JPH08264598A - Apparatus and method for bonding flexible film - Google Patents

Abstract

PURPOSE: To heat at a lower temperature when a flexible film and a semiconductor chip are bonded together and further to reduce dispersion of bonding strength. CONSTITUTION: A semiconductor chip 1 is fixed on a fixing part 2, a flexible film 12 is placed on the semiconductor chip 1, a tool 10 is moved down to the flexible film 12 while heating the fixing part 2 and while applying ultrasonic vibration to the fixing part 2 and the flexible film 12 is pressed by the tool 10, and the down movement of the tool 10 is stopped when the pressure of the tool 10 against the flexible film 12 reaches a preset value.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible film bonding apparatus and method for bonding a flexible film to a semiconductor chip, and more particularly to a flexible film bonding apparatus used in a film carrier semiconductor device manufacturing apparatus.

[0002]

2. Description of the Related Art A method of manufacturing a film carrier semiconductor device by adhering a semiconductor chip to a flexible film is described in Japanese Patent Application No. 110857 of 1994. FIG. 3 is a cross-sectional view of the flexible film 12 showing this manufacturing method, in which the semiconductor chip 1 is bonded to the flexible film 12 using an adhesive film 21. The flexible film 12 is provided with a wiring 22, and the via hole of the flexible film 12 is filled with a conductive filling material 24 that is electrically connected to the wiring 22. The surface of the semiconductor chip 1 is covered with a passivation film 25 except for the electrode 23. The wiring 22 is connected to the electrode 23 by bonding.

FIG. 2 is a block diagram of a conventional flexible film bonding apparatus for bonding the flexible film 12 shown in FIG. 3 to the semiconductor chip 1. The flexible film bonding apparatus shown in FIG. 2 fixes the chip fixing part 2 for fixing the semiconductor chip 1, the heater block part 3 provided below the chip fixing part 2 for heating the chip fixing part 2 and the heater block part 3. It is composed of a base 4, a pressing mechanism section 5 placed on the base 4, and a tool 10 installed on the pressing mechanism section 5. The tool 10 is heated similarly to the heater block section 3.

The semiconductor chip 1 is vacuum-sucked by the chip fixing portion 2, and the adhesive film 21 (see FIG. 3, not shown in FIG. 2) and the flexible film 12 are accurately positioned and placed on the semiconductor chip 1. The tool 10 is lowered by the heating mechanism 5, and the flexible film 1 is moved by the tool 10.
The semiconductor chip 1 and the flexible film 12 are heated and adhered by the heater block 3 and the tool 10 while pressing the semiconductor chip 1 onto the semiconductor chip 1.

The pressing mechanism 5 moves the tool 10 up and down by screw feeding with a ball screw rotated by a motor, for example, and presses it against the flexible film 12. The pressure applied to the flexible film 12 by the pressurizing mechanism 5 is preset by setting the voltage applied to the motor when the tool 10 is pressing the flexible film 12 to a predetermined value.

[0006]

SUMMARY OF THE INVENTION The conventional flexible film bonding apparatus described above has the flexible film 12
In order to sufficiently bond the semiconductor chip 1 and the semiconductor chip 1 to each other, the temperature of the heater block portion 3 is set to a high temperature and the flexible film 12
It was necessary to heat the semiconductor chip 1 to a high temperature. Further, since the pressure applied by the pressing mechanism section 5 is not stable, the adhesive force of the flexible film 12 varies, and the quality of the film carrier semiconductor device obtained by adhering the flexible film and the semiconductor chip is good. There was a problem that it did not exist.

[0007]

A flexible film bonding apparatus according to the present invention comprises a chip fixing portion for fixing a semiconductor chip, a heater block portion for heating the chip fixing portion, and a flexible member mounted on the semiconductor chip. A tool for pressurizing the film, a pressurizing mechanism section for moving the tool up and down to generate a pressurizing force of the tool on the flexible film, and a pressurizing detecting section for detecting the pressurizing force of the tool on the flexible film. A comparing unit that lowers the tool by the pressing mechanism unit and stops the pressing mechanism unit when the pressing force of the tool detected by the pressing detection unit reaches a preset pressing force; And an ultrasonic generator for applying ultrasonic vibration to the tool.

According to the flexible film bonding method of the present invention, a semiconductor chip is fixed on a fixed portion, a flexible film is placed on the semiconductor chip, the fixed portion is heated, and ultrasonic vibration is applied to the fixed portion. While lowering the tool on the flexible film to press the flexible film with the tool, and stop the lowering of the tool when the pressing force of the tool on the flexible film reaches a preset value. Is characterized by.

[0009]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of the present invention.

In this embodiment, a chip fixing portion 2 for fixing the semiconductor chip 1, a heater block portion 3 provided below the chip fixing portion 2 for heating the chip fixing portion 2, and a base for fixing the heater block portion 3. 4, a pressure mechanism unit 5 mounted on the base 4, a pressure detection unit 6 such as a load cell provided at the tip of the pressure mechanism unit 5, and a tool provided below the pressure detection unit 6. 10, a pressure detection amplifier unit 7 that detects the pressure applied by the tool 10 to press the flexible film 12 and amplifies the signal output from the pressure detection unit 6, and a pressure setting unit 8 that sets the pressure applied by the tool 10. And a pressure comparing unit 9 that compares signals from the pressure detecting and amplifying unit 7 and the pressure establishing unit 8 and sends a signal to the pressure mechanism unit 5, and an ultrasonic generator 11 that applies ultrasonic waves to the tool 10. I have it.

Next, the operation of this embodiment will be described.
When adhering the flexible film 12 to the semiconductor chip 1, first, the chip fixing portion 2 which is heated to a preset temperature is used.
The semiconductor chip 1 is fixed to the predetermined position by vacuum suction. The adhesive film and the flexible film 12 are placed on the semiconductor chip 1 after aligning with the semiconductor chip 1. The pressing force is set in advance in the pressurization setting unit 8. Ultrasonic vibration is applied to the tool 10 by the ultrasonic generator 11. After that, the pressurizing mechanism section 5 is operated to operate the tool 1
Decrease 0. The pressure setting unit 8, the pressure comparing unit 9, the pressure detecting unit 6, and the pressure detecting amplifier unit 7 apply the pressing force with which the tool 10 presses the flexible film 12.
When the applied pressure becomes larger than the preset pressing force, the pressurization comparison unit 9 operates to stop the pressurization mechanism unit 5. As a result, the semiconductor chip 1 and the flexible film 12 are brought into a state of being bonded to each other by a pressing force, heat and ultrasonic waves. By continuing this state for several seconds, the semiconductor chip 1 and the flexible film 12
Glue and. Note that heat is also generated between the tool 10 and the flexible film 12 by applying ultrasonic waves to the tool 10, and plays a role of supplementing the heating of the heater block portion 3. Further, after the bonding is completed, the pressing mechanism section 5 is returned to the original position, and the flexible film 12 is bonded to the semiconductor chip 1
Is removed from the chip fixing portion 3.

According to the present invention, the flexible film and the semiconductor chip can be bonded to each other by using another adhesive material without using the adhesive film, for example, an adhesive or the like previously applied to the flexible film.

[0014]

As described above, according to the flexible film bonding apparatus and method of the present invention, the temperature of the semiconductor chip is lowered by heating the chip fixing portion for fixing the semiconductor chip and applying ultrasonic vibration. Therefore, it is not necessary to heat the chip fixing portion to a high temperature. Further, by stopping the descent of the tool for pressurizing the flexible film placed on the semiconductor chip when the applied pressure reaches a set value, the variation in the adhesive force between the flexible film and the semiconductor chip is reduced, and The quality of the film carrier semiconductor device obtained by bonding can be improved.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment of the present invention.

FIG. 2 is a configuration diagram of a conventional flexible film bonding apparatus.

FIG. 3 is a cross-sectional view of a flexible film having semiconductor chips adhered thereto for manufacturing a film carrier semiconductor device.

[Explanation of symbols]

 1 semiconductor chip 2 chip fixing part 3 heater block part 4 base 5 pressurizing mechanism part 6 pressurizing detecting part 7 pressurizing detection amplifier part 8 pressurizing setting part 9 pressurizing comparing part 10 tool 11 ultrasonic wave generator 12 flexible film

Claims (2)

[Claims] 1. A chip fixing part for fixing a semiconductor chip, and a heater block part for heating the chip fixing part,
A tool for pressurizing a flexible film placed on the semiconductor chip, a pressurizing mechanism section for moving the tool up and down to generate a pressing force on the flexible film, and a tool for the flexible film. A pressurization detection unit that detects a pressurization force, and the pressurization mechanism unit lowers the tool when the pressurization force of the tool detected by the pressurization detection unit reaches a preset pressurization force. A flexible film bonding apparatus, comprising: a comparison unit that stops a mechanical unit; and an ultrasonic wave generation device that applies ultrasonic vibration to the tool. 2. A semiconductor chip is fixed on a fixing portion, a flexible film is placed on the semiconductor chip, the fixing portion is heated, and ultrasonic vibration is applied to the fixing portion while applying a tool to the flexible film. The flexible film bonding is characterized in that the flexible film is pushed down to press the flexible film with the tool, and the descent of the tool is stopped when the pressing force of the tool with respect to the flexible film reaches a preset value. Method.