JPS63280445A - Electronic circuit device and manufacture thereof - Google Patents

Abstract

PURPOSE:To improve the productivity of an electronic circuit device by forming an extrusion mold, inserting an electronic circuit body having a lead terminal into a U-shaped metal case formed with a plurality of fins parallel to the extruding direction, and filling resin in the case. CONSTITUTION:A plurality of heat sink fins 6a are so integrally provided on the outer face of a metal case 6 as to be parallel to the extruding direction on one side and upper face at the time of extrusion molding. A metal member is extrusion molded to obtain a long metal case member 6' of the shape in which a plurality of cases 6 are connected. A plurality of lead terminals 5 are connected to a holding bar 9 to so insert an electronic circuit body 1 of the state that a plurality of the terminals are hung into the member 6' in such a manner that the terminals 5 are protruded from the opening in the bottom of the member 6'. The body 1 is so inserted that the heat sink of the heating component 4 of the body 1 is engaged with the recess of a protrusion wall 6c at this time. Thereafter, resin 8 is filled therein in the state that both end openings of the member 6' are blocked and cured. Then, the member 6' is cut including the resin 8 between the individual bodies 1.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic circuit device such as an in-vehicle component and a method for manufacturing the same.

Conventional technology A conventional electronic circuit device of this type is shown in FIG.

It was constructed as shown in FIG. That is, in FIGS. 4 and 6, reference numeral 21 indicates electronic components 23, such as resistors and capacitors, on a printed circuit board 22. It is an electronic circuit body configured by mounting heat-generating parts 24 such as transistors and performing predetermined electrical wiring.
5 is connected. The electronic circuit main body 21 is housed in a bottomed metal case 26 made of Guicast molding and has heat dissipation fins 261L on the outer surface, and the metal case 26 is filled with a thermosetting resin 27. There is. Note that the lead wires 25 of the electronic circuit main body 21 are held by a holding plate 28 fitted to the side surface of the metal case 26 and drawn out to the outside.

Problems to be Solved by the Invention In the case of such conventional devices, the opening side of the metal case 26 is the part for attaching to the equipment, and the resin side is in contact with the equipment, resulting in poor heat dissipation efficiency, and during assembly, electronic Circuit body 21
After composing the parts, they are stored in a metal case 26 and a resin 27 is placed.
The problem is that the process involves assembling each piece one by one, making it difficult to mass produce and lower prices.

The present invention solves these problems and aims to improve productivity.

Means for Solving the Problem In order to solve this problem, the present invention provides a U-shaped metal case formed by extrusion molding and having a plurality of fins formed on the outer surface parallel to the extrusion direction. , an electronic circuit body having lead terminals is inserted into the metal case, and the inside of the metal case is filled with resin.

Furthermore, the manufacturing method of the present invention involves forming a U-shaped elongated metal case member by extrusion molding, and then cutting the metal case member after or before inserting and arranging the electronic circuit body and filling the resin. It has a metal case.

Effect: With this configuration, a long metal case member is prepared, a plurality of electronic circuit bodies are inserted into the metal case member, and
After filling with resin, it is sufficient to divide the electronic circuit into individual parts or obtain a metal case from a long metal case member, insert the electronic circuit main body, and fill with resin, resulting in high productivity. Still, one side of the U-shaped metal case serves as the part for attachment to the equipment, and the heat dissipation efficiency is improved compared to the conventional case where the resin part serves as the part for attachment.

EXAMPLE Hereinafter, an example of the present invention will be explained using the drawings of FIGS. 1 to 3.

FIGS. 1 and 2 show an electronic circuit device according to an embodiment of the present invention, and in the figures, 1 is an electronic circuit main body,
It is constructed by mounting electronic components 3 such as capacitors and resistors and heat generating components 4 such as transistors on a printed circuit board 2 and performing predetermined electrical wiring. In addition, printed circuit board 2
A round or plate-shaped lead terminal 5 for connection with an external device is directly connected and fixed by soldering or the like.

Reference numeral 6 denotes a U-shaped metal case formed by extrusion molding with both end faces and bottom open. On the outer surface of this metal case 6, on the - side and top surfaces, parallel to the extrusion direction during extrusion molding, A plurality of heat radiation fins θ& are integrally provided. The electronic circuit main body 1 is inserted into the metal case 6 so that the lead terminals 6 protrude outside from the bottom opening of the metal case 6. In addition, a plurality of grooves 6b are provided on the inner surface of the metal case 6 at positions facing the fins 6a along the fins 6B so as to be parallel to the fins 6a, and furthermore, on the upper surface inside the metal case θ, , a protruding wall 6C is provided that forms a recess into which the heat dissipating part of the heat generating component 4 of the electronic circuit main body 1 fits. moreover,
On one side of the metal case 6 where the fins 82L are not formed, a mounting part 7 is provided by extending this side surface to the upper surface side, and the mounting part for external equipment is on this side side, and can be mounted with bolts and nuts etc. Installed.

A thermosetting resin 8 is injected into the metal case θ, and serves to protect the electronic circuit body 1, make it waterproof, and assist in heat radiation.

Next, regarding the method for manufacturing an electronic circuit device of the present invention, the third
This will be explained using Figures a to c.

First, as shown in FIG. 3a, a long metal case member 6' having a shape in which a plurality of metal cases 6 are connected is obtained by extrusion molding a metal member.

Thereafter, as shown in FIG. 3, the electronic circuit body 1 has a plurality of lead terminals 6 connected to the holding bar 9 and suspended
is inserted into the metal case member 6' so that the lead terminal 5 protrudes from the bottom opening of the metal case member 6'. At this time, the electronic circuit main body 1 is inserted and arranged so that the heat radiation part of the heat generating component 4 of the electronic circuit main body 1 fits into the recess formed by the protruding wall θC.

Thereafter, as shown in FIG. 3C, with the openings at both ends of the metal case member 6' closed, the resin 8 is injected into the interior and hardened. Then, in the final process, each electronic circuit body 1
The metal case member 6' is cut including the resin 8 between them, and is thereby divided into individual parts to obtain the electronic circuit device shown in FIGS. 1 and 2.

Here, in this embodiment, the long metal case member 6
After obtaining the metal case member 6', a plurality of electronic circuit bodies 1 were inserted and arranged, resin was injected, and the product was then divided into parts. Alternatively, the electronic circuit main body 1 may be inserted into the metal cases 6, and the resin 8 may be injected into the metal cases 6.

Effects of the Invention As described above, according to the present invention, a long metal case member is prepared by extrusion molding, a plurality of electronic circuit bodies are inserted and arranged in the metal case member, and the finished product is filled with resin. After dividing into individual metal cases or obtaining individual metal cases from long metal case members, the electronic circuit body can be inserted and arranged and filled with resin, thereby obtaining electronic circuit devices with high productivity. Furthermore, since the metal surface, which is one side of the metal case, serves as a mounting part for external equipment, it is possible to improve heat dissipation efficiency.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway perspective view of an electronic circuit device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the same, and FIG.
FIG. 4 and FIG. 6 are perspective views and cross-sectional views showing conventional electronic circuit devices. 1...Electronic circuit body, 2...Printed circuit board, 3...Electronic components, 4...Heating components, 5...Lead terminals , 6...Metal case, 6a...Fin, 6b...Groove,
6C...Protruding wall, 8...Resin. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 3 Figure 3 Figure 4 Figure 5 Q

Claims (3)

[Claims] (1) An electronic circuit body having lead terminals is inserted into a U-shaped metal case formed by extrusion molding and has multiple fins formed on the outer surface parallel to the extrusion direction, and placed inside the metal case. Electronic circuit device filled with resin. (2) A long U-shaped metal case member having a plurality of fins on the outer surface parallel to the extrusion direction is formed by extrusion molding, and a plurality of electronic circuit bodies having lead terminals are placed inside this metal case member. After inserting and arranging them in parallel,
1. A method of manufacturing an electronic circuit device, which comprises filling the inside of a metal case member with resin, and then dividing the metal case member between electronic circuit bodies into individual parts by cutting the metal case member. (3) A long U-shaped metal case member having multiple fins on the outer surface parallel to the extrusion direction is formed by extrusion molding, and this metal case member is cut to predetermined dimensions to form a metal case. 1. A method of manufacturing an electronic circuit device, comprising: inserting and arranging an electronic circuit body having lead terminals into a metal case, and filling the inside of the metal case with resin.