JPS63274706A - 金属微粉末の製造法 - Google Patents
金属微粉末の製造法Info
- Publication number
- JPS63274706A JPS63274706A JP10938987A JP10938987A JPS63274706A JP S63274706 A JPS63274706 A JP S63274706A JP 10938987 A JP10938987 A JP 10938987A JP 10938987 A JP10938987 A JP 10938987A JP S63274706 A JPS63274706 A JP S63274706A
- Authority
- JP
- Japan
- Prior art keywords
- reaction
- metal
- solution
- aqueous solution
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10938987A JPS63274706A (ja) | 1987-05-02 | 1987-05-02 | 金属微粉末の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10938987A JPS63274706A (ja) | 1987-05-02 | 1987-05-02 | 金属微粉末の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63274706A true JPS63274706A (ja) | 1988-11-11 |
| JPH0372683B2 JPH0372683B2 (enExample) | 1991-11-19 |
Family
ID=14508996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10938987A Granted JPS63274706A (ja) | 1987-05-02 | 1987-05-02 | 金属微粉末の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63274706A (enExample) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6540811B2 (en) | 2000-01-21 | 2003-04-01 | Sumitomo Electric Industries, Ltd. | Method of producing alloy powders, alloy powders obtained by said method, and products applying said powders |
| US6627118B2 (en) | 2000-04-26 | 2003-09-30 | Hitachi Metals, Ltd. | Ni alloy particles and method for producing same, and anisotropic conductive film |
| US6632265B1 (en) | 1999-11-10 | 2003-10-14 | Mitsui Mining And Smelting Co., Ltd. | Nickel powder, method for preparation thereof and conductive paste |
| JP2006152344A (ja) * | 2004-11-26 | 2006-06-15 | Catalysts & Chem Ind Co Ltd | 金属微粒子および金属微粒子の製造方法 |
| US7166502B1 (en) * | 1999-11-10 | 2007-01-23 | Lg. Philips Lcd Co., Ltd. | Method of manufacturing a thin film transistor |
| JP2008019503A (ja) * | 2006-07-10 | 2008-01-31 | Samsung Electro-Mechanics Co Ltd | 銅ナノ粒子の製造方法およびこれによる銅ナノ粒子 |
| JP2008519156A (ja) * | 2004-10-29 | 2008-06-05 | ナノダイナミクス,インク. | 超微細金属粉末の水性溶液中での製法 |
| JP2010070793A (ja) * | 2008-09-17 | 2010-04-02 | Dowa Electronics Materials Co Ltd | 球状銀粉およびその製造方法 |
| US8048193B2 (en) | 2006-06-05 | 2011-11-01 | Tanaka Kikinzoku Kogyo K.K. | Method for producing gold colloid and gold colloid |
| WO2012043267A1 (ja) | 2010-09-30 | 2012-04-05 | Dowaエレクトロニクス株式会社 | 導電性ペースト用銅粉およびその製造方法 |
| CN102496404A (zh) * | 2011-12-27 | 2012-06-13 | 华东理工大学 | 一种高效晶硅太阳电池用电极银浆 |
| CN104174864A (zh) * | 2013-05-21 | 2014-12-03 | 中国科学院理化技术研究所 | 一种纳米或亚微米级银颗粒粉的制备方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5323250A (en) * | 1976-08-16 | 1978-03-03 | Denki Kogyo Co Ltd | Grounded tower double feeding system |
| JPS5329240A (en) * | 1976-08-31 | 1978-03-18 | Hitachi Shipbuilding Eng Co | Connecting process for tig welding electrodes |
| JPS5754207A (enExample) * | 1980-08-21 | 1982-03-31 | Inco Ltd |
-
1987
- 1987-05-02 JP JP10938987A patent/JPS63274706A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5323250A (en) * | 1976-08-16 | 1978-03-03 | Denki Kogyo Co Ltd | Grounded tower double feeding system |
| JPS5329240A (en) * | 1976-08-31 | 1978-03-18 | Hitachi Shipbuilding Eng Co | Connecting process for tig welding electrodes |
| JPS5754207A (enExample) * | 1980-08-21 | 1982-03-31 | Inco Ltd |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6632265B1 (en) | 1999-11-10 | 2003-10-14 | Mitsui Mining And Smelting Co., Ltd. | Nickel powder, method for preparation thereof and conductive paste |
| US7166502B1 (en) * | 1999-11-10 | 2007-01-23 | Lg. Philips Lcd Co., Ltd. | Method of manufacturing a thin film transistor |
| US6540811B2 (en) | 2000-01-21 | 2003-04-01 | Sumitomo Electric Industries, Ltd. | Method of producing alloy powders, alloy powders obtained by said method, and products applying said powders |
| US6627118B2 (en) | 2000-04-26 | 2003-09-30 | Hitachi Metals, Ltd. | Ni alloy particles and method for producing same, and anisotropic conductive film |
| JP2008519156A (ja) * | 2004-10-29 | 2008-06-05 | ナノダイナミクス,インク. | 超微細金属粉末の水性溶液中での製法 |
| JP2006152344A (ja) * | 2004-11-26 | 2006-06-15 | Catalysts & Chem Ind Co Ltd | 金属微粒子および金属微粒子の製造方法 |
| US8048193B2 (en) | 2006-06-05 | 2011-11-01 | Tanaka Kikinzoku Kogyo K.K. | Method for producing gold colloid and gold colloid |
| JP2008019503A (ja) * | 2006-07-10 | 2008-01-31 | Samsung Electro-Mechanics Co Ltd | 銅ナノ粒子の製造方法およびこれによる銅ナノ粒子 |
| JP2010070793A (ja) * | 2008-09-17 | 2010-04-02 | Dowa Electronics Materials Co Ltd | 球状銀粉およびその製造方法 |
| WO2012043267A1 (ja) | 2010-09-30 | 2012-04-05 | Dowaエレクトロニクス株式会社 | 導電性ペースト用銅粉およびその製造方法 |
| US9248504B2 (en) | 2010-09-30 | 2016-02-02 | Dowa Electronics Materials Co., Ltd. | Copper powder for conductive paste and method for producing same |
| CN102496404A (zh) * | 2011-12-27 | 2012-06-13 | 华东理工大学 | 一种高效晶硅太阳电池用电极银浆 |
| CN104174864A (zh) * | 2013-05-21 | 2014-12-03 | 中国科学院理化技术研究所 | 一种纳米或亚微米级银颗粒粉的制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0372683B2 (enExample) | 1991-11-19 |
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