed part 55a of the tray jig 52.

The position where both the claws 66 and the concave portion 55a of the tray jig 52 engage with or disengage from each other will be referred to as a "delivery position."

And, due to the configuration of the tray delivery section 60 in the electronic component storage means 3 and the electronic component transport means 4 as described above,
The operation of carrying out the tray jig 52 from the tray magazine 42 as shown in FIG. 8(a), the operation of carrying the tray jig 52 into the tray magazine 42 as shown in FIG. The operation of unloading the next tray jig 52 from the tray magazine 42 as shown in C) is performed at the delivery position.

As shown in FIG. 1, the X-Y robot includes a fixed guide member 76 horizontally arranged in the X direction in the vicinity of the electronic component storage means 3 by a branch 75 erected from the base 1a; An X-direction movable body 7B that engages with a guide groove 77 provided in the fixed guide member 76 and extends in the Y direction above the tray transfer section 60, and a driving force in the X direction is applied to the X-direction movable body 78. and a Y-direction drive motor 80 that applies a driving force in the Y-direction to the electronic component supply chuck section 62 mounted movably along the X-direction moving body 78. There is.

The electronic component supply chuck section 62 is shown in FIG. 9 (a>, (
, b), a movable piece 81 movably attached to the X-direction movable body 78, a box body 82 with a built-in traverse structure supported by this movable piece 81, and A pair of chucks 83a, 83 protrudingly arranged parallel to each other and having an interval adjustable by the traverse jaw structure.
b.

Then, the interval between the chucks 83a and 83b of the pair of electronic component supply chuck sections 62 is adjusted to Ll or L2 as shown in FIGS. 9(a) and 9(b), and the tray jig 52
Electronic components 100 of the same kind or different kinds placed on the upper tray 56 are picked up and supplied to the electronic component positioning means 5. The manner in which the electronic component 100 is supplied in this case will be described later.

The electronic component positioning means 5 is provided between the electronic component transport means 4 and the board transport means 2 and on a horizontal board 85 horizontally arranged on the base 1a.

In this embodiment, the electronic component positioning means 5 is composed of four units, including an electronic component positioning section 5A that forms a positioning space corresponding to the shape of the electronic component 100, and an electronic component positioning section 5A that forms a positioning space corresponding to the shape of the electronic component 100; 90',
180', 270"(-90", etc.) and an actuator for operating both parts, the details will be discussed here as the applicant has already filed an application. I will omit it here.

Next, the soldering medium application means 6 and the electronic component transfer/
The mounting means 7 will be explained.

The soldering medium application means 6 includes four flux heads 8.
6, the electronic component transfer/mounting means 7 is each equipped with four FPIC supply heads 87, and one flux head 86 and one FPIC supply head 87 constitute one set, for a total of four sets. In addition, in FIG. 1, only three sets are shown for convenience of explanation.

The flux head 86 and the FPIC supply head 87
are supported movably in the Y direction by guide rails 88 fixedly arranged above the horizontal board 85 in the Y direction.

The flux head 86 uses eight head parts provided at its lower end to connect the wiring pattern 11 of the board 110.
1 is coated with flux as a soldering medium, and the head portion 89 is moved in the Y direction by the Y direction actuator 90.
direction, and is driven in the ZY direction by a two-way actuator 91. Further, the FPIG supply head 87 has a suction function for the electronic component 100 at its lower end, and comes into contact with a portion of a lead terminal 102 protruding outward from the main body 101 of the electronic component 100 to heat it. The IC head section 93 includes a heater chip 92 that has a heater chip 92. Then, this IC head 93 is moved in the Y direction by a Y direction actuator 94 and in the Z direction by a rad actuator 95.
They are each driven in the Z direction.

In addition, 96 in FIG. 1 indicates at least four pulse controllers constituting a part of the control means 120 attached to the base 1a;
Reference numeral 130 denotes an X-Y controller similarly attached to the base 1a.

FIG. 10 shows the control system of the device of this embodiment,
A control means 120 that controls the entire device, a memory 140 that stores a control program for this device in advance,
The device includes an operation section 150 for inputting operation signals to the device. The control means 120 also includes the substrate transport means 2.
Each part of.

A tray transfer section of the electronic component storage means 3, each section of the electronic component transport section 4, and each section of the electronic component positioning section 5.

Soldering medium application means 6. Electronic component transfer/mounter 827
are connected to each other, and their operations are controlled by the control means 120.

Further, an X-Y controller 130 is connected to the control means 120, and the X-Y controller 130 controls the
- The Y table 12 and the XY robot 61 are controlled respectively.

Next, the operation of the apparatus having the above structure will be explained with reference to FIGS. 11 to 13.

First, the transport and positioning operation of the substrate 110 by the substrate transport means 2 will be explained.

The substrates 110 placed in pairs between the transport rails 13a and 13b of the substrate loader 8 are transferred to the transfer claws 16a and 16b and the transfer claws 15c of the transport unit 15.
16d, and in this state, the carrier is forcibly conveyed in the direction of the arrow (X direction) shown in FIG. 1 by the conveyance force of the conveyance drive unit 17.

The two substrates 100 transported onto the positioning rails 28a and 28b reach directly above the backup tables 29a and 29b, as shown in FIG. At the base of both boards 1
Stop transporting 00.

Next, both positioning rails 28a and 28b are lowered in the Z direction by the operation of the lift unit 27, and thereby the pin 3
8 and the positioning hole 112 of the substrate 100 is released, and the positioning hole 112 is connected to the backup table 29.
It engages with protruding pins 39 provided on each of a and 29b.

In this way, the open substrate 110 is positioned on the backup tables 29a, 29b.

On the other hand, the tray transfer unit 41 of the electronic component storage means 3 moves in seven directions the tray magazine 42 in which each tray jig 52 on which a large number of electronic components 100 of the same or different types is placed is moved, and each tray The jigs 52 are sequentially carried to the delivery position.

The claw opening/closing mechanism section 67 of the tray delivery section 60 opens both claws 66 so as to expose both claws 66 to both sides of the hook 55, and closes both claws 66 in this state to engage protrusions 66a,
66b is engaged with the concave portion 55a of the hook 55. After that, the belt 64 is driven in the Y direction to pull out the tray jig 52 from the tray magazine 42 and move it to the tray transport rail 63.
a.

63b.

In this case, as shown in FIG. 11, the wide first tray jig 52a is
The following explanation will be given assuming that the narrow second tray jig 52b is simultaneously pulled out to each of the tray conveyance rails 63a and 63b. Note that trays 56a arranged in 10 columns and 5 rows are mounted on the first tray jig 52a, and trays 56b arranged in 4 columns and 14 rows are mounted on the second tray jig 52b. It is assumed that the parts 100 are placed respectively.

The X-Y robot 61 includes a control means 120 and an X-Y
Under the control of the controller 130, all the electronic component supply V-tuck units 62 are transferred onto the first tray odor control 52a.

The operation of supplying the electronic component 100 by the electronic component supply chuck section 62 is as follows.

That is, first, at the first point shown in FIG.
Tray 5 is removed by two sets of chucks 83a and 83b.
The electronic components 100 of the same type on 6a are simultaneously picked up, and these are placed in the four electronic component positioning means 5 (these are sequentially "gauged 5a, 5b, 5b,
5c, 5dl. ), gauging 5a, 5c
Supply one piece each.

Next, the two sets of chucks 83a and 83b are moved to the first point on the tray 56b, where the electronic component 10 described above is
Two electronic components 100 of a type different from 0 (for example, one having a shape and size of one circuit configuration) are picked up, and this time gauging 5b is performed.

Supply one piece each to 5d. After this, tray 56
Move to the second point a, and repeat the same operation thereafter.

Incidentally, the symbols ``■'' to ``■'' in FIG. 11 indicate the order in which the electronic component supply chuck section 62 is moved.

Due to this feeding operation of the electronic components 100, the tray 56
When all the electronic components 100 on a and 56b are gone, each tray jig 52a and 52b is returned to the corresponding tray magazine 42 by the electronic component conveying means 4.

Next, as schematically shown in FIG. 12, each gauging 5a to 5d constituting the electronic component positioning means 5 moves the electronic component 100 from Q6°90° to 180°. ',,270
Positioning is performed while turning in a direction predetermined by the control program such as '(-90').

While positioning is being performed by each of the gaugings 5a to 5d described above, the head portions 89 of the four flux heads 86 apply flux to each wiring pattern 111 of the substrate 110 under the control of the control means 120. do.

Application of flux to each wiring pattern 111 and subsequent application of flux to each FPIC supply head 87
The transportation and mounting of each electronic component 100 by the electronic component 100 is performed as follows.

Two substrates 110 (hereinafter referred to as [first substrate 110a, second substrate 110a]) positioned on both backup tables 29a, 29b
The wiring pattern 111 of the board 110bJ) is
The Y table 12 positions the flux heads 86 at positions corresponding to the flux heads 86, as shown in FIG. This is indicated by points (■) to (■) in the figure.

In this state, the first flux head 86 is connected to the first substrate 1.
3rd flux head 86 at point 10a ■
At the same time, 7 lux is applied to point (3) of the second substrate 110b.

After that, the first FPIC supply head 87 transfers the electronic components 100 arranged at O° from the gauging 5a to the third FPIC supply head 87.
The PIC supply head 87 is 180 from the gauging 5C.
The electronic components 100 arranged at ° are respectively attracted and transferred to both points (2), and the electronic components 100 are each placed at both points (2) by heating each heater chip under the control of the pulse controller 130 that constitutes the control means 120 @. Mount by soldering.

In the same manner, points ■ to ■ of the first diamond plate 110a,
Flux application and mounting of each electronic component 100 to points (2) to (3) on the second board 110b are performed.

After this, the side substrate 110a on which each electronic component 100 is mounted
, 110b rise in seven directions together with the positioning rails 28a, 28b in the reverse order of the positioning operation shown in FIG.

18b, the substrate is sent to the discharge rails 30a and 30b of the substrate unloader 9, as shown in FIG. 4(b). At this time, the following two boards 110 are connected to the transfer claw body 16a.
16d to positioning rails 28a and 28b as shown in FIG. 4(b). Furthermore, in this state, the subsequent two substrates 110 are connected to the first substrate 110. It is stopped on the transport rails 13a, 13b by the second stopper 20.21.

Thereafter, the pusher claws 18a, 18b and the transfer claws 16a to 16d rotate in the direction of arrow P1 in response to the rotational force of the actuator 18, and are simultaneously driven by the conveyance drive unit 17, as shown in FIG. 4(a). Return to the state shown in .

On the other hand, the mounted peripheral substrate 110 transferred to the discharge rails 30a and 30b is pushed by the presser 35 of the substrate unloader 9 and discharged to a stocker (not shown).

The present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the invention.

For example, in the embodiment described above, the electronic component storage means.

Each of the electronic component transport means is composed of three units, including an electronic component positioning means, a soldering medium application means, and an electronic component transfer means.
The explanation has been given of a case in which the mounting means are each configured with four units, and two boards are transported and positioned at the same time by the board transport means. Combinations are possible.

[Effects of the Invention] According to the present invention described in detail above, it is possible to provide an electronic component mounting apparatus that can simultaneously mount a plurality of electronic components at predetermined positions on a board, is suitable for mass production, and is excellent in economic efficiency. can.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an embodiment of the device of the present invention, FIG. 2 is a schematic plan view of the device, FIG. 3(a) is a plan view showing an example of electronic components used in the device, and FIG. b) is a perspective view showing a part of the board used in the device; FIG. 4(a), <b)
5 is a schematic sectional view showing the board positioning state in the same device, and FIG. 6(a) is a perspective view showing the electronic component storage means in the same device. , FIG. 6(b) is a partially cutaway perspective view showing the tray magazine same as above, FIG. 6(C) is a perspective view showing the tray jig and tray same as above, and FIG. 6(d) is a perspective view showing the tray jig same as above. A schematic cross-sectional view showing a tool, a tray, and electronic components,
Figure 7(a). 8(b) is a perspective view showing a part of the electronic component conveying means in the same device, and FIGS. 8(a) and 8(b), respectively. (C) is an explanatory diagram showing the tray jig and tray loading and unloading operations, respectively, with respect to the tray magazine, and Figure 9 (a)
＞, (b) are respectively plan views showing the electronic component supply chuck section in the same device, FIG. 10 is a block diagram showing the control system of the embodiment device, and FIG. An explanatory diagram showing the supply order, FIG. 12 is an explanatory diagram showing the turning state of electronic components by each gauging in the same device and a supply state of electronic components from each gauging to the board, and FIG. 13 is a diagram showing the flux head and FPIC in the same device. FIG. 3 is an explanatory diagram that does not show the positional relationship between the supply head and the substrate. 1... Electronic component mounting device, 2... Board transport means, 3
...Electronic component storage means, 4...Electronic component transport means,
5...Electronic component positioning means, 6...Soldering medium application means, 7...Electronic component transfer/mounting means. H BiY □3゜(C) Fig. 6 (b) Fig. 7 (b) (C) Fig. 8 Fig. 9 Fig. 11 Fig. 12

Claims (5)

[Claims] (1) A board mounting means for mounting a board on which a wiring pattern for soldering is formed at multiple locations in a predetermined position, and an electronic device for storing electronic components to be mounted on the board placed on this board mounting means. a component storage means; a plurality of electronic component transport means for taking out and transporting electronic components from the electronic component storage means;
A plurality of electronic component positioning means for positioning the electronic components transported by these electronic component transport means in desired directions, and transporting each electronic component positioned by these electronic component positioning means to the mounting area of each wiring pattern. An electronic component mounting apparatus comprising: a plurality of electronic component transfer/mounting means for mounting electronic components; and a control means for controlling the operation of each of the means. (2) The substrate mounting means includes a transport section that transports the substrate;
It includes a board positioning section that positions the board transported by the transport section at a predetermined position, and an X-Y table that moves the board positioned by the board positioning section to a mounting position by the electronic component transport/mounting means. An electronic component mounting apparatus according to claim 1, which comprises an electronic component mounting apparatus. (3) The electronic component storage means includes a tray magazine in which a required number of trays for storing groups of the same or different types of electronic components are removably arranged in a row, and each tray in the tray magazine is taken out by the electronic component transport means. The electronic component mounting apparatus according to claim 1, further comprising a tray transfer section for transferring the electronic component to the position. (4) The first electronic component transport means includes a tray take-out section that takes out each tray in the tray magazine from the take-out position, and an X-Y that transports the taken out trays to the electronic component positioning section.
2. The electronic component mounting apparatus according to claim 1, comprising a robot and an electronic component supply chuck section that supplies electronic components of the same type or different types from a tray transferred by the XY robot to a board positioning section. (5) The electronic component positioning means has a turning mechanism section that turns the electronic components of the same type or different type supplied from the electronic component conveying means in a desired direction. Electronic component mounting equipment.