JPS63275101A - Electronic part - Google Patents
Electronic partInfo
- Publication number
- JPS63275101A JPS63275101A JP62111234A JP11123487A JPS63275101A JP S63275101 A JPS63275101 A JP S63275101A JP 62111234 A JP62111234 A JP 62111234A JP 11123487 A JP11123487 A JP 11123487A JP S63275101 A JPS63275101 A JP S63275101A
- Authority
- JP
- Japan
- Prior art keywords
- case
- notch
- cover sheet
- cover seat
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- NUFNQYOELLVIPL-UHFFFAOYSA-N acifluorfen Chemical compound C1=C([N+]([O-])=O)C(C(=O)O)=CC(OC=2C(=CC(=CC=2)C(F)(F)F)Cl)=C1 NUFNQYOELLVIPL-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、チップタイプの電子部品、特に、そのケース
の構造に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to chip-type electronic components, and in particular to the structure of their cases.
従来技術とその問題点
従来、チップタイプのボリュームやトリマコンデンサに
あっては、第5図、第6図に示す様に、内部を半田付は
時のフラックス、洗浄液の侵入から保護するために、ケ
ース1の上面部に接着剤3にてカバーシート2を貼着し
ていた。そして、基板へのマウント後の調整の必要上、
ビンセット4にてカバーシート2の端部をケース1から
αだけつかみ代として突出許せている。このつかみ代は
αが大きくなる程ビンセット4にてつかみ易いのは当然
である。しかしながら、つかみ代を大きくすると、チッ
ププレーサでの基板へのマウント時に位置ずれやマウン
トミスを発生するおそれを有している。そこで、つかみ
代は0.2〜0.3mmが限度であり、これではビンセ
ット4ではつかみにくく、作業性が悪いという問題点を
有していた。Conventional technology and its problems Conventionally, as shown in Figures 5 and 6, in chip-type volumetric capacitors and trimmer capacitors, the internal parts were soldered to protect them from the intrusion of flux and cleaning fluid. A cover sheet 2 was attached to the upper surface of the case 1 with an adhesive 3. And, due to the need for adjustment after mounting on the board,
In the bin set 4, the end of the cover sheet 2 is allowed to protrude from the case 1 by α as a gripping margin. It goes without saying that the larger α is, the easier it is to grip with the bottle set 4. However, if the gripping allowance is made large, there is a risk that misalignment or mounting errors may occur during mounting on a substrate with a chip placer. Therefore, the gripping margin is limited to 0.2 to 0.3 mm, which causes the bottle set 4 to have a problem in that it is difficult to grip and the workability is poor.
問題点を解決するための手段
以上の問題点を解決するため、本発明に係る電子部品は
、ケースの上面部の縁部に少なくとも1箇所の切欠きを
形成し、該切欠き上にカバーシートの端部を位置させた
ことを特徴とする。Means for Solving the Problems In order to solve the problems above, the electronic component according to the present invention has at least one notch formed in the edge of the upper surface of the case, and a cover sheet is placed over the notch. It is characterized in that the end of the
作用
以上の構成において、基板へのマウント後調整のために
カバーシートを剥離する際には、ケースの切欠き部分に
位置するカバーシートの端部をビンセットで挾んで行な
うが、カバーシートの端部は切欠きの存在によって大き
なつかみ代を備えている。しかも、つかみ代はケースの
上面部からはみ出すことはなく、チップブレーザでの保
持に狂いがなくなる。Function In the above configuration, when peeling off the cover sheet for adjustment after mounting on the board, the end of the cover sheet located in the notch of the case is held in the bin set. The part has a large gripping allowance due to the presence of the notch. Moreover, the gripping allowance does not protrude from the upper surface of the case, and there is no misalignment in holding the chip blazer.
実施例
第1図はチップタイプのボリュームやトリマコンデンサ
等の電子部品を示し、そのケース10の上面部にはカバ
ーシート15が耐熱性接着剤16にて貼着されている。Embodiment FIG. 1 shows electronic components such as a chip type volume and a trimmer capacitor, and a cover sheet 15 is adhered to the upper surface of a case 10 with a heat-resistant adhesive 16.
カバーシート15はポリミドフィルム等の耐熱性の材料
が使用されている。ケース10の上面縁部には、例えば
、第2図に示す様に、角部の1箇所に切欠き11が形成
されている。カバーシート15はケース10の切欠き1
1を含む上面部と同じ太きびを有し、端部158は切欠
き11の上部に位置している。The cover sheet 15 is made of a heat-resistant material such as polymide film. A notch 11 is formed at one corner of the upper edge of the case 10, as shown in FIG. 2, for example. The cover sheet 15 is the notch 1 of the case 10
The end portion 158 is located above the notch 11.
このカバーシート15はフラックスや洗浄液がケース1
0内部に侵入することを防止するためのもので、調整時
にはビンセット20で端部158を挾んで剥離きれる。This cover sheet 15 has flux and cleaning liquid in case 1.
This is to prevent the end portion 158 from penetrating into the interior of the film, and during adjustment, the end portion 158 can be held and peeled off with the bin set 20.
一方、前記切欠き11は、第3図に示す様に、ケース1
0の上面部の対角線上に2箇所形成しても良く、あるい
は、第4図に示す様に、−辺の全部を切り欠いて形成し
ても良い。前者にあっては2方向から剥離でき、後者に
あってはビンセット20でつかむ位置の自由度が大きく
、つかみ代が大きいことと相俟って作業性が良好である
。On the other hand, the notch 11 is formed in the case 1 as shown in FIG.
They may be formed at two locations on the diagonal line of the top surface of the 0, or they may be formed by cutting out the entire negative side as shown in FIG. In the former case, it can be peeled off from two directions, and in the latter case, there is a large degree of freedom in the gripping position with the bottle set 20, and together with the large gripping margin, the workability is good.
発明の効果
以上の説明で明らかな様に、本発明によれば、ケースの
上面部の縁部に少なくとも1箇所の切欠きを形成し、該
切欠き上にカバーシートの端部を位置許せたため、カバ
ーシートを剥離する際のビンセットでのつかみ代が大き
くなり、剥離の作業性が向上すると共に、つかみ代部分
がケースの外形から突出することはなく、チップブレー
ザでの保持が正確となり、マウントミスや位置ずれが確
実に防止される。Effects of the Invention As is clear from the above explanation, according to the present invention, at least one notch is formed at the edge of the upper surface of the case, and the end of the cover sheet can be positioned on the notch. When peeling off the cover sheet, the gripping area with the bin set is increased, improving the peeling work efficiency, and the gripping area does not protrude from the outer shape of the case, making it possible to hold the cover sheet accurately with the chip laser, making it easier to mount the cover sheet. Mistakes and misalignments are reliably prevented.
第1図は本発明に係る電子部品の正面図、第2図、第3
図、第4図はそれぞれケースの切欠き箇所を示す斜視図
である。第5図は従来の電子部品の正面図、第6図はそ
のカバーシート剥離時を示す斜視図である。
10・・・ケース、11・・・切欠き、15・・・カバ
ーシート、15a・・・端部(つかみ代)。
特許出願人 株式会社村田製作所
代理人弁理士 森 下 武 −
第5図
第1図
第6図FIG. 1 is a front view of an electronic component according to the present invention, FIG.
4 and 4 are perspective views showing cutout locations of the case, respectively. FIG. 5 is a front view of a conventional electronic component, and FIG. 6 is a perspective view of the conventional electronic component when the cover sheet is peeled off. DESCRIPTION OF SYMBOLS 10... Case, 11... Notch, 15... Cover sheet, 15a... End part (grip allowance). Patent applicant Takeshi Morishita, patent attorney representing Murata Manufacturing Co., Ltd. - Figure 5 Figure 1 Figure 6
Claims (1)
品において、 前記ケースの上面部の縁部に少なくとも1箇所の切欠き
を形成し、該切欠き上に前記カバーシートの端部を位置
させたこと、 を特徴とする電子部品。(1) In an electronic component in which a cover sheet is attached to the upper surface of the case, at least one notch is formed at the edge of the upper surface of the case, and the end of the cover sheet is positioned on the notch. An electronic component characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62111234A JPS63275101A (en) | 1987-05-07 | 1987-05-07 | Electronic part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62111234A JPS63275101A (en) | 1987-05-07 | 1987-05-07 | Electronic part |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63275101A true JPS63275101A (en) | 1988-11-11 |
Family
ID=14555965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62111234A Pending JPS63275101A (en) | 1987-05-07 | 1987-05-07 | Electronic part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63275101A (en) |
-
1987
- 1987-05-07 JP JP62111234A patent/JPS63275101A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS63275101A (en) | Electronic part | |
US5098008A (en) | Fine pitch leaded component placement process | |
JPS6135696B2 (en) | ||
JPH1154901A (en) | Soldering method and soldering jig | |
JPH0236590A (en) | Mask plate of mounting printed circuit board and its manufacture | |
JPS63299300A (en) | Mounting of component on printed board | |
JP2583353B2 (en) | Lead frame for semiconductor device | |
JPH04163987A (en) | Chip component mounting system | |
JP3709581B2 (en) | Method for manufacturing solder bonding jig plate and electronic component mounting board | |
JPH0553266U (en) | Multilayer printed wiring board | |
JPH0230194A (en) | Mounting of surface-mounting component | |
JPS629253Y2 (en) | ||
JPH05190380A (en) | Composite electronic parts | |
JPH0677620A (en) | Electronic component mounting structure | |
JPH01161707A (en) | Chip component | |
JP2530783Y2 (en) | Chip component mounting structure | |
JPS62128600A (en) | Tape-shape parts assembled unit | |
JPH0444408B2 (en) | ||
JP2531123B2 (en) | How to attach chip parts | |
JPS58173884A (en) | Method of mounting chip part | |
JPH05206628A (en) | Soldering auxiliary tool | |
JPH0555436A (en) | Lead frame for semiconductor device | |
JPS59152697A (en) | Taping electronic part | |
JPS6333824Y2 (en) | ||
JPH09205276A (en) | Component mounting structure |