JPS6327093U - - Google Patents
Info
- Publication number
- JPS6327093U JPS6327093U JP12029686U JP12029686U JPS6327093U JP S6327093 U JPS6327093 U JP S6327093U JP 12029686 U JP12029686 U JP 12029686U JP 12029686 U JP12029686 U JP 12029686U JP S6327093 U JPS6327093 U JP S6327093U
- Authority
- JP
- Japan
- Prior art keywords
- soldering part
- soldering
- utility
- model registration
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims 1
- 238000009792 diffusion process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
この考案に係る半田付け部の構造の実施例を第
1図乃至第7図に示し、第1図は前面図を示し、
第2図は第1図のA―A′よりみた拡大した断面
図である。第3図乃至第7図は他の実施例である
。第9図は、従来の半田付け部の構造前面図であ
る。
1:プリント配線基板、2:半田付け部(舌片
)、3:シールド板、6:穴、7:切り欠き部。
Examples of the structure of the soldering part according to this invention are shown in FIGS. 1 to 7, and FIG. 1 shows a front view,
FIG. 2 is an enlarged sectional view taken along line AA' in FIG. 1. FIGS. 3 to 7 show other embodiments. FIG. 9 is a structural front view of a conventional soldering section. 1: Printed wiring board, 2: Soldering part (tongue), 3: Shield plate, 6: Hole, 7: Notch part.
補正 昭61.11.6
図面の簡単な説明を次のように補正する。
明細書第5ページ16行目から同第6ページ2
行目の「この考案に係る……構造前面図である。
」とあるを次のように訂正する。「第1図乃至第
8図は、この考案に係る半田付け部の構造の実施
例を示すもので、第1図はプリント配線基板の部
分を断面した要部正面図、第2図は第1図のA―
A′線断面側面図、第3図乃至第7図は他の実施
例を示すもので、プリント配線基板の部分を断面
した要部正面図、第8図は熱伝導状態の一例を示
す正面図である。第9図は従来の半田付け部の構
造を示す正面図である。」Amendment November 6, 1981 The brief description of the drawing is amended as follows. Specification page 5, line 16 to page 6, line 2
The line ``This is a front view of the structure related to this invention.''
'' should be corrected as follows. ``Figures 1 to 8 show examples of the structure of the soldering part according to this invention. A in the diagram
A cross-sectional side view taken along the line A', and FIGS. 3 to 7 show other embodiments. FIG. 8 is a front view showing an example of the heat conduction state. It is. FIG. 9 is a front view showing the structure of a conventional soldering part. ”
Claims (1)
するための1又は複数の穴又は切り欠き部を設け
て、半田付け加工時の熱拡散を抑えるように構成
したことを特徴とする半田付け部の構造。 (2) 穴を形成するために、切り起こした舌片を
折り曲げて半田付け部としたことを特徴とする実
用新案登録請求の範囲第1項記載の半田付け部の
構造。[Scope of Claim for Utility Model Registration] (1) One or more holes or notches are provided near the soldering part to narrow the heat conduction path to suppress heat diffusion during the soldering process. The structure of the soldering part is characterized by comprising: (2) The structure of the soldering part according to claim 1 of the utility model registration, characterized in that the soldering part is made by bending a tongue piece cut and raised to form the hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12029686U JPS6327093U (en) | 1986-08-07 | 1986-08-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12029686U JPS6327093U (en) | 1986-08-07 | 1986-08-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6327093U true JPS6327093U (en) | 1988-02-22 |
Family
ID=31008483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12029686U Pending JPS6327093U (en) | 1986-08-07 | 1986-08-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6327093U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010028930A (en) * | 2008-07-16 | 2010-02-04 | Tdk-Lambda Corp | Solder joint structure and power supply apparatus |
-
1986
- 1986-08-07 JP JP12029686U patent/JPS6327093U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010028930A (en) * | 2008-07-16 | 2010-02-04 | Tdk-Lambda Corp | Solder joint structure and power supply apparatus |