JPS63283139A - Method for packaging semiconductor element - Google Patents

Abstract

PURPOSE:To realize a high-density package of semiconductor elements on a tape carrier without holes by a method wherein a semiconductor element is connected to a metal protrusion formed at an end of a metal conductor. CONSTITUTION:Metal conductors 12 are built on a tape carrier 11 so that the tape carrier 11 itself will serve as a circuit board. A resist 14 is provided on a substrate 13 for metal protrusion formation and, to the resist 14 at its prescribed position, a metal protrusion 15 is attached. The metal protrusion 15 is connected to an end of the metal conductor 12, pressure is exerted by using a pressing block 16, and an ultrasonic heater 17 is activated in an ultrasonic bonding process. The ultrasonic heater 17 is activated again in a process of attaching a semiconductor element 18 to the protrusion 15 on the tape carrier 11, which is accomplished at a lower temperature under pressure. A metal conductor may be fixed secure to a tape carrier in this method, and an enhanced-density package realizes of semiconductor elements on a tape carrier.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to a method for mounting semiconductor devices using a tape carrier.

[Prior art and its problems]

(Prior Art) When mounting a large number of semiconductor elements on a substrate using a conventional tape carrier, for example, as shown in FIG. A device hole 2 and a cutting hole 3 are formed at the positions, and a metal conductor 4 is formed above them.

Then, a metal protrusion (Au bump, etc.) 5 is attached to the end of the metal conductor 4.
At the same time, as shown in FIGS. 5(a) and 5(b), the semiconductor elements 7 are connected by, for example, thermocompression bonding using the holding member 6, and the metal conductor 4 is cut and formed at necessary locations to form the base. I was trying to implement it on FiB.

(Problems to be Solved by the Invention) However, in such conventional tape carrier methods, the tape carrier itself may be used as a substrate. In such a case, there is a problem that a circuit pattern cannot be formed in the device hole or the cutting hole, and the degree of freedom of the circuit pattern is restricted.

Further, since the device hole exists, when connecting the semiconductor element 7, only a part of the metal conductor 4 is supported by the tape carrier 1 as shown in FIG. There is also a drawback that there is a risk that a part of the metal conductor 4 may be bent, resulting in a poor connection when forming the semiconductor element 7 or connecting the semiconductor element 7.For this reason, it is not possible to widen the gap between the semiconductor elements, and the semiconductor element 7 is placed on the tape carrier. It was not possible to mount elements at high density.

[Purpose of the invention]

The present invention has been made in view of the problems of the conventional semiconductor device mounting method, and it enables high-density mounting of semiconductor devices using a tape carrier as a circuit board, and also improves reliability during mounting. The technical challenge is to improve the flexibility.

[Structure and effects of the invention]

(Means for Solving the Problems) The present invention is a method for mounting a semiconductor element using a tape carrier, which includes the steps of forming a circuit pattern using a metal conductor on the tape carrier, as shown in FIG. The steps include forming a metal protrusion on the end of the metal conductor on the tape carrier, and connecting the electrode terminal of the semiconductor element to the metal protrusion from the metal conductor side of the tape carrier. It is characterized by implementing the following.

(Function) According to the present invention having such characteristics, a metal conductor is formed as a connection pattern without forming a device hole or a pattern cutting hole even at a position where a semiconductor element is attached to a tape carrier. A joining metal protrusion is formed at the end of the metal conductor, and a semiconductor element is connected from one side of the tape carrier. In this way, the tape carrier itself can be used as a circuit board.

(Effects of the Invention) Therefore, according to the present invention, since no holes are provided in the tape carrier, the metal conductor is securely fixed to the tape carrier, and there is no possibility that the conductor will be deformed during mounting. Therefore, a large number of semiconductor elements can be mounted on the tape carrier with high density. Also in that case, it is possible to provide a semiconductor device with high reliability.

[Explanation of Examples]

FIG. 1 is a diagram showing a manufacturing process of a semiconductor device according to an embodiment of the present invention. First, as shown in FIG. 1(a), a metal conductor 12 is formed on the upper surface of a tape carrier 11 having sprocket holes around its periphery in the same manner as in the prior art. A circuit pattern for connecting a plurality of semiconductor elements to each other is simultaneously formed on the metal conductor 12 so that the tape carrier 11 itself can be used as a circuit board. Then, a metal protrusion is formed at the end of the metal conductor 12 at a position where the semiconductor element is to be attached. As shown in FIG. 1(b), a resist 14 is provided on a substrate 13 for forming metal protrusions, and a metal protrusion 15 is attached in advance at a predetermined position on the resist 14. Then, ultrasonic bonding is performed on the ends of the metal conductors 12 of the tape carrier 11 as shown in FIG. 1(C).
is connected to the end of the metal conductor 12, pressure is applied using the holding block 16, heating is performed using the ultrasonic connection heater 17, and ultrasonic waves are applied. In this way, a tape carrier 11 having metal protrusions 15 at the ends of the metal pattern is constructed, and a semiconductor element 18 is further attached to the same surface as shown in FIG. 1(d). When attaching the semiconductor element 18, the ultrasonic connection heater 1 is
Bonding is performed at a low temperature by applying ultrasonic waves while pressurizing and heating the chips using a microprocessor.

In this way, since no device hole is provided in the tape carrier itself, the metal conductor 12 is securely held on the tape carrier 11. Therefore, as shown in FIGS. 2 and 3, a large number of semiconductor elements 18 can be mounted on the tape carrier 11 at high density.

Furthermore, it becomes possible to form a metal conductor through the part where the semiconductor element is to be attached, and the degree of freedom in pattern design can be increased.

[Brief explanation of drawings]

FIG. 1 is a process diagram showing a method for mounting a semiconductor device according to an embodiment of the present invention, FIG. 2 is a diagram showing an example of a semiconductor device configured on a tape carrier, FIG. 3 is a cross-sectional view thereof, and FIG.
This figure shows an example of a conventional tape carrier, and FIG. 5 shows a state in which a semiconductor element is mounted on the tape carrier. 11--Tape carrier 12--Metal conductor 15--Metal protrusion 18---Semiconductor element Patent applicant Tateishi Electric Co., Ltd. agent Patent attorney Yoshiki Okamoto ( 1 other person) Figure 1 11-...-1-Thea Pigeon 7 12...-Plan λ4 Hunting 15...-Kai &! ! Z 18・----+4 A (Fist figure 2 figure 4 figure f mouth figure 5

Claims (1)

[Claims] (1) A step of forming a circuit pattern using a metal conductor on the tape carrier, a step of forming a metal protrusion at the end of the metal conductor on the tape carrier, and an electrode terminal of the semiconductor element from the metal conductor side of the tape carrier. A method for mounting a semiconductor device, comprising: connecting a semiconductor device to the metal protrusion, and mounting the semiconductor device using a tape carrier.