JPS63275112A - Wafer conveying equipment - Google Patents

Wafer conveying equipment

Info

Publication number
JPS63275112A
JPS63275112A JP62111850A JP11185087A JPS63275112A JP S63275112 A JPS63275112 A JP S63275112A JP 62111850 A JP62111850 A JP 62111850A JP 11185087 A JP11185087 A JP 11185087A JP S63275112 A JPS63275112 A JP S63275112A
Authority
JP
Japan
Prior art keywords
wheel
wafer
covers
dust
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62111850A
Other languages
Japanese (ja)
Inventor
Toshiya Oba
大庭 俊也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YAMAGUCHI NIPPON DENKI KK
Original Assignee
YAMAGUCHI NIPPON DENKI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YAMAGUCHI NIPPON DENKI KK filed Critical YAMAGUCHI NIPPON DENKI KK
Priority to JP62111850A priority Critical patent/JPS63275112A/en
Publication of JPS63275112A publication Critical patent/JPS63275112A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To reduce the amount of dust leaking outward, and prevent the contamination of a wafer surface due to dust, by providing a wheel and a bottom surface with covers. CONSTITUTION:A plurality of wheel covers 4 and a plurality of bottom surface covers 5 are provided. Those cover the upper surface of wheels except a wheel 2 of one end-portion of a main body part 1, and are fixed to the main body part 1. These are fixed to the bottom surface of the main body part 1 between the wheels 2. The wheel covers 4 cover the wheel 2 in the manner in which the external upper surface of the wheel 2 with an external diameter of about 45mm is covered with a several mm gap. The bottom surface covers 5 cover about 1/4 part of the lower side part of the external pheriphery of a wafer 8 with an external diameter of 6 inches. Therefore, dust generated by the wheel 2 can be prevented from attaching to the wafer 8 mounted on a boat 7 by the wheel covers 4. The dust blown up by travelling can be prevented from attaching to the wafer 8 by the existence of the bottom surface covers 5.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はウェーハ運搬器具に関し、特にウェーハの横型
拡散炉用の車輪付きのウェーハ運搬器具に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wafer transport device, and more particularly to a wheeled wafer transport device for a horizontal wafer diffusion furnace.

〔従来の技術〕[Conventional technology]

従来、この種のウェーハ運搬器具は、複数個のウェーハ
を立てて搭載するボートを複数個搭載して複数個の車輪
で移動できる構造になっていて、本体部は枠と枠に回転
可能に支持される車輪とから構成されていた。
Conventionally, this type of wafer transport equipment has a structure in which it can be moved on multiple wheels by mounting multiple boats on which multiple wafers can be loaded vertically, and the main body is rotatably supported between frames. It was made up of wheels.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来のウェーハ運搬器具は、底面側と車輪及び
車軸が搭載されたウェーハに対し露出した状態になって
いるので、塵埃が舞上り、ウェーハ表面に付着するとい
う欠点がある。
The above-mentioned conventional wafer transport device has the drawback that the bottom side, wheels, and axle are exposed to the wafer on which the wafer is mounted, so that dust can fly up and adhere to the wafer surface.

〔問題点を解決するための手段〕[Means for solving problems]

本発明のウェーハ運搬器具は、複数個のウェーハを搭載
した複数個のボートを搭載する複数個の車輪を有する本
体部から成るウェーハ運搬器具において、前記車輪の上
面を覆って設けられる車輪カバーと、前記本体部の底面
側の前記車輪間を覆って設けられる底面カバーとを有し
ている。
The wafer transport device of the present invention includes a main body portion having a plurality of wheels on which a plurality of boats carrying a plurality of wafers are mounted, and a wheel cover provided to cover the upper surface of the wheels; and a bottom cover provided to cover between the wheels on the bottom side of the main body.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図(a)及び(b)はそれぞれ本発明の−実施例の
平面図及び側面図である。
FIGS. 1(a) and 1(b) are a plan view and a side view, respectively, of an embodiment of the present invention.

第1図に示すように、枠組みされた本体部1と、本体部
1に車軸3で回転可能に支持された複数個の車輪2と、
本体部1の一端部の車輪2を除く車輪2の上面を覆って
本体部1に固定された複数個の車輪カバー4と、本体部
1の底面側の車輪2間に固定された複数個の底面カバー
5と、本体部1の一端に固定される引出し棒η炉から引
出すための引掛は枠6とを含む。
As shown in FIG. 1, a framed main body 1, a plurality of wheels 2 rotatably supported on the main body 1 by an axle 3,
A plurality of wheel covers 4 are fixed to the main body 1 so as to cover the upper surfaces of the wheels 2 except the wheels 2 at one end of the main body 1, and a plurality of wheel covers 4 are fixed between the wheels 2 on the bottom side of the main body 1. A pull-out rod η fixed to one end of the main body 1 includes a frame 6, and a hook for pulling out the furnace.

車輪カバー4は外径的45InI11の車輪2の外周上
面を数mmの間隔を開けて車輪2を覆うようになってい
る。又、底面カバー5は外径6インチのウェーハの外周
の下側部の約1/4を覆っていて、断面形状がウェーハ
の形状に合せて円弧状に曲がっている。ウェーハと底面
カバー5との間隔は10〜20mmである。
The wheel cover 4 covers the upper surface of the outer periphery of the wheel 2 having an outer diameter of 45 InI11 with an interval of several mm. The bottom cover 5 covers about 1/4 of the lower part of the outer periphery of the wafer having an outer diameter of 6 inches, and its cross-sectional shape is curved in an arc shape to match the shape of the wafer. The distance between the wafer and the bottom cover 5 is 10 to 20 mm.

ウェーハ運搬器具が重くなれば車輪2の摩擦が大きくな
り発塵量が多くなるので、車輪カバー4及び底面カバー
5の厚さは機械的強度が許す範囲内でできるだけ薄く形
成するのが望ましく、本実施例では2〜3Il1mとし
た。
If the wafer transport equipment becomes heavy, the friction of the wheels 2 will increase and the amount of dust generated will increase. Therefore, it is desirable that the thickness of the wheel cover 4 and the bottom cover 5 be as thin as possible within the range that mechanical strength allows. In the example, it was set to 2 to 3 Il1m.

次に、第2図は第1図の実施例を用いてウェーハの運搬
状態を説明するためのウェーハ運搬器具の斜視図である
Next, FIG. 2 is a perspective view of a wafer transport device for explaining the state of transporting a wafer using the embodiment shown in FIG.

第2図に示すように、本体部1の上面には複数個のウェ
ーハ8を立てた状態で搭載したボート7が複数個搭載さ
れている。本体部1は引掛は枠6に引出し棒9を引掛け
て炉中を移動させる。
As shown in FIG. 2, a plurality of boats 7 each carrying a plurality of wafers 8 in an upright position are mounted on the upper surface of the main body 1. The main body 1 is moved through the furnace by hooking a pull-out rod 9 to a frame 6.

車輪カバー4は車輪2で発生する塵埃がボート7に乗せ
られたウェーハ8に付着するのを防止する。又、底面カ
バー5は移動中に舞上る塵埃がウェーハ8に付着するの
を防止する。
The wheel cover 4 prevents dust generated by the wheel 2 from adhering to the wafers 8 placed on the boat 7. Further, the bottom cover 5 prevents dust that flies up during movement from adhering to the wafer 8.

第3図(a)及び(b)はそれぞれ第1図の実施例を用
いたときの塵埃の収集量をテストするためのウェーハ運
搬器具試験治具の斜視図である。
3(a) and 3(b) are perspective views of a wafer carrier test jig for testing the amount of dust collected when using the embodiment of FIG. 1, respectively.

第3図(a)に示すように、断面が円弧状の石英製の受
皿10の上で本実施例のウェーハ運搬器具を移動させて
発生した塵埃を収集した。又、第3図(b)に示すよう
に、石英製の円筒管11の中で本実施例を移動させて発
生した塵埃を収集した。ただし、後者の場合は移動方向
に向って窒素ガスを吹付けている。
As shown in FIG. 3(a), the wafer transport device of this example was moved on a quartz saucer 10 having an arcuate cross section, and the dust generated was collected. Further, as shown in FIG. 3(b), dust generated by moving this example in a cylindrical tube 11 made of quartz was collected. However, in the latter case, nitrogen gas is sprayed in the direction of movement.

第4図(a)及び(b)はそれぞれ第3図(a)及び(
b)の塵埃収集テストの結果収集された塵埃量と従来の
ウェーハ運搬器具の塵埃発生量との比較を示す特性図で
ある。
Figures 4(a) and (b) correspond to Figures 3(a) and (), respectively.
FIG. 3 is a characteristic diagram showing a comparison between the amount of dust collected as a result of the dust collection test in b) and the amount of dust generated by a conventional wafer transport device.

第4図において、ウェーハ運搬器具の移動速度は40c
m/minであり、第4図(b)における窒素ガス流の
速度は60cm/minである。
In Figure 4, the moving speed of the wafer transport device is 40c.
m/min, and the velocity of the nitrogen gas flow in FIG. 4(b) is 60 cm/min.

第4図(a)に示すように、従来のカバーのないウェー
ハ運搬器具に比べ本実施例では格段に塵埃の収集量が減
少している。又、第4図(b)に示すように、後者のテ
ストでは窒素ガス流により塵埃の舞上り量が増加するた
め収集される塵埃が増加しているが、従来のカバーのな
いものに比べて格段に減少している。
As shown in FIG. 4(a), the amount of dust collected in this embodiment is significantly reduced compared to the conventional wafer transport device without a cover. In addition, as shown in Figure 4 (b), in the latter test, the amount of dust collected increased due to the increase in the amount of dust thrown up by the nitrogen gas flow, but compared to the conventional one without a cover. It has decreased significantly.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、車輪及び底面側にカバー
を設けることにより、外部にもれる塵埃量を減少できる
ので、ウェーハ表面の塵埃による汚染を防止できるとい
う効果がある。
As described above, the present invention has the effect of preventing contamination of the wafer surface by dust, since the amount of dust leaking to the outside can be reduced by providing a cover on the wheels and the bottom side.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(a)及び(b)はそれぞれ本発明の一実施例の
平面図及び側面図、第2図は第1図の実施例を用いてウ
ェーハの運搬状態を説明するためのウェーハ運搬器具の
斜視図、第3図(a)及び(b)はそれぞれ第1図の実
施例を用いたときの塵埃の収集量をテストするためのウ
ェーハ運搬器具試験治具の斜視図、第4図(a)及び(
b)はそれぞれ第3図(a)及び(b)の塵埃収集テス
トの結果収集された塵埃量と従来のウェーハ運搬器具の
塵埃発生量との比較を示す特性図である。 1・・・本体部、2・・・車輪、3・・・車軸、4・・
・車輪カバー、5・・・底面カバー、6・・・引掛は枠
、7・・・ボート、8・・・ウェーハ、9・・・引出し
棒、10・・・受皿、11・・・円筒管。
1(a) and (b) are respectively a plan view and a side view of an embodiment of the present invention, and FIG. 2 is a wafer transport device for explaining the state of transporting a wafer using the embodiment of FIG. 1. Figures 3(a) and (b) are respectively perspective views of a wafer carrier test jig for testing the amount of dust collected when using the embodiment of Figure 1, and Figure 4(a). a) and (
b) is a characteristic diagram showing a comparison between the amount of dust collected as a result of the dust collection test of FIGS. 3(a) and 3(b) and the amount of dust generated by a conventional wafer transport device. 1... Main body, 2... Wheels, 3... Axle, 4...
・Wheel cover, 5...Bottom cover, 6...Hook is frame, 7...Boat, 8...Wafer, 9...Drawer rod, 10...Saucer, 11...Cylindrical tube .

Claims (1)

【特許請求の範囲】[Claims] 複数個のウェーハを搭載した複数個のボートを搭載する
複数個の車輪を有する本体部から成るウェーハ運搬器具
において、前記車輪の上面を覆つて設けられる車輪カバ
ーと、前記本体部の底面側の前記車輪間を覆って設けら
れる底面カバーとを有することを特徴とするウェーハ運
搬器具。
A wafer transport device comprising a main body having a plurality of wheels on which a plurality of boats carrying a plurality of wafers are mounted, a wheel cover provided to cover the top surface of the wheels, and a wheel cover provided on the bottom surface side of the main body. A wafer transport device characterized by having a bottom cover provided to cover between the wheels.
JP62111850A 1987-05-07 1987-05-07 Wafer conveying equipment Pending JPS63275112A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62111850A JPS63275112A (en) 1987-05-07 1987-05-07 Wafer conveying equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62111850A JPS63275112A (en) 1987-05-07 1987-05-07 Wafer conveying equipment

Publications (1)

Publication Number Publication Date
JPS63275112A true JPS63275112A (en) 1988-11-11

Family

ID=14571728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62111850A Pending JPS63275112A (en) 1987-05-07 1987-05-07 Wafer conveying equipment

Country Status (1)

Country Link
JP (1) JPS63275112A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100501979B1 (en) * 2002-03-22 2005-07-20 엘지.필립스 엘시디 주식회사 Clean transfer vehicle
KR101209127B1 (en) * 2011-03-16 2012-12-06 주식회사 신성에프에이 Stacker having dust collecting function
JPWO2017115573A1 (en) * 2015-12-28 2018-05-24 三菱電機株式会社 Horizontal diffusion furnace and method for manufacturing solar cell

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5478969A (en) * 1977-12-07 1979-06-23 Hitachi Ltd Tool for semiconductor wafer thermal treatment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5478969A (en) * 1977-12-07 1979-06-23 Hitachi Ltd Tool for semiconductor wafer thermal treatment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100501979B1 (en) * 2002-03-22 2005-07-20 엘지.필립스 엘시디 주식회사 Clean transfer vehicle
KR101209127B1 (en) * 2011-03-16 2012-12-06 주식회사 신성에프에이 Stacker having dust collecting function
JPWO2017115573A1 (en) * 2015-12-28 2018-05-24 三菱電機株式会社 Horizontal diffusion furnace and method for manufacturing solar cell

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